TW350970B - Wafer transfer apparatus - Google Patents

Wafer transfer apparatus

Info

Publication number
TW350970B
TW350970B TW084111195A TW84111195A TW350970B TW 350970 B TW350970 B TW 350970B TW 084111195 A TW084111195 A TW 084111195A TW 84111195 A TW84111195 A TW 84111195A TW 350970 B TW350970 B TW 350970B
Authority
TW
Taiwan
Prior art keywords
wafer
master
chip
proximity
sustaining
Prior art date
Application number
TW084111195A
Other languages
English (en)
Inventor
Steven R Thompson
Rikki S Labere
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Application granted granted Critical
Publication of TW350970B publication Critical patent/TW350970B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW084111195A 1994-10-13 1995-10-23 Wafer transfer apparatus TW350970B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/322,754 US5590996A (en) 1994-10-13 1994-10-13 Wafer transfer apparatus

Publications (1)

Publication Number Publication Date
TW350970B true TW350970B (en) 1999-01-21

Family

ID=23256255

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111195A TW350970B (en) 1994-10-13 1995-10-23 Wafer transfer apparatus

Country Status (7)

Country Link
US (2) US5590996A (zh)
EP (1) EP0786146A1 (zh)
JP (1) JP2925329B2 (zh)
AU (1) AU3889495A (zh)
DE (1) DE786146T1 (zh)
TW (1) TW350970B (zh)
WO (1) WO1996012294A1 (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2429395A (en) * 1994-04-28 1995-11-29 Semitool, Incorporated Semiconductor processing systems
US6833035B1 (en) * 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US5664925A (en) * 1995-07-06 1997-09-09 Brooks Automation, Inc. Batchloader for load lock
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6672820B1 (en) 1996-07-15 2004-01-06 Semitool, Inc. Semiconductor processing apparatus having linear conveyer system
JP3570827B2 (ja) * 1996-09-13 2004-09-29 東京エレクトロン株式会社 処理装置
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
US6213708B1 (en) * 1997-03-12 2001-04-10 Advanced Micro Devices, Inc. System for sorting multiple semiconductor wafers
US5980187A (en) * 1997-04-16 1999-11-09 Kla-Tencor Corporation Mechanism for transporting semiconductor-process masks
US6572320B2 (en) 1997-05-05 2003-06-03 Semitool, Inc. Robot for handling workpieces in an automated processing system
GB2343672B (en) * 1997-08-28 2001-04-04 Cvc Products Inc Wafer Handler and Multi-Station Processing System and Method for Handling Wafers
US6168697B1 (en) 1998-03-10 2001-01-02 Trusi Technologies Llc Holders suitable to hold articles during processing and article processing methods
US6095582A (en) * 1998-03-11 2000-08-01 Trusi Technologies, Llc Article holders and holding methods
US6457929B2 (en) 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment
US6120229A (en) * 1999-02-01 2000-09-19 Brooks Automation Inc. Substrate carrier as batchloader
DE10121499B4 (de) * 2001-05-03 2007-08-02 Campus Technologies Ag Vorrichtung und Verfahren zur optischen Spektroskopie und optischen Sensorik sowie Verwendung der Vorrichtung
US7114903B2 (en) 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US7785573B2 (en) * 2006-01-23 2010-08-31 Isp Investments Inc. Solubilizing agents for active or functional organic compounds
US7371998B2 (en) * 2006-07-05 2008-05-13 Semitool, Inc. Thermal wafer processor
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
US8673783B2 (en) 2010-07-02 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Metal conductor chemical mechanical polish
WO2013021645A1 (ja) 2011-08-10 2013-02-14 川崎重工業株式会社 エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット
JP6309756B2 (ja) 2013-12-26 2018-04-11 川崎重工業株式会社 エンドエフェクタ装置
US10483143B2 (en) 2013-12-26 2019-11-19 Kawasaki Jukogyo Kabushiki Kaisha End effector and substrate conveying robot
EP3101684B1 (en) 2014-01-28 2023-08-16 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying system and method
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
FR2624839B1 (fr) * 1987-12-22 1990-06-01 Recif Sa Appareil pour le transfert horizontal de plaquettes de silicium notamment
US4875824A (en) * 1988-02-01 1989-10-24 Biorne Enterprises, Inc. Wafer transfer apparatus
JPH01239865A (ja) * 1988-03-19 1989-09-25 Teru Yamanashi Kk 半導体ウエハの移載装置
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
US5022695A (en) * 1989-01-30 1991-06-11 Texas Instruments Incorporated Semiconductor slice holder
CH680275A5 (zh) * 1990-03-05 1992-07-31 Tet Techno Investment Trust
US5404894A (en) * 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
EP0686303B1 (de) * 1993-02-26 2000-12-13 MAYER, Herbert E. Vorrichtung und verfahren zum transportieren von flachen gegenständen, insbesondere von substraten

Also Published As

Publication number Publication date
EP0786146A1 (en) 1997-07-30
AU3889495A (en) 1996-05-06
WO1996012294A1 (en) 1996-04-25
US5590996A (en) 1997-01-07
JP2925329B2 (ja) 1999-07-28
DE786146T1 (de) 1998-01-29
US5575611A (en) 1996-11-19
JPH10506757A (ja) 1998-06-30

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