TW334469B - Curable organosiloxane compositions and semiconductor devices - Google Patents

Curable organosiloxane compositions and semiconductor devices

Info

Publication number
TW334469B
TW334469B TW085109162A TW85109162A TW334469B TW 334469 B TW334469 B TW 334469B TW 085109162 A TW085109162 A TW 085109162A TW 85109162 A TW85109162 A TW 85109162A TW 334469 B TW334469 B TW 334469B
Authority
TW
Taiwan
Prior art keywords
curable organosiloxane
semiconductor chip
semiconductor devices
composition
organosiloxane compositions
Prior art date
Application number
TW085109162A
Other languages
English (en)
Inventor
Katsutoshi Mine
Osamu Yuami
Kazuki Nakayoshi
Rikako Tazawa
Original Assignee
Doconitele Silicon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21985995A external-priority patent/JPH0948960A/ja
Priority claimed from JP21986095A external-priority patent/JP3950490B2/ja
Application filed by Doconitele Silicon Kk filed Critical Doconitele Silicon Kk
Application granted granted Critical
Publication of TW334469B publication Critical patent/TW334469B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW085109162A 1995-08-04 1996-07-26 Curable organosiloxane compositions and semiconductor devices TW334469B (en)

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JP21985995A JPH0948960A (ja) 1995-08-04 1995-08-04 シリコーン系ダイボンディング剤および半導体装置
JP21986095A JP3950490B2 (ja) 1995-08-04 1995-08-04 導電性シリコーンゴム組成物および半導体装置

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TWI667292B (zh) * 2014-04-09 2019-08-01 日商道康寧東麗股份有限公司 硬化性有機聚矽氧烷組合物及電氣、電子零件之保護劑或接著劑組合物
CN114300365A (zh) * 2021-11-27 2022-04-08 昆山弗莱吉电子科技有限公司 铜合金引线框架的后处理工艺以及铜合金引线框架
TWI808956B (zh) * 2016-12-28 2023-07-21 日商Ａｇｃ股份有限公司 積層體、附聚矽氧樹脂層之支持基材、附聚矽氧樹脂層之樹脂基板、及電子器件之製造方法

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JPH09286971A (ja) * 1996-04-19 1997-11-04 Toray Dow Corning Silicone Co Ltd シリコーン系ダイボンディング剤、半導体装置の製造方法および半導体装置
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FR2775481B1 (fr) * 1998-02-27 2003-10-24 Rhodia Chimie Sa Composition silicone adhesive reticulable et utilisation de cette composition pour le collage de substrats divers
KR100418013B1 (ko) * 1998-07-28 2004-02-14 히다치 가세고교 가부시끼가이샤 반도체 장치 및 그 제조 방법
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US6156743A (en) * 1999-10-18 2000-12-05 Whitcomb; John E. Method of decreasing fatigue
JP2001139894A (ja) * 1999-11-15 2001-05-22 Dow Corning Toray Silicone Co Ltd シリコーン系接着性シート、および半導体装置
EP1219693B1 (en) * 2000-02-29 2006-05-03 Matsushita Electric Industrial Co., Ltd. Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
US6426552B1 (en) * 2000-05-19 2002-07-30 Micron Technology, Inc. Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
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