TW371673B - Automatic positive pressure seal access door - Google Patents

Automatic positive pressure seal access door

Info

Publication number
TW371673B
TW371673B TW087110056A TW87110056A TW371673B TW 371673 B TW371673 B TW 371673B TW 087110056 A TW087110056 A TW 087110056A TW 87110056 A TW87110056 A TW 87110056A TW 371673 B TW371673 B TW 371673B
Authority
TW
Taiwan
Prior art keywords
load lock
positive pressure
access port
opening
face surface
Prior art date
Application number
TW087110056A
Other languages
English (en)
Chinese (zh)
Inventor
Alex Glants
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Application granted granted Critical
Publication of TW371673B publication Critical patent/TW371673B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Warehouses Or Storage Devices (AREA)
TW087110056A 1997-07-11 1998-06-23 Automatic positive pressure seal access door TW371673B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/891,550 US5837059A (en) 1997-07-11 1997-07-11 Automatic positive pressure seal access door

Publications (1)

Publication Number Publication Date
TW371673B true TW371673B (en) 1999-10-11

Family

ID=25398394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087110056A TW371673B (en) 1997-07-11 1998-06-23 Automatic positive pressure seal access door

Country Status (7)

Country Link
US (1) US5837059A (https=)
EP (1) EP1021587A1 (https=)
JP (1) JP4508412B2 (https=)
KR (1) KR100626275B1 (https=)
AU (1) AU7700898A (https=)
TW (1) TW371673B (https=)
WO (1) WO1999002751A1 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0870850B1 (de) * 1997-04-11 2002-09-18 Leybold Systems GmbH Verfahren und Vorrichtung zum Be- und Entladen einer evakuierbaren Behandlungskammer
US20020051699A1 (en) * 1997-05-05 2002-05-02 Gordon Nelson Door system for a process chamber
WO1999028951A2 (en) * 1997-11-28 1999-06-10 Mattson Technology, Inc. Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
US6106213A (en) * 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
JP2001118904A (ja) * 1999-10-19 2001-04-27 Canon Inc ロードロック室を備えた基板処理装置および被処理基板の搬送方法
US6379095B1 (en) * 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
US6582175B2 (en) 2000-04-14 2003-06-24 Applied Materials, Inc. Robot for handling semiconductor wafers
US6698439B2 (en) * 2000-07-03 2004-03-02 Tokyo Electron Limited Processing apparatus with sealing mechanism
WO2002095809A2 (en) * 2001-05-18 2002-11-28 Lam Research Corporation Apparatus and method for substrate preparation implementing a surface tension reducing process
JP2003031639A (ja) * 2001-07-17 2003-01-31 Canon Inc 基板処理装置、基板の搬送方法及び露光装置
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
US6776848B2 (en) * 2002-01-17 2004-08-17 Applied Materials, Inc. Motorized chamber lid
US7196507B2 (en) * 2003-08-28 2007-03-27 Suss Microtec Testsystems (Gmbh) Apparatus for testing substrates
US7632078B2 (en) * 2003-10-30 2009-12-15 Deka Products Limited Partnership Pump cassette bank
TW200614411A (en) * 2004-09-04 2006-05-01 Applied Materials Inc Substrate carrier having reduced height
TW200725784A (en) * 2005-11-21 2007-07-01 Applied Materials Inc Apparatus and methods for a substrate carrier having an inflatable seal
US20070141280A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Substrate carrier having an interior lining
KR100841942B1 (ko) * 2007-06-05 2008-06-27 주식회사 케이피씨 기판 처리장치의 슬라이딩 도어
ES2752207T3 (es) * 2015-08-07 2020-04-03 Indag Pouch Partners Gmbh Máquina para el llenado aséptico de líquidos, procedimiento para abrir y procedimiento para cerrar una ventana de apertura en una máquina para el llenado aséptico de líquidos
CN107345293B (zh) * 2016-05-06 2019-07-05 北京北方华创微电子装备有限公司 反应腔室及半导体加工设备
CN106555158B (zh) * 2016-11-15 2018-11-13 浦江和平真空镀膜有限公司 一种真空镀膜箱设备
DE102019134546B4 (de) 2019-12-16 2025-03-27 VON ARDENNE Asset GmbH & Co. KG Verfahren, Steuervorrichtung und Vakuumanordnung
JP6952920B1 (ja) * 2021-04-20 2021-10-27 株式会社ブイテックス デュアルゲートバルブ
US11933416B2 (en) * 2021-07-16 2024-03-19 Changxin Memory Technologies, Inc. Gate valve device, cleaning method and mechanical apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546132A (en) * 1977-06-17 1979-01-18 Mitsubishi Heavy Ind Ltd Gate valve
JPS55139562A (en) * 1979-04-14 1980-10-31 Hitachi Ltd Valve device
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
JPS6323331A (ja) * 1986-10-21 1988-01-30 Tokyo Ohka Kogyo Co Ltd 蓋体の開閉機構
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
DE69304038T2 (de) * 1993-01-28 1996-12-19 Applied Materials Inc Vorrichtung für ein Vakuumverfahren mit verbessertem Durchsatz
WO1994023911A1 (en) * 1993-04-16 1994-10-27 Brooks Automation, Inc. Articulated arm transfer device
US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock

Also Published As

Publication number Publication date
AU7700898A (en) 1999-02-08
JP2001509640A (ja) 2001-07-24
EP1021587A1 (en) 2000-07-26
KR20010021759A (ko) 2001-03-15
WO1999002751A1 (en) 1999-01-21
US5837059A (en) 1998-11-17
KR100626275B1 (ko) 2006-09-20
JP4508412B2 (ja) 2010-07-21

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Legal Events

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MK4A Expiration of patent term of an invention patent