TW348157B - Equipment and method to hold and to protect objects - Google Patents

Equipment and method to hold and to protect objects

Info

Publication number
TW348157B
TW348157B TW087100728A TW87100728A TW348157B TW 348157 B TW348157 B TW 348157B TW 087100728 A TW087100728 A TW 087100728A TW 87100728 A TW87100728 A TW 87100728A TW 348157 B TW348157 B TW 348157B
Authority
TW
Taiwan
Prior art keywords
equipment
hold
protect objects
feeding device
outer region
Prior art date
Application number
TW087100728A
Other languages
English (en)
Inventor
Mathuni Josef
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW348157B publication Critical patent/TW348157B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Buffer Packaging (AREA)
TW087100728A 1997-01-28 1998-01-20 Equipment and method to hold and to protect objects TW348157B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19703059A DE19703059A1 (de) 1997-01-28 1997-01-28 Vorrichtung und Verfahren zur Halterung und zum Schutz von Halbleiter-Wafern

Publications (1)

Publication Number Publication Date
TW348157B true TW348157B (en) 1998-12-21

Family

ID=7818586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087100728A TW348157B (en) 1997-01-28 1998-01-20 Equipment and method to hold and to protect objects

Country Status (7)

Country Link
EP (1) EP0904598A1 (zh)
JP (1) JP2000508837A (zh)
KR (1) KR20000064544A (zh)
CN (1) CN1216157A (zh)
DE (1) DE19703059A1 (zh)
TW (1) TW348157B (zh)
WO (1) WO1998033205A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1089328A1 (en) 1999-09-29 2001-04-04 Infineon Technologies AG Method for manufacturing of a semiconductor device
CN1323424C (zh) * 2002-01-23 2007-06-27 明基电通股份有限公司 晶片保护装置
JP4603578B2 (ja) * 2005-02-18 2010-12-22 三井化学株式会社 半導体ウェハ表面保護シート及び該保護シートを用いる半導体ウェハの保護方法
JP4740414B2 (ja) 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
JP5288191B2 (ja) * 2009-03-17 2013-09-11 大日本印刷株式会社 基板固定装置
EP2696365B1 (en) * 2012-08-09 2021-06-23 Samsung Electronics Co., Ltd. Method of manufacturing a semiconductor device using a semiconductor buffer structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895812A (ja) * 1981-12-01 1983-06-07 Nippon Kogaku Kk <Nikon> 基板の収納容器及び収納容器の装着装置
DE3686781D1 (de) * 1985-05-04 1992-10-29 Seibu Giken Kk Vorrichtung zum halten und/oder foerdern einer platte mittels eines fluids ohne koerperliche beruehrung.
US5067762A (en) * 1985-06-18 1991-11-26 Hiroshi Akashi Non-contact conveying device
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
US5075256A (en) * 1989-08-25 1991-12-24 Applied Materials, Inc. Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer
DE9213054U1 (de) * 1992-09-28 1994-02-03 Siemens AG, 80333 München Transportbehälter für Halbleiterprodukte in Reinraum-Fertigungen
JP2934565B2 (ja) * 1993-05-21 1999-08-16 三菱電機株式会社 半導体製造装置及び半導体製造方法
DE19502777A1 (de) * 1994-02-22 1995-08-24 Siemens Ag Verfahren zur plasmaunterstützten Rückseitenätzung einer Halbleiterscheibe bei belackungsfreier Scheibenvorderseite
US5494156A (en) * 1994-07-21 1996-02-27 Optima Precision Inc. Disc retainer for disc storage device

Also Published As

Publication number Publication date
DE19703059A1 (de) 1998-09-17
JP2000508837A (ja) 2000-07-11
CN1216157A (zh) 1999-05-05
EP0904598A1 (de) 1999-03-31
KR20000064544A (ko) 2000-11-06
WO1998033205A1 (de) 1998-07-30

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