TW351008B - Lead holder, manufacturing method of lead holder, semiconductor and manufacturing method of semiconductor - Google Patents
Lead holder, manufacturing method of lead holder, semiconductor and manufacturing method of semiconductorInfo
- Publication number
- TW351008B TW351008B TW086119630A TW86119630A TW351008B TW 351008 B TW351008 B TW 351008B TW 086119630 A TW086119630 A TW 086119630A TW 86119630 A TW86119630 A TW 86119630A TW 351008 B TW351008 B TW 351008B
- Authority
- TW
- Taiwan
- Prior art keywords
- lead
- manufacturing
- semiconductor
- lead holder
- holder
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP34299796 | 1996-12-24 |
Publications (1)
Publication Number | Publication Date |
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TW351008B true TW351008B (en) | 1999-01-21 |
Family
ID=18358145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086119630A TW351008B (en) | 1996-12-24 | 1997-12-23 | Lead holder, manufacturing method of lead holder, semiconductor and manufacturing method of semiconductor |
Country Status (3)
Country | Link |
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US (2) | US5977615A (zh) |
CN (1) | CN1155084C (zh) |
TW (1) | TW351008B (zh) |
Families Citing this family (129)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6101101A (en) * | 1998-05-28 | 2000-08-08 | Sampo Semiconductor Corporation | Universal leadframe for semiconductor devices |
US6143981A (en) | 1998-06-24 | 2000-11-07 | Amkor Technology, Inc. | Plastic integrated circuit package and method and leadframe for making the package |
US7005326B1 (en) * | 1998-06-24 | 2006-02-28 | Amkor Technology, Inc. | Method of making an integrated circuit package |
US6281568B1 (en) * | 1998-10-21 | 2001-08-28 | Amkor Technology, Inc. | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad |
JP2000164788A (ja) * | 1998-11-20 | 2000-06-16 | Anam Semiconductor Inc | 半導体パッケ―ジ用リ―ドフレ―ムとこれを用いた半導体パッケ―ジ及びその製造方法 |
US6274927B1 (en) | 1999-06-03 | 2001-08-14 | Amkor Technology, Inc. | Plastic package for an optical integrated circuit device and method of making |
MY133357A (en) * | 1999-06-30 | 2007-11-30 | Hitachi Ltd | A semiconductor device and a method of manufacturing the same |
JP2001077232A (ja) * | 1999-09-06 | 2001-03-23 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP3461332B2 (ja) * | 1999-09-10 | 2003-10-27 | 松下電器産業株式会社 | リードフレーム及びそれを用いた樹脂パッケージと光電子装置 |
JP2001085460A (ja) * | 1999-09-10 | 2001-03-30 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
KR20010037247A (ko) * | 1999-10-15 | 2001-05-07 | 마이클 디. 오브라이언 | 반도체패키지 |
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-
1997
- 1997-12-23 US US08/997,651 patent/US5977615A/en not_active Expired - Lifetime
- 1997-12-23 TW TW086119630A patent/TW351008B/zh not_active IP Right Cessation
- 1997-12-24 CN CNB971258236A patent/CN1155084C/zh not_active Expired - Fee Related
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1999
- 1999-07-27 US US09/361,404 patent/US6225146B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
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US5977615A (en) | 1999-11-02 |
CN1155084C (zh) | 2004-06-23 |
US6225146B1 (en) | 2001-05-01 |
CN1186340A (zh) | 1998-07-01 |
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