TW335514B - Method of fabricating semiconductor device - Google Patents
Method of fabricating semiconductor deviceInfo
- Publication number
- TW335514B TW335514B TW086111862A TW86111862A TW335514B TW 335514 B TW335514 B TW 335514B TW 086111862 A TW086111862 A TW 086111862A TW 86111862 A TW86111862 A TW 86111862A TW 335514 B TW335514 B TW 335514B
- Authority
- TW
- Taiwan
- Prior art keywords
- height
- layer
- crystal
- forming
- cumulative
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000013078 crystal Substances 0.000 abstract 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 230000001186 cumulative effect Effects 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8222—Bipolar technology
- H01L21/8228—Complementary devices, e.g. complementary transistors
- H01L21/82285—Complementary vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
- H01L27/0823—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
- H01L27/0826—Combination of vertical complementary transistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019970013071A KR100249168B1 (ko) | 1997-04-09 | 1997-04-09 | 반도체소자 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW335514B true TW335514B (en) | 1998-07-01 |
Family
ID=19502314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086111862A TW335514B (en) | 1997-04-09 | 1997-08-19 | Method of fabricating semiconductor device |
Country Status (5)
Country | Link |
---|---|
US (1) | US5970355A (zh) |
JP (1) | JP3062597B2 (zh) |
KR (1) | KR100249168B1 (zh) |
CN (1) | CN1122303C (zh) |
TW (1) | TW335514B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3727482B2 (ja) * | 1998-06-05 | 2005-12-14 | セイコーインスツル株式会社 | 半導体装置の製造方法 |
US7592898B1 (en) | 1999-03-09 | 2009-09-22 | Keystone Technology Solutions, Llc | Wireless communication systems, interrogators and methods of communicating within a wireless communication system |
JP5105830B2 (ja) * | 2006-11-07 | 2012-12-26 | 新日本無線株式会社 | 半導体装置の製造方法 |
CN104282556B (zh) * | 2014-06-23 | 2017-06-23 | 上海先进半导体制造股份有限公司 | 双极型晶体管发射极的掺杂方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2565317B2 (ja) * | 1986-12-03 | 1996-12-18 | 富士通株式会社 | 半導体装置の製造方法 |
JPS6473766A (en) * | 1987-09-16 | 1989-03-20 | Oki Electric Ind Co Ltd | Manufacture of semiconductor integrated circuit |
WO1993016494A1 (en) * | 1992-01-31 | 1993-08-19 | Analog Devices, Inc. | Complementary bipolar polysilicon emitter devices |
JPH07142419A (ja) * | 1993-11-15 | 1995-06-02 | Toshiba Corp | 半導体装置の製造方法 |
-
1997
- 1997-04-09 KR KR1019970013071A patent/KR100249168B1/ko not_active IP Right Cessation
- 1997-08-19 TW TW086111862A patent/TW335514B/zh not_active IP Right Cessation
- 1997-10-15 CN CN97120447A patent/CN1122303C/zh not_active Expired - Lifetime
-
1998
- 1998-02-04 US US09/018,476 patent/US5970355A/en not_active Expired - Lifetime
- 1998-02-20 JP JP10038537A patent/JP3062597B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100249168B1 (ko) | 2000-03-15 |
JP3062597B2 (ja) | 2000-07-10 |
CN1122303C (zh) | 2003-09-24 |
JPH1140573A (ja) | 1999-02-12 |
KR19980076382A (ko) | 1998-11-16 |
US5970355A (en) | 1999-10-19 |
CN1195885A (zh) | 1998-10-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |