TW335514B - Method of fabricating semiconductor device - Google Patents

Method of fabricating semiconductor device

Info

Publication number
TW335514B
TW335514B TW086111862A TW86111862A TW335514B TW 335514 B TW335514 B TW 335514B TW 086111862 A TW086111862 A TW 086111862A TW 86111862 A TW86111862 A TW 86111862A TW 335514 B TW335514 B TW 335514B
Authority
TW
Taiwan
Prior art keywords
height
layer
crystal
forming
cumulative
Prior art date
Application number
TW086111862A
Other languages
English (en)
Inventor
Kim Yong-Chan
Original Assignee
Lg Semicon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Semicon Co Ltd filed Critical Lg Semicon Co Ltd
Application granted granted Critical
Publication of TW335514B publication Critical patent/TW335514B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8222Bipolar technology
    • H01L21/8228Complementary devices, e.g. complementary transistors
    • H01L21/82285Complementary vertical transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/082Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
    • H01L27/0823Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
    • H01L27/0826Combination of vertical complementary transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
TW086111862A 1997-04-09 1997-08-19 Method of fabricating semiconductor device TW335514B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970013071A KR100249168B1 (ko) 1997-04-09 1997-04-09 반도체소자 제조방법

Publications (1)

Publication Number Publication Date
TW335514B true TW335514B (en) 1998-07-01

Family

ID=19502314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086111862A TW335514B (en) 1997-04-09 1997-08-19 Method of fabricating semiconductor device

Country Status (5)

Country Link
US (1) US5970355A (zh)
JP (1) JP3062597B2 (zh)
KR (1) KR100249168B1 (zh)
CN (1) CN1122303C (zh)
TW (1) TW335514B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3727482B2 (ja) * 1998-06-05 2005-12-14 セイコーインスツル株式会社 半導体装置の製造方法
US7592898B1 (en) 1999-03-09 2009-09-22 Keystone Technology Solutions, Llc Wireless communication systems, interrogators and methods of communicating within a wireless communication system
JP5105830B2 (ja) * 2006-11-07 2012-12-26 新日本無線株式会社 半導体装置の製造方法
CN104282556B (zh) * 2014-06-23 2017-06-23 上海先进半导体制造股份有限公司 双极型晶体管发射极的掺杂方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2565317B2 (ja) * 1986-12-03 1996-12-18 富士通株式会社 半導体装置の製造方法
JPS6473766A (en) * 1987-09-16 1989-03-20 Oki Electric Ind Co Ltd Manufacture of semiconductor integrated circuit
WO1993016494A1 (en) * 1992-01-31 1993-08-19 Analog Devices, Inc. Complementary bipolar polysilicon emitter devices
JPH07142419A (ja) * 1993-11-15 1995-06-02 Toshiba Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
KR100249168B1 (ko) 2000-03-15
JP3062597B2 (ja) 2000-07-10
CN1122303C (zh) 2003-09-24
JPH1140573A (ja) 1999-02-12
KR19980076382A (ko) 1998-11-16
US5970355A (en) 1999-10-19
CN1195885A (zh) 1998-10-14

Similar Documents

Publication Publication Date Title
TW358992B (en) Semiconductor device and method of fabricating the same
TW330306B (en) A semiconductor substrate and its fabrication method
EP1115153A3 (en) Semiconductor substrate and process for its production
EP1069605A3 (en) Method for fabricating a semiconductor structure including a metal oxide interface with silicon
AU2003301057A1 (en) Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices
TW359008B (en) Double metal embedding
WO2002027363A3 (en) Method of bonding wafers with controlled height and associated structures
TW354430B (en) Photodiode and method for fabricating the same
WO2003019643A1 (fr) Dispositif semi-conducteur comportant un film isolant presentant une permittivite elevee et son procede de production
EP1049172A3 (en) A SOI structure semiconductor device and a fabrication method thereof
TW366596B (en) Thin-film transistor and the manufacturing method
TW335514B (en) Method of fabricating semiconductor device
TW345743B (en) Method for forming side contact of semiconductor device
WO2000052738A3 (de) Verfahren zur herstellung hochdotierter halbleiterbauelemente
TW429513B (en) Method of forming shallow trench isolation of semiconductor device
TW346666B (en) Process for producing dielectric layer in an integrated circuit
EP0391561A3 (en) Forming wells in semiconductor devices
EP0809281A3 (en) Improvements in or relating to semiconductor devices
TW346661B (en) A method for manufacturing a semiconductor device
TW335535B (en) Method of manufacturing semiconductor device
TW429512B (en) Semiconductor device and method for manufacturing the same
TW430887B (en) Method of producing polysilicon gate
TW350129B (en) Manufacturing method of semiconductor formation latches the invention relates to a manufacturing method of semiconductor formation latches
TW343383B (en) A metal contact structure of a semiconductor device and a method of fabricating the same
TW368729B (en) Manufacturing method for barrier

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees