TW364956B - Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products - Google Patents

Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products

Info

Publication number
TW364956B
TW364956B TW086106431A TW86106431A TW364956B TW 364956 B TW364956 B TW 364956B TW 086106431 A TW086106431 A TW 086106431A TW 86106431 A TW86106431 A TW 86106431A TW 364956 B TW364956 B TW 364956B
Authority
TW
Taiwan
Prior art keywords
item
measurement
assessing
batch
manufacturing process
Prior art date
Application number
TW086106431A
Other languages
English (en)
Inventor
Boxem Gerardus Johannes Cornelis Van
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of TW364956B publication Critical patent/TW364956B/zh

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
TW086106431A 1996-10-21 1997-05-14 Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products TW364956B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP96202901 1996-10-21

Publications (1)

Publication Number Publication Date
TW364956B true TW364956B (en) 1999-07-21

Family

ID=8224507

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086106431A TW364956B (en) 1996-10-21 1997-05-14 Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products

Country Status (7)

Country Link
US (1) US5943237A (zh)
EP (1) EP0870218B1 (zh)
JP (1) JP2000502517A (zh)
KR (1) KR100495194B1 (zh)
DE (1) DE69723547T2 (zh)
TW (1) TW364956B (zh)
WO (1) WO1998018066A2 (zh)

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JPH1170445A (ja) 1997-08-29 1999-03-16 Nec Kyushu Ltd 製造プロセス変更管理装置及び製造プロセス変更管理方法
US6594598B1 (en) * 1997-10-08 2003-07-15 Matsushita Electronics Corporation Method for controlling production line
US6115643A (en) * 1998-02-03 2000-09-05 Mcms Real-time manufacturing process control monitoring method
US6130173A (en) * 1998-03-19 2000-10-10 Lsi Logic Corporation Reticle based skew lots
JP2002535744A (ja) * 1999-01-15 2002-10-22 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン 製造の際の品質の監視
EP1196830B1 (en) 1999-07-13 2003-10-08 MV Research Limited A printed circuit production method
US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6672716B2 (en) * 2002-04-29 2004-01-06 Xerox Corporation Multiple portion solid ink stick
US6718221B1 (en) * 2002-05-21 2004-04-06 University Of Kentucky Research Foundation Nonparametric control chart for the range
DE10241742B4 (de) * 2002-09-10 2008-06-26 Alstom Technology Ltd. Fertigungsanlage zum Herstellen von Produkten
US7272459B2 (en) 2002-11-15 2007-09-18 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
WO2005013016A2 (en) * 2003-08-05 2005-02-10 Arie Melul Method and system for real time diagnosis of machine operation
CN113311145A (zh) * 2021-05-28 2021-08-27 中航复合材料有限责任公司 一种预浸料树脂含量测量系统分析方法和装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0397924B1 (en) * 1989-05-17 1995-11-29 Koninklijke Philips Electronics N.V. Work station controller module
US5239456A (en) * 1990-07-30 1993-08-24 The Foxboro Company Method and apparatus for process control with opimum setpoint determination
US5399531A (en) * 1990-12-17 1995-03-21 United Micrpelectronics Corporation Single semiconductor wafer transfer method and plural processing station manufacturing system
US5327437A (en) * 1991-11-25 1994-07-05 Hewlett-Packard Company Method for testing electronic assemblies in the presence of noise
US5408405A (en) * 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
US5440478A (en) * 1994-02-22 1995-08-08 Mercer Forge Company Process control method for improving manufacturing operations
US5646870A (en) * 1995-02-13 1997-07-08 Advanced Micro Devices, Inc. Method for setting and adjusting process parameters to maintain acceptable critical dimensions across each die of mass-produced semiconductor wafers
US5761064A (en) * 1995-10-06 1998-06-02 Advanced Micro Devices, Inc. Defect management system for productivity and yield improvement

Also Published As

Publication number Publication date
DE69723547T2 (de) 2004-06-09
JP2000502517A (ja) 2000-02-29
US5943237A (en) 1999-08-24
EP0870218A2 (en) 1998-10-14
EP0870218B1 (en) 2003-07-16
DE69723547D1 (de) 2003-08-21
WO1998018066A2 (en) 1998-04-30
WO1998018066A3 (en) 1998-06-04
KR19990076578A (ko) 1999-10-15
KR100495194B1 (ko) 2005-09-30

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees