TW343396B - Laser device - Google Patents

Laser device

Info

Publication number
TW343396B
TW343396B TW085112073A TW85112073A TW343396B TW 343396 B TW343396 B TW 343396B TW 085112073 A TW085112073 A TW 085112073A TW 85112073 A TW85112073 A TW 85112073A TW 343396 B TW343396 B TW 343396B
Authority
TW
Taiwan
Prior art keywords
pulse
source voltage
oscillation
continuous
prescribed
Prior art date
Application number
TW085112073A
Other languages
English (en)
Inventor
Kei Mizoguchi
Satoru Wakabayashi
Yukio Kobayashi
Yoshiho Amada
Tatuo Mitsumura
Original Assignee
Komatsu Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP24968395A external-priority patent/JP3413510B2/ja
Priority claimed from JP05778396A external-priority patent/JP3864287B2/ja
Application filed by Komatsu Mfg Co Ltd filed Critical Komatsu Mfg Co Ltd
Application granted granted Critical
Publication of TW343396B publication Critical patent/TW343396B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70041—Production of exposure light, i.e. light sources by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/131—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/134—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation in gas lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/22—Gases
    • H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
    • H01S3/225—Gases the active gas being polyatomic, i.e. containing two or more atoms comprising an excimer or exciplex

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Lasers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW085112073A 1995-09-27 1996-10-03 Laser device TW343396B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24968395A JP3413510B2 (ja) 1995-09-27 1995-09-27 レーザ装置
JP05778396A JP3864287B2 (ja) 1996-03-14 1996-03-14 レーザ装置

Publications (1)

Publication Number Publication Date
TW343396B true TW343396B (en) 1998-10-21

Family

ID=26398854

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085112073A TW343396B (en) 1995-09-27 1996-10-03 Laser device

Country Status (6)

Country Link
US (1) US6008497A (zh)
EP (1) EP0854003B1 (zh)
KR (1) KR19980702629A (zh)
DE (1) DE69617254T2 (zh)
TW (1) TW343396B (zh)
WO (1) WO1997011810A1 (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3830591B2 (ja) * 1996-11-05 2006-10-04 株式会社小松製作所 レーザ装置
US6727731B1 (en) * 1999-03-12 2004-04-27 Lambda Physik Ag Energy control for an excimer or molecular fluorine laser
US7050882B1 (en) * 1999-04-27 2006-05-23 Mitsubishi Denki Kabushiki Kaisha Method of controlling working conditions of a laser working machine and a computer-readable storage medium
CN1168024C (zh) * 2000-02-16 2004-09-22 西默股份有限公司 光刻制版激光器的处理监视系统
US6408260B1 (en) * 2000-02-16 2002-06-18 Cymer, Inc. Laser lithography quality alarm system
US6618403B2 (en) 2000-03-16 2003-09-09 Lambda Physik Ag Method and apparatus for compensation of beam property drifts detected by measurement systems outside of an excimer laser
US6697695B1 (en) * 2000-04-25 2004-02-24 Komatsu Ltd. Laser device management system
US7095497B2 (en) * 2001-06-27 2006-08-22 Canon Kabushiki Kaisha Beam splitting apparatus, transmittance measurement apparatus, and exposure apparatus
US20060096956A1 (en) * 2001-10-19 2006-05-11 Mitsubishi Denki Kabushiki Kaisha Method of controlling working conditions of a laser working machine and a computer-readable storage medium
US6914920B2 (en) 2002-02-26 2005-07-05 Xtreme Technologies Gmbh Method for energy stabilization of gas discharged pumped in selected impulse following driven beam sources
US7251029B2 (en) * 2002-07-01 2007-07-31 Canon Kabushiki Kaisha Birefringence measurement apparatus, strain remover, polarimeter and exposure apparatus
US6998567B2 (en) * 2003-01-31 2006-02-14 Trimedyne, Inc. Generation and application of efficient solid-state laser pulse trains
US8518030B2 (en) * 2006-03-10 2013-08-27 Amo Manufacturing Usa, Llc Output energy control for lasers
JP4917382B2 (ja) * 2006-08-09 2012-04-18 株式会社ディスコ レーザー光線照射装置およびレーザー加工機
JP5371838B2 (ja) 2010-03-10 2013-12-18 株式会社フジクラ ファイバレーザ装置
CN104105570A (zh) * 2012-02-10 2014-10-15 旭硝子株式会社 使用多个dc电压输出的基板钻孔装置以及使用该装置的基板钻孔方法
WO2014030645A1 (ja) 2012-08-23 2014-02-27 ギガフォトン株式会社 光源装置及びデータ処理方法
TWI523357B (zh) * 2013-03-19 2016-02-21 Sumitomo Heavy Industries Laser processing device and laser processing method
WO2014208111A1 (ja) 2013-06-27 2014-12-31 ギガフォトン株式会社 光ビーム計測装置、レーザ装置及び光ビーム分離装置
WO2018105002A1 (ja) * 2016-12-05 2018-06-14 ギガフォトン株式会社 レーザ装置
US20180207748A1 (en) * 2017-01-23 2018-07-26 Lumentum Operations Llc Machining processes using a random trigger feature for an ultrashort pulse laser
CN114077163B (zh) * 2020-08-14 2023-03-31 长鑫存储技术有限公司 光罩传送装置及曝光系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4302782A (en) * 1977-03-10 1981-11-24 Xerox Corporation Reproduction scanning system having intermediate storage between input and output scanning stations
JP3580430B2 (ja) * 1991-12-18 2004-10-20 株式会社ニコン 露光システム及び露光方法
JP2738796B2 (ja) * 1992-06-08 1998-04-08 三菱電機株式会社 パルスレーザ装置
JP2779566B2 (ja) * 1992-07-17 1998-07-23 株式会社小松製作所 エキシマレーザ装置の制御装置
JP2631080B2 (ja) * 1993-10-05 1997-07-16 株式会社小松製作所 レーザ装置の出力制御装置

Also Published As

Publication number Publication date
US6008497A (en) 1999-12-28
EP0854003B1 (en) 2001-11-21
WO1997011810A1 (fr) 1997-04-03
KR19980702629A (ko) 1998-08-05
EP0854003A1 (en) 1998-07-22
DE69617254T2 (de) 2002-07-04
DE69617254D1 (de) 2002-01-03
EP0854003A4 (en) 1998-12-16

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