TW351834B - Method of round formation and surface treatment agent - Google Patents
Method of round formation and surface treatment agentInfo
- Publication number
- TW351834B TW351834B TW086112608A TW86112608A TW351834B TW 351834 B TW351834 B TW 351834B TW 086112608 A TW086112608 A TW 086112608A TW 86112608 A TW86112608 A TW 86112608A TW 351834 B TW351834 B TW 351834B
- Authority
- TW
- Taiwan
- Prior art keywords
- hydroxy
- carbon atoms
- substituted
- saturated hydroxy
- saturated
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000012756 surface treatment agent Substances 0.000 title abstract 2
- 230000015572 biosynthetic process Effects 0.000 title 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 15
- 125000004432 carbon atom Chemical group C* 0.000 abstract 9
- 229910052739 hydrogen Inorganic materials 0.000 abstract 3
- 239000001257 hydrogen Substances 0.000 abstract 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 3
- 238000005260 corrosion Methods 0.000 abstract 2
- 230000007797 corrosion Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910021332 silicide Inorganic materials 0.000 abstract 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27329296 | 1996-10-16 | ||
| JP1053397 | 1997-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW351834B true TW351834B (en) | 1999-02-01 |
Family
ID=26345816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW086112608A TW351834B (en) | 1996-10-16 | 1997-09-02 | Method of round formation and surface treatment agent |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6133465A (zh) |
| EP (1) | EP0837369B1 (zh) |
| KR (1) | KR19980032852A (zh) |
| DE (1) | DE69709287T2 (zh) |
| TW (1) | TW351834B (zh) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6258972B1 (en) | 1995-08-03 | 2001-07-10 | Matsushita Electric Industrial Co., Ltd. | Pattern formation method and surface treating agent |
| US6054255A (en) * | 1996-08-01 | 2000-04-25 | Matsushita Electric Industrial Co., Ltd. | Pattern formation method and surface treating agent |
| TW351834B (en) * | 1996-10-16 | 1999-02-01 | Matsushita Electric Ind Co Ltd | Method of round formation and surface treatment agent |
| TW392229B (en) | 1997-01-23 | 2000-06-01 | Matsushita Electric Ind Co Ltd | Method of manufacturing semiconductor device and apparatus for same |
| TW383416B (en) * | 1997-06-26 | 2000-03-01 | Matsushita Electric Ind Co Ltd | Pattern forming method |
| JP5158370B2 (ja) * | 2008-02-14 | 2013-03-06 | 信越化学工業株式会社 | ダブルパターン形成方法 |
| JP5007827B2 (ja) * | 2008-04-04 | 2012-08-22 | 信越化学工業株式会社 | ダブルパターン形成方法 |
| KR20110086028A (ko) * | 2008-10-21 | 2011-07-27 | 도오꾜오까고오교 가부시끼가이샤 | 표면 처리액 및 표면 처리 방법, 그리고 소수화 처리 방법 및 소수화된 기판 |
| WO2016021408A1 (ja) * | 2014-08-07 | 2016-02-11 | ダイキン工業株式会社 | 防汚処理組成物、処理装置、処理方法および処理物品 |
| JP6081637B2 (ja) * | 2015-04-10 | 2017-02-15 | ダイキン工業株式会社 | 防汚処理組成物、処理装置、処理方法および処理物品 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4051164A (en) * | 1975-02-14 | 1977-09-27 | General Foods Corporation | Enol ester of α-diketones |
| JPS58188132A (ja) * | 1982-04-28 | 1983-11-02 | Toyo Soda Mfg Co Ltd | レジストと基板との密着性強化方法 |
| US4535054A (en) * | 1983-05-05 | 1985-08-13 | Hughes Aircraft Company | Wet process for developing styrene polymer resists for submicron lithography |
| DE3751595T2 (de) * | 1986-07-31 | 1996-06-13 | Nissan Chemical Ind Ltd | Optisch aktive Alkohole, Verfahren zu deren Produktion und Verfahren zu deren Spaltung. |
| US4732858A (en) * | 1986-09-17 | 1988-03-22 | Brewer Science, Inc. | Adhesion promoting product and process for treating an integrated circuit substrate |
| EP0278996A1 (de) * | 1987-02-17 | 1988-08-24 | Ibm Deutschland Gmbh | Verfahren zur Verbesserung der Haftung von Photoresistmaterialien |
| US4808511A (en) * | 1987-05-19 | 1989-02-28 | International Business Machines Corporation | Vapor phase photoresist silylation process |
| CA2037538A1 (en) * | 1990-03-12 | 1991-09-13 | John A. T. Norman | Fluorinated beta-ketoiminato metal complexes |
| US5091290A (en) * | 1990-12-03 | 1992-02-25 | Micron Technology, Inc. | Process for promoting adhesion of a layer of photoresist on a substrate having a previous layer of photoresist |
| JPH05150459A (ja) * | 1991-05-24 | 1993-06-18 | Nippon Paint Co Ltd | レジストパターンの形成方法 |
| JP3424835B2 (ja) * | 1991-12-27 | 2003-07-07 | 松下電器産業株式会社 | カラー固体撮像装置およびカラーフィルタ |
| US5312717A (en) * | 1992-09-24 | 1994-05-17 | International Business Machines Corporation | Residue free vertical pattern transfer with top surface imaging resists |
| JPH06350000A (ja) * | 1993-06-04 | 1994-12-22 | Hitachi Ltd | リードフレームの表面処理剤およびそれを用いた半導体集積回路装置の製造方法 |
| KR0174316B1 (ko) * | 1994-07-05 | 1999-04-01 | 모리시다 요이치 | 미세패턴 형성방법 |
| JPH11511900A (ja) * | 1994-11-22 | 1999-10-12 | コンプレツクス フルイツド システムズ，インコーポレーテツド | マイクロエレクトロニクス用途のための非アミン系フォトレジスト密着促進剤 |
| US6258972B1 (en) * | 1995-08-03 | 2001-07-10 | Matsushita Electric Industrial Co., Ltd. | Pattern formation method and surface treating agent |
| TW351834B (en) * | 1996-10-16 | 1999-02-01 | Matsushita Electric Ind Co Ltd | Method of round formation and surface treatment agent |
-
1997
- 1997-09-02 TW TW086112608A patent/TW351834B/zh not_active IP Right Cessation
- 1997-09-10 DE DE69709287T patent/DE69709287T2/de not_active Expired - Lifetime
- 1997-09-10 EP EP97115726A patent/EP0837369B1/en not_active Expired - Lifetime
- 1997-10-15 US US08/951,001 patent/US6133465A/en not_active Expired - Lifetime
- 1997-10-15 KR KR1019970052739A patent/KR19980032852A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR19980032852A (ko) | 1998-07-25 |
| US6133465A (en) | 2000-10-17 |
| DE69709287D1 (de) | 2002-01-31 |
| EP0837369A1 (en) | 1998-04-22 |
| DE69709287T2 (de) | 2002-06-13 |
| EP0837369B1 (en) | 2001-12-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |