DE786146T1 - Wafer-transfer-apparat - Google Patents

Wafer-transfer-apparat

Info

Publication number
DE786146T1
DE786146T1 DE0786146T DE95938154T DE786146T1 DE 786146 T1 DE786146 T1 DE 786146T1 DE 0786146 T DE0786146 T DE 0786146T DE 95938154 T DE95938154 T DE 95938154T DE 786146 T1 DE786146 T1 DE 786146T1
Authority
DE
Germany
Prior art keywords
wafer
transfer apparatus
transfer
apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE0786146T
Other languages
English (en)
Inventor
Steve Thompson
Rikki Labere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US08/322,754 priority Critical patent/US5590996A/en
Application filed by Semitool Inc filed Critical Semitool Inc
Priority to PCT/US1995/012769 priority patent/WO1996012294A1/en
Publication of DE786146T1 publication Critical patent/DE786146T1/de
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of waers
    • H01L21/67781Batch transfer of wafers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/141Associated with semiconductor wafer handling includes means for gripping wafer
DE0786146T 1994-10-13 1995-10-13 Wafer-transfer-apparat Pending DE786146T1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US08/322,754 US5590996A (en) 1994-10-13 1994-10-13 Wafer transfer apparatus
PCT/US1995/012769 WO1996012294A1 (en) 1994-10-13 1995-10-13 Wafer transfer apparatus

Publications (1)

Publication Number Publication Date
DE786146T1 true DE786146T1 (de) 1998-01-29

Family

ID=23256255

Family Applications (1)

Application Number Title Priority Date Filing Date
DE0786146T Pending DE786146T1 (de) 1994-10-13 1995-10-13 Wafer-transfer-apparat

Country Status (7)

Country Link
US (2) US5590996A (de)
EP (1) EP0786146A1 (de)
JP (1) JP2925329B2 (de)
AU (1) AU3889495A (de)
DE (1) DE786146T1 (de)
TW (1) TW350970B (de)
WO (1) WO1996012294A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US6833035B1 (en) * 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US6572320B2 (en) 1997-05-05 2003-06-03 Semitool, Inc. Robot for handling workpieces in an automated processing system
EP0757844A1 (de) * 1994-04-28 1997-02-12 Semitool, Inc. Verarbeitungssysteme für halbleiter
US5664925A (en) * 1995-07-06 1997-09-09 Brooks Automation, Inc. Batchloader for load lock
US6091498A (en) 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6672820B1 (en) 1996-07-15 2004-01-06 Semitool, Inc. Semiconductor processing apparatus having linear conveyer system
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6203582B1 (en) 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
JP3570827B2 (ja) * 1996-09-13 2004-09-29 東京エレクトロン株式会社 処理装置
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
US6213708B1 (en) * 1997-03-12 2001-04-10 Advanced Micro Devices, Inc. System for sorting multiple semiconductor wafers
US5980187A (en) * 1997-04-16 1999-11-09 Kla-Tencor Corporation Mechanism for transporting semiconductor-process masks
DE19882662T1 (de) * 1997-08-28 2000-08-03 Cvc Products Inc Wafertransportvorrichtung für Mehrstationswerkzeug
US6168697B1 (en) 1998-03-10 2001-01-02 Trusi Technologies Llc Holders suitable to hold articles during processing and article processing methods
US6095582A (en) * 1998-03-11 2000-08-01 Trusi Technologies, Llc Article holders and holding methods
US6457929B2 (en) 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment
US6120229A (en) * 1999-02-01 2000-09-19 Brooks Automation Inc. Substrate carrier as batchloader
DE10121499B4 (de) * 2001-05-03 2007-08-02 Campus Technologies Ag Vorrichtung und Verfahren zur optischen Spektroskopie und optischen Sensorik sowie Verwendung der Vorrichtung
US7114903B2 (en) 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US7785573B2 (en) 2006-01-23 2010-08-31 Isp Investments Inc. Solubilizing agents for active or functional organic compounds
US7371998B2 (en) * 2006-07-05 2008-05-13 Semitool, Inc. Thermal wafer processor
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
US8673783B2 (en) 2010-07-02 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Metal conductor chemical mechanical polish
TWI538789B (zh) 2011-08-10 2016-06-21 Kawasaki Heavy Ind Ltd A end effector device, and a substrate transport robot including the end effector device
WO2015098153A1 (ja) 2013-12-26 2015-07-02 川崎重工業株式会社 エンドエフェクタおよび基板搬送ロボット
JP6309756B2 (ja) 2013-12-26 2018-04-11 川崎重工業株式会社 エンドエフェクタ装置
WO2015114850A1 (ja) 2014-01-28 2015-08-06 川崎重工業株式会社 基板搬送システムおよび方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
FR2624839B1 (fr) * 1987-12-22 1990-06-01 Recif Sa Appareil pour le transfert horizontal de plaquettes de silicium notamment
US4875824A (en) * 1988-02-01 1989-10-24 Biorne Enterprises, Inc. Wafer transfer apparatus
JPH01239865A (en) * 1988-03-19 1989-09-25 Teru Yamanashi Kk Device for transfer of semiconductor wafer
US4900214A (en) * 1988-05-25 1990-02-13 American Telephone And Telegraph Company Method and apparatus for transporting semiconductor wafers
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
US5022695A (en) * 1989-01-30 1991-06-11 Texas Instruments Incorporated Semiconductor slice holder
CH680275A5 (de) * 1990-03-05 1992-07-31 Tet Techno Investment Trust
US5404894A (en) * 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
EP0686303B1 (de) * 1993-02-26 2000-12-13 MAYER, Herbert E. Vorrichtung und verfahren zum transportieren von flachen gegenständen, insbesondere von substraten

Also Published As

Publication number Publication date
US5575611A (en) 1996-11-19
JPH10506757A (ja) 1998-06-30
US5590996A (en) 1997-01-07
EP0786146A1 (de) 1997-07-30
WO1996012294A1 (en) 1996-04-25
JP2925329B2 (ja) 1999-07-28
TW350970B (en) 1999-01-21
AU3889495A (en) 1996-05-06

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