MXPA02009785A - Proceso para el recubrimiento electrolitico directo con metal de un substrato de plastico. - Google Patents
Proceso para el recubrimiento electrolitico directo con metal de un substrato de plastico.Info
- Publication number
- MXPA02009785A MXPA02009785A MXPA02009785A MXPA02009785A MXPA02009785A MX PA02009785 A MXPA02009785 A MX PA02009785A MX PA02009785 A MXPA02009785 A MX PA02009785A MX PA02009785 A MXPA02009785 A MX PA02009785A MX PA02009785 A MXPA02009785 A MX PA02009785A
- Authority
- MX
- Mexico
- Prior art keywords
- plastic substrate
- metal plating
- direct metal
- active surface
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Un proceso para el recubrimiento electrolitico directo con metal, de un substrato (14) de plastico. El proceso comprende las etapas de: (i) activar una superficie del substrato de poliolefina modificada para producir una superficie (16) activa, la superficie 16 activa, que tiene al menos aproximadamente el 7% de atomos de carbono en la forma de carbonilo; (ii) depositar electroquimicamente una capa (18) de metal sobre la superficie (16) activa.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19469300P | 2000-04-05 | 2000-04-05 | |
PCT/CA2001/000463 WO2001077419A2 (en) | 2000-04-05 | 2001-04-05 | Process for the direct metal-plating of a plastic substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA02009785A true MXPA02009785A (es) | 2004-09-06 |
Family
ID=22718560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA02009785A MXPA02009785A (es) | 2000-04-05 | 2001-04-05 | Proceso para el recubrimiento electrolitico directo con metal de un substrato de plastico. |
Country Status (8)
Country | Link |
---|---|
US (1) | US20040222103A1 (es) |
EP (1) | EP1268880B1 (es) |
AU (1) | AU2001248179A1 (es) |
BR (1) | BR0109887A (es) |
CA (1) | CA2404946A1 (es) |
DE (1) | DE60109432T2 (es) |
MX (1) | MXPA02009785A (es) |
WO (1) | WO2001077419A2 (es) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060104074A1 (en) * | 2004-09-10 | 2006-05-18 | Boniface Robert E | Vehicle body |
US7666471B2 (en) * | 2006-03-22 | 2010-02-23 | Mark Wojtaszek | Polyimide substrate and method of manufacturing printed wiring board using the same |
FR2930180B1 (fr) * | 2008-04-22 | 2010-12-17 | Inst Superieur De Plasturgie D Alencon Entpr S | Procede de metallisation d'un substrat non conducteur en matiere plastique |
EP3019711B1 (en) | 2013-07-09 | 2023-11-01 | RTX Corporation | Plated polymer nosecone |
EP3019710A4 (en) | 2013-07-09 | 2017-05-10 | United Technologies Corporation | Plated polymer fan |
WO2015006487A1 (en) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Erosion and wear protection for composites and plated polymers |
EP3019723A4 (en) | 2013-07-09 | 2017-05-10 | United Technologies Corporation | Plated polymer compressor |
CA2917955A1 (en) * | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Plating a composite to enhance bonding of metallic components |
WO2015053832A2 (en) | 2013-07-09 | 2015-04-16 | United Technologies Corporation | High-modulus coating for local stiffening of airfoil trailing edges |
WO2015006421A1 (en) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Metal-encapsulated polymeric article |
CN105112971A (zh) * | 2015-09-22 | 2015-12-02 | 太仓市金鹿电镀有限公司 | 一种汽车散热格栅沙镍电镀工艺 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1488559A (es) * | 1965-08-03 | 1967-10-27 | ||
US3556955A (en) * | 1966-02-18 | 1971-01-19 | Union Carbide Corp | Process of metal plating plastics |
US4002595A (en) * | 1973-12-27 | 1977-01-11 | E. I. Du Pont De Nemours And Company | Electroplatable polypropylene compositions |
US4298424A (en) * | 1980-06-19 | 1981-11-03 | Vbe Industries, Ltd. | Method for etching polyamide shaped articles |
