JP4508412B2 - 処理チャンバ - Google Patents

処理チャンバ Download PDF

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Publication number
JP4508412B2
JP4508412B2 JP2000502240A JP2000502240A JP4508412B2 JP 4508412 B2 JP4508412 B2 JP 4508412B2 JP 2000502240 A JP2000502240 A JP 2000502240A JP 2000502240 A JP2000502240 A JP 2000502240A JP 4508412 B2 JP4508412 B2 JP 4508412B2
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JP
Japan
Prior art keywords
door panel
processing chamber
door
inner door
port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000502240A
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English (en)
Japanese (ja)
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JP2001509640A (ja
JP2001509640A5 (https=
Inventor
アレックス グランツ
Original Assignee
ブルックス オートメーション インコーポレイテッド
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Filing date
Publication date
Application filed by ブルックス オートメーション インコーポレイテッド filed Critical ブルックス オートメーション インコーポレイテッド
Publication of JP2001509640A publication Critical patent/JP2001509640A/ja
Publication of JP2001509640A5 publication Critical patent/JP2001509640A5/ja
Application granted granted Critical
Publication of JP4508412B2 publication Critical patent/JP4508412B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2000502240A 1997-07-11 1998-05-28 処理チャンバ Expired - Lifetime JP4508412B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/891,550 US5837059A (en) 1997-07-11 1997-07-11 Automatic positive pressure seal access door
US08/891,550 1997-07-11
PCT/US1998/010879 WO1999002751A1 (en) 1997-07-11 1998-05-28 Automatic positive pressure seal access door

Publications (3)

Publication Number Publication Date
JP2001509640A JP2001509640A (ja) 2001-07-24
JP2001509640A5 JP2001509640A5 (https=) 2009-08-06
JP4508412B2 true JP4508412B2 (ja) 2010-07-21

Family

ID=25398394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000502240A Expired - Lifetime JP4508412B2 (ja) 1997-07-11 1998-05-28 処理チャンバ

Country Status (7)

Country Link
US (1) US5837059A (https=)
EP (1) EP1021587A1 (https=)
JP (1) JP4508412B2 (https=)
KR (1) KR100626275B1 (https=)
AU (1) AU7700898A (https=)
TW (1) TW371673B (https=)
WO (1) WO1999002751A1 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0870850B1 (de) * 1997-04-11 2002-09-18 Leybold Systems GmbH Verfahren und Vorrichtung zum Be- und Entladen einer evakuierbaren Behandlungskammer
US20020051699A1 (en) * 1997-05-05 2002-05-02 Gordon Nelson Door system for a process chamber
WO1999028951A2 (en) * 1997-11-28 1999-06-10 Mattson Technology, Inc. Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
US6106213A (en) * 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
JP2001118904A (ja) * 1999-10-19 2001-04-27 Canon Inc ロードロック室を備えた基板処理装置および被処理基板の搬送方法
US6379095B1 (en) * 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
US6582175B2 (en) 2000-04-14 2003-06-24 Applied Materials, Inc. Robot for handling semiconductor wafers
US6698439B2 (en) * 2000-07-03 2004-03-02 Tokyo Electron Limited Processing apparatus with sealing mechanism
WO2002095809A2 (en) * 2001-05-18 2002-11-28 Lam Research Corporation Apparatus and method for substrate preparation implementing a surface tension reducing process
JP2003031639A (ja) * 2001-07-17 2003-01-31 Canon Inc 基板処理装置、基板の搬送方法及び露光装置
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
US6776848B2 (en) * 2002-01-17 2004-08-17 Applied Materials, Inc. Motorized chamber lid
US7196507B2 (en) * 2003-08-28 2007-03-27 Suss Microtec Testsystems (Gmbh) Apparatus for testing substrates
US7632078B2 (en) * 2003-10-30 2009-12-15 Deka Products Limited Partnership Pump cassette bank
TW200614411A (en) * 2004-09-04 2006-05-01 Applied Materials Inc Substrate carrier having reduced height
TW200725784A (en) * 2005-11-21 2007-07-01 Applied Materials Inc Apparatus and methods for a substrate carrier having an inflatable seal
US20070141280A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Substrate carrier having an interior lining
KR100841942B1 (ko) * 2007-06-05 2008-06-27 주식회사 케이피씨 기판 처리장치의 슬라이딩 도어
ES2752207T3 (es) * 2015-08-07 2020-04-03 Indag Pouch Partners Gmbh Máquina para el llenado aséptico de líquidos, procedimiento para abrir y procedimiento para cerrar una ventana de apertura en una máquina para el llenado aséptico de líquidos
CN107345293B (zh) * 2016-05-06 2019-07-05 北京北方华创微电子装备有限公司 反应腔室及半导体加工设备
CN106555158B (zh) * 2016-11-15 2018-11-13 浦江和平真空镀膜有限公司 一种真空镀膜箱设备
DE102019134546B4 (de) 2019-12-16 2025-03-27 VON ARDENNE Asset GmbH & Co. KG Verfahren, Steuervorrichtung und Vakuumanordnung
JP6952920B1 (ja) * 2021-04-20 2021-10-27 株式会社ブイテックス デュアルゲートバルブ
US11933416B2 (en) * 2021-07-16 2024-03-19 Changxin Memory Technologies, Inc. Gate valve device, cleaning method and mechanical apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546132A (en) * 1977-06-17 1979-01-18 Mitsubishi Heavy Ind Ltd Gate valve
JPS55139562A (en) * 1979-04-14 1980-10-31 Hitachi Ltd Valve device
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
JPS6323331A (ja) * 1986-10-21 1988-01-30 Tokyo Ohka Kogyo Co Ltd 蓋体の開閉機構
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
DE69304038T2 (de) * 1993-01-28 1996-12-19 Applied Materials Inc Vorrichtung für ein Vakuumverfahren mit verbessertem Durchsatz
WO1994023911A1 (en) * 1993-04-16 1994-10-27 Brooks Automation, Inc. Articulated arm transfer device
US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock

Also Published As

Publication number Publication date
AU7700898A (en) 1999-02-08
JP2001509640A (ja) 2001-07-24
EP1021587A1 (en) 2000-07-26
KR20010021759A (ko) 2001-03-15
WO1999002751A1 (en) 1999-01-21
US5837059A (en) 1998-11-17
KR100626275B1 (ko) 2006-09-20
TW371673B (en) 1999-10-11

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