TW351008B - Lead holder, manufacturing method of lead holder, semiconductor and manufacturing method of semiconductor - Google Patents

Lead holder, manufacturing method of lead holder, semiconductor and manufacturing method of semiconductor

Info

Publication number
TW351008B
TW351008B TW086119630A TW86119630A TW351008B TW 351008 B TW351008 B TW 351008B TW 086119630 A TW086119630 A TW 086119630A TW 86119630 A TW86119630 A TW 86119630A TW 351008 B TW351008 B TW 351008B
Authority
TW
Taiwan
Prior art keywords
lead
manufacturing
semiconductor
lead holder
holder
Prior art date
Application number
TW086119630A
Other languages
English (en)
Inventor
Yukio Yamaguchi
Akira Koga
Toru Nomura
Masanori Nano
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of TW351008B publication Critical patent/TW351008B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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    • H01L2924/181—Encapsulation
TW086119630A 1996-12-24 1997-12-23 Lead holder, manufacturing method of lead holder, semiconductor and manufacturing method of semiconductor TW351008B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34299796 1996-12-24

Publications (1)

Publication Number Publication Date
TW351008B true TW351008B (en) 1999-01-21

Family

ID=18358145

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086119630A TW351008B (en) 1996-12-24 1997-12-23 Lead holder, manufacturing method of lead holder, semiconductor and manufacturing method of semiconductor

Country Status (3)

Country Link
US (2) US5977615A (zh)
CN (1) CN1155084C (zh)
TW (1) TW351008B (zh)

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US6101101A (en) * 1998-05-28 2000-08-08 Sampo Semiconductor Corporation Universal leadframe for semiconductor devices
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7005326B1 (en) * 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US6281568B1 (en) * 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6448633B1 (en) * 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6274927B1 (en) 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP2001077232A (ja) * 1999-09-06 2001-03-23 Mitsubishi Electric Corp 半導体装置およびその製造方法
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