JPS63247376A (ja) * | 1987-04-03 | 1988-10-14 | Citizen Watch Co Ltd | プラスチツク成形品への無電解メツキの前処理方法 |
US5340451A (en) * | 1990-10-04 | 1994-08-23 | International Business Machines Corporation | Process for producing a metal organic polymer combination |
EP0905285B1 (en) * | 1997-02-03 | 2000-12-27 | Okuno Chemical Industries Co., Ltd. | Method for electroplating nonconductive material |
GB9722028D0 (en) * | 1997-10-17 | 1997-12-17 | Shipley Company Ll C | Plating of polymers |
-
2001
- 2001-04-05 WO PCT/CA2001/000463 patent/WO2001077419A2/en active IP Right Grant
- 2001-04-05 BR BR0109887A patent/BR0109887A/pt not_active Application Discontinuation
- 2001-04-05 CA CA 2404946 patent/CA2404946A1/en not_active Abandoned
- 2001-04-05 AU AU2001248179A patent/AU2001248179A1/en not_active Abandoned
- 2001-04-05 US US10/240,972 patent/US20040222103A1/en not_active Abandoned
- 2001-04-05 EP EP01921064A patent/EP1268880B1/en not_active Expired - Lifetime
- 2001-04-05 DE DE2001609432 patent/DE60109432T2/de not_active Expired - Fee Related
- 2001-04-05 MX MXPA02009785A patent/MXPA02009785A/es unknown
Also Published As
Publication number | Publication date |
---|---|
EP1268880B1 (en) | 2005-03-16 |
US20040222103A1 (en) | 2004-11-11 |
WO2001077419A3 (en) | 2002-09-12 |
BR0109887A (pt) | 2003-06-03 |
EP1268880A2 (en) | 2003-01-02 |
DE60109432T2 (de) | 2006-04-06 |
WO2001077419A2 (en) | 2001-10-18 |
AU2001248179A1 (en) | 2001-10-23 |
DE60109432D1 (de) | 2005-04-21 |
CA2404946A1 (en) | 2001-10-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200513549A (en) | Electroplating composite substrates | |
MXPA02009785A (es) | Proceso para el recubrimiento electrolitico directo con metal de un substrato de plastico. | |
WO2003095701A8 (en) | Volatile copper(ii) complexes for deposition of copper films by atomic layer deposition | |
ATE429525T1 (de) | Metallisierte folie und verfahren zu deren herstellung sowie deren anwendung | |
AU2003226425A1 (en) | Method of making transistors | |
TW200732518A (en) | Method of direct plating of copper on a substrate structure | |
AU2002342470A1 (en) | Improvements in fluxless brazing | |
SG166794A1 (en) | Layer arrangement for the formation of a coating on a surface of a substrate,coating method,and substrate with a layer arrangement | |
WO2002004715A3 (en) | Deposition uniformity control for electroplating apparatus, and associated method | |
TW200628618A (en) | Film forming method, deposition source substrate and preparation method thereof | |
TW200508026A (en) | Weatherable multilayer articles and method for their preparation | |
TW344892B (en) | Method of forming a semiconductor metallization system and structure therefor | |
TW200515637A (en) | Porous films and method of making the same | |
AU2565597A (en) | Blocking foil and method of producing the same | |
GB2247692B (en) | Diamond-like carbon coatings | |
TW349129B (en) | Precursor with (methoxy)(methyl)silylolefin ligands to deposit copper and method for same | |
TW351770B (en) | Shield layer, method for forming shield layer and producing substrate | |
WO2005048275A3 (en) | COMPOSITIONS AND METHODS FOR THE ELECTROLESS DEPOSITION OF NiFe ON A WORK PIECE | |
HK1050998A1 (en) | Member for application of ointment and ointment patch employing the same | |
PL368719A1 (en) | Inoculants for intermetallic layer | |
AU2002358303A1 (en) | Material deposition from a liquefied gas solution | |
SG108267A1 (en) | Composition for circuit board manufacture | |
AU5888798A (en) | New process for modification of surfaces | |
AU2681200A (en) | Moulds and method of making the same | |
MY135932A (en) | "method for electroless metalisation of polymer substrate" |