TW355151B - A method for cutting single chip material by the steel saw - Google Patents

A method for cutting single chip material by the steel saw

Info

Publication number
TW355151B
TW355151B TW085107756A TW85107756A TW355151B TW 355151 B TW355151 B TW 355151B TW 085107756 A TW085107756 A TW 085107756A TW 85107756 A TW85107756 A TW 85107756A TW 355151 B TW355151 B TW 355151B
Authority
TW
Taiwan
Prior art keywords
single chip
chip material
steel wire
steel
feeding tray
Prior art date
Application number
TW085107756A
Other languages
English (en)
Inventor
Shinji Shibaoka
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17231995A external-priority patent/JP3144269B2/ja
Priority claimed from JP7178456A external-priority patent/JPH0929734A/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Application granted granted Critical
Publication of TW355151B publication Critical patent/TW355151B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Sawing (AREA)
TW085107756A 1995-07-07 1996-06-27 A method for cutting single chip material by the steel saw TW355151B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17231995A JP3144269B2 (ja) 1995-07-07 1995-07-07 単結晶材料の切断方法
JP7178456A JPH0929734A (ja) 1995-07-14 1995-07-14 ワイヤソーのワーク接着ブロック

Publications (1)

Publication Number Publication Date
TW355151B true TW355151B (en) 1999-04-01

Family

ID=26494714

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085107756A TW355151B (en) 1995-07-07 1996-06-27 A method for cutting single chip material by the steel saw

Country Status (4)

Country Link
US (1) US5857454A (zh)
KR (1) KR100244108B1 (zh)
CH (1) CH693137A5 (zh)
TW (1) TW355151B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202012100727U1 (de) 2012-01-13 2012-04-03 Apex Mfg. Co., Ltd. Tacker
DE202016101621U1 (de) 2016-03-23 2016-04-18 Apex Mfg. Co., Ltd. Tacker mit einer Klammerführungsstruktur

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10249700A (ja) * 1997-03-17 1998-09-22 Super Silicon Kenkyusho:Kk ワイヤソーによるインゴットの切断方法及び装置
JP3137600B2 (ja) * 1997-09-12 2001-02-26 株式会社日平トヤマ ワークの結晶方位調整方法
DE19851070A1 (de) * 1998-11-05 2000-05-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Werkstück
US6106365A (en) * 1998-11-06 2000-08-22 Seh America, Inc. Method and apparatus to control mounting pressure of semiconductor crystals
KR100375173B1 (ko) * 2000-10-20 2003-03-08 주식회사 실트론 단결정 잉곳의 제조 방법 및 이 단결정 잉곳을 이용한웨이퍼 제조방법
DE10128630A1 (de) 2001-06-13 2003-01-02 Freiberger Compound Mat Gmbh Vorrichtung und Verfahren zur Bestimmung der Orientierung einer kristallografischen Ebene relativ zu einer Kristalloberfläche sowie Vorrichtung und Verfahren zum Trennen eines Einkristalls in einer Trennmaschine
JP4951914B2 (ja) * 2005-09-28 2012-06-13 信越半導体株式会社 （１１０）シリコンウエーハの製造方法
DE112012002299T5 (de) 2011-06-02 2014-05-15 Sumitomo Electric Industries, Ltd. Verfahren zum Herstellen eines Siliziumkarbidsubstrates
JP2013008769A (ja) * 2011-06-23 2013-01-10 Sumitomo Electric Ind Ltd 炭化珪素基板の製造方法
US8960657B2 (en) * 2011-10-05 2015-02-24 Sunedison, Inc. Systems and methods for connecting an ingot to a wire saw
KR101390794B1 (ko) 2011-12-23 2014-05-07 주식회사 엘지실트론 잉곳 절단용 와이어 가이드, 이를 포함한 와이어 쏘 장치 및 잉곳 절단 방법
KR101449572B1 (ko) * 2013-03-25 2014-10-13 한국생산기술연구원 리프트-업 스윙을 구현하는 와이어 쏘
JP6000235B2 (ja) 2013-12-24 2016-09-28 信越半導体株式会社 ワークの切断方法及びワーク保持治具
JP6272801B2 (ja) * 2015-07-27 2018-01-31 信越半導体株式会社 ワークホルダー及びワークの切断方法
TWI642899B (zh) * 2017-10-13 2018-12-01 友達晶材股份有限公司 Method for detecting main wheel diameter of multi-wheel system
CN108789896B (zh) * 2018-06-25 2021-01-15 安庆友仁电子有限公司 一种晶体定向加工夹具
KR20220046229A (ko) 2020-10-07 2022-04-14 (주)그린광학 수은할로겐화물 단결정 절단 방법
CN113787636B (zh) * 2021-07-09 2022-05-27 麦斯克电子材料股份有限公司 一种用于12寸半导体晶圆的手动粘棒方法
CN114474443B (zh) * 2022-02-22 2023-03-21 河北同光半导体股份有限公司 晶体的偏置切割方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2752925A1 (de) * 1977-11-26 1979-05-31 Philips Patentverwaltung Vorrichtung zum ausrichten und festlegen eines einkristalles
JP2673544B2 (ja) * 1988-06-14 1997-11-05 株式会社日平トヤマ 脆性材料の切断方法
KR900701490A (ko) * 1988-11-03 1990-12-03 원본미기재 연마식 세분장치
JP2516717B2 (ja) * 1991-11-29 1996-07-24 信越半導体株式会社 ワイヤソ―及びその切断方法
DE69631353T2 (de) * 1995-04-22 2004-12-09 Hct Shaping Systems Sa Verfahren zur Orientierung von Einkristallen zum Schneiden in eine Schneidemaschine und Einrichtung zur Durchführung des Verfahrens

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202012100727U1 (de) 2012-01-13 2012-04-03 Apex Mfg. Co., Ltd. Tacker
DE202016101621U1 (de) 2016-03-23 2016-04-18 Apex Mfg. Co., Ltd. Tacker mit einer Klammerführungsstruktur

Also Published As

Publication number Publication date
US5857454A (en) 1999-01-12
KR100244108B1 (ko) 2000-03-02
CH693137A5 (de) 2003-03-14
KR970005473A (ko) 1997-02-19

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