TW335525B - Tool chip, bonding tool having such tool chip, and method for controlling such bonding tool - Google Patents

Tool chip, bonding tool having such tool chip, and method for controlling such bonding tool

Info

Publication number
TW335525B
TW335525B TW086107133A TW86107133A TW335525B TW 335525 B TW335525 B TW 335525B TW 086107133 A TW086107133 A TW 086107133A TW 86107133 A TW86107133 A TW 86107133A TW 335525 B TW335525 B TW 335525B
Authority
TW
Taiwan
Prior art keywords
tool
chip
crystal diamond
bonding
diamond film
Prior art date
Application number
TW086107133A
Other languages
English (en)
Inventor
Katsuko Yamamoto
Gohisa Inoguchi
Yoshiaki Kumazawa
Katsukyo Tanaka
Hiroshi Shiomi
Takashi Tsuno
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Application granted granted Critical
Publication of TW335525B publication Critical patent/TW335525B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/20—Tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
TW086107133A 1996-05-27 1997-05-27 Tool chip, bonding tool having such tool chip, and method for controlling such bonding tool TW335525B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13210296 1996-05-27
JP2494397 1997-02-07

Publications (1)

Publication Number Publication Date
TW335525B true TW335525B (en) 1998-07-01

Family

ID=26362536

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086107133A TW335525B (en) 1996-05-27 1997-05-27 Tool chip, bonding tool having such tool chip, and method for controlling such bonding tool

Country Status (5)

Country Link
US (1) US6270898B1 (zh)
EP (1) EP0910122A4 (zh)
KR (1) KR100445275B1 (zh)
TW (1) TW335525B (zh)
WO (1) WO1997045867A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009008848U1 (de) 2009-06-27 2009-09-03 CHEE SIANG INDUSTRIAL CO., LTD., Wugu Differential-Zuführungsvorrichtung einer Nähmaschine

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7389905B2 (en) * 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
JP2004103649A (ja) * 2002-09-05 2004-04-02 Toyota Motor Corp 熱光発電用光電変換素子
US6840424B2 (en) * 2002-10-08 2005-01-11 Chien-Min Sung Compression bonding tools and associated bonding methods
DE10320133B4 (de) * 2003-05-06 2011-02-10 Universität Augsburg Verfahren zur Herstellung von einkristallinen oder quasi-einkristallinen Diamantschichten und auf einem Körper angeordnete einkristalline oder quasi-einkristalline Diamantschicht
JP2006100454A (ja) * 2004-09-29 2006-04-13 Tdk Corp 半田を用いた接合装置
EP1825731A1 (en) * 2004-11-29 2007-08-29 Heetronix Corporation Thermal attach and detach methods and systems for surface-mounted components
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
FR2905883B1 (fr) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre
JP5463059B2 (ja) * 2009-03-23 2014-04-09 東洋炭素株式会社 ダイヤモンド薄膜を被覆した炭素材料及びその製造方法
US8833635B1 (en) 2011-07-28 2014-09-16 Us Synthetic Corporation Method for identifying PCD elements for EDM processing
JP6236957B2 (ja) * 2013-07-23 2017-11-29 セイコーエプソン株式会社 電子部品搬送装置、電子部品検査装置および冷却システム

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
EP0286306B1 (en) * 1987-04-03 1993-10-06 Fujitsu Limited Method and apparatus for vapor deposition of diamond
DE69018220T2 (de) * 1989-12-20 1995-07-27 Sumitomo Electric Industries Verbindungswerkzeug.
JP2717867B2 (ja) * 1989-12-27 1998-02-25 オグラ宝石精機工業株式会社 ボンディングツール
DE69117077T2 (de) * 1990-03-06 1996-06-27 Sumitomo Electric Industries Verfahren zum Aufwachsen einer Dünnschicht aus Diamant oder c-BN
JPH0451534A (ja) 1990-06-19 1992-02-20 Sumitomo Electric Ind Ltd 半導体素子実装方法
JP3028660B2 (ja) * 1991-10-21 2000-04-04 住友電気工業株式会社 ダイヤモンドヒートシンクの製造方法
GB9104984D0 (en) * 1991-03-08 1991-04-24 De Beers Ind Diamond Lead bonding tool
JPH053223A (ja) * 1991-06-24 1993-01-08 Toshiba Corp 平行出し機構と平行出し方法及びこの平行出し機構或いは平行出し方法を用いたインナリ−ドボンデイング装置とインナリ−ドボンデイング方法
US5254862A (en) * 1991-08-14 1993-10-19 Kobe Steel U.S.A., Inc. Diamond field-effect transistor with a particular boron distribution profile
JP2656864B2 (ja) 1991-09-10 1997-09-24 住友電気工業株式会社 ボンディングツール
US5213248A (en) * 1992-01-10 1993-05-25 Norton Company Bonding tool and its fabrication
JP3180419B2 (ja) * 1992-02-18 2001-06-25 住友電気工業株式会社 ボンディングツール
JP3077376B2 (ja) * 1992-04-28 2000-08-14 住友電気工業株式会社 ボンディングツールおよびその製造方法
JPH05299479A (ja) * 1992-04-23 1993-11-12 Sumitomo Electric Ind Ltd ボンディングツールおよびその製造方法
US5370299A (en) * 1992-04-23 1994-12-06 Sumitomo Electric Industries, Ltd. Bonding tool having diamond head and method of manufacturing the same
JPH0637150A (ja) 1992-07-20 1994-02-10 Fujitsu Ltd ボンディングツール
US5371383A (en) * 1993-05-14 1994-12-06 Kobe Steel Usa Inc. Highly oriented diamond film field-effect transistor
JPH0786311A (ja) * 1993-05-14 1995-03-31 Kobe Steel Ltd 高配向性ダイヤモンド薄膜電界効果トランジスタ
US5488350A (en) * 1994-01-07 1996-01-30 Michigan State University Diamond film structures and methods related to same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009008848U1 (de) 2009-06-27 2009-09-03 CHEE SIANG INDUSTRIAL CO., LTD., Wugu Differential-Zuführungsvorrichtung einer Nähmaschine

Also Published As

Publication number Publication date
WO1997045867A1 (fr) 1997-12-04
KR20000016021A (ko) 2000-03-25
KR100445275B1 (ko) 2004-10-14
EP0910122A1 (en) 1999-04-21
EP0910122A4 (en) 2007-07-04
US6270898B1 (en) 2001-08-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees