TW333678B - Method and apparatus for testing a semiconductor wafer - Google Patents

Method and apparatus for testing a semiconductor wafer

Info

Publication number
TW333678B
TW333678B TW086105160A TW86105160A TW333678B TW 333678 B TW333678 B TW 333678B TW 086105160 A TW086105160 A TW 086105160A TW 86105160 A TW86105160 A TW 86105160A TW 333678 B TW333678 B TW 333678B
Authority
TW
Taiwan
Prior art keywords
wafer
testing
load plate
probe
semiconductor wafer
Prior art date
Application number
TW086105160A
Other languages
English (en)
Inventor
W O Connell Richard
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW333678B publication Critical patent/TW333678B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
TW086105160A 1996-06-10 1997-04-21 Method and apparatus for testing a semiconductor wafer TW333678B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/662,739 US6166552A (en) 1996-06-10 1996-06-10 Method and apparatus for testing a semiconductor wafer

Publications (1)

Publication Number Publication Date
TW333678B true TW333678B (en) 1998-06-11

Family

ID=24658999

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086105160A TW333678B (en) 1996-06-10 1997-04-21 Method and apparatus for testing a semiconductor wafer

Country Status (5)

Country Link
US (1) US6166552A (zh)
JP (1) JPH1064963A (zh)
KR (1) KR100486396B1 (zh)
IE (1) IE80524B1 (zh)
TW (1) TW333678B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US6732053B1 (en) * 1998-09-30 2004-05-04 Intel Corporation Method and apparatus for controlling a test cell
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
US6741072B2 (en) * 2000-09-15 2004-05-25 James E. Orsillo Docking system for connecting a tester to a probe station using an A-type docking configuration
US6838868B1 (en) * 2000-11-07 2005-01-04 Teradyne, Inc. Test head actuation system with positioning and compliant modes
US6441607B1 (en) * 2000-12-01 2002-08-27 N&K Technology, Inc. Apparatus for docking a floating test stage in a terrestrial base
US6856150B2 (en) 2001-04-10 2005-02-15 Formfactor, Inc. Probe card with coplanar daughter card
US6766996B1 (en) 2001-07-16 2004-07-27 Reid-Ashman Manufacturing, Inc. Manipulator
US6570397B2 (en) 2001-08-07 2003-05-27 Agilent Technologies, Inc. Timing calibration and timing calibration verification of electronic circuit testers
TWI272392B (en) * 2002-03-22 2007-02-01 Electro Scient Ind Inc Test probe alignment apparatus
JP4548817B2 (ja) * 2002-10-18 2010-09-22 東京エレクトロン株式会社 プローブ装置
US6972571B2 (en) * 2004-03-22 2005-12-06 Freescale Semiconductor, Inc. Load board with embedded relay tracker
US7148716B2 (en) 2004-06-10 2006-12-12 Texas Instruments Incorporated System and method for the probing of a wafer
US7598725B2 (en) * 2005-12-30 2009-10-06 Teradyne, Inc. Alignment receptacle of a sensor adapted to interact with a pin to generate position data along at least two transverse axes for docking a test head
US7737708B2 (en) * 2006-05-11 2010-06-15 Johnstech International Corporation Contact for use in testing integrated circuits
US7750657B2 (en) * 2007-03-15 2010-07-06 Applied Materials Inc. Polishing head testing with movable pedestal
DE102009005182A1 (de) * 2009-01-15 2010-07-29 Suss Microtec Test Systems Gmbh Chuck und Verfahren zur Aufnahme und Halterung dünner Testsubstrate
US8872532B2 (en) * 2009-12-31 2014-10-28 Formfactor, Inc. Wafer test cassette system
TWI771805B (zh) * 2020-11-18 2022-07-21 致茂電子股份有限公司 探針頭連接方法
US11662366B2 (en) 2021-09-21 2023-05-30 International Business Machines Corporation Wafer probe with elastomer support
US11675010B1 (en) 2021-11-30 2023-06-13 International Business Machines Corporation Compliant wafer probe assembly

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4665360A (en) * 1985-03-11 1987-05-12 Eaton Corporation Docking apparatus
DE3524348A1 (de) * 1985-07-08 1987-01-29 Heigl Helmuth Vorrichtung zum positionieren von testkoepfen
JPH0746693B2 (ja) * 1986-08-20 1995-05-17 東京エレクトロン株式会社 プロ−バ装置
US4973015A (en) * 1987-09-17 1990-11-27 Schlumberger Technologies, Inc. Manipulator apparatus for test head support and orientation
US4994735A (en) * 1988-05-16 1991-02-19 Leedy Glenn J Flexible tester surface for testing integrated circuits
US5091693A (en) * 1990-07-13 1992-02-25 Schlumberger Technologies, Inc. Dual-sided test head having floating contact surfaces
JP3208734B2 (ja) * 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
EP0547251A1 (en) * 1991-12-14 1993-06-23 International Business Machines Corporation A method for testing a micro circuit
JP2963603B2 (ja) * 1993-05-31 1999-10-18 東京エレクトロン株式会社 プローブ装置のアライメント方法
US5471148A (en) * 1993-06-24 1995-11-28 Xandex, Inc. Probe card changer system and method
US5600258A (en) * 1993-09-15 1997-02-04 Intest Corporation Method and apparatus for automated docking of a test head to a device handler
US5528158A (en) * 1994-04-11 1996-06-18 Xandex, Inc. Probe card changer system and method
US5546012A (en) * 1994-04-15 1996-08-13 International Business Machines Corporation Probe card assembly having a ceramic probe card
US5534784A (en) * 1994-05-02 1996-07-09 Motorola, Inc. Method for probing a semiconductor wafer
US5982182A (en) * 1994-09-01 1999-11-09 Chiu; Michael A. Interface apparatus for automatic test equipment with positioning modules incorporating kinematic surfaces
TW273635B (zh) * 1994-09-01 1996-04-01 Aesop
US5606262A (en) * 1995-06-07 1997-02-25 Teradyne, Inc. Manipulator for automatic test equipment test head

Also Published As

Publication number Publication date
KR100486396B1 (ko) 2005-08-11
US6166552A (en) 2000-12-26
IE80524B1 (en) 1998-08-26
JPH1064963A (ja) 1998-03-06
KR980005984A (ko) 1998-03-30
IE970253A1 (en) 1997-12-17

Similar Documents

Publication Publication Date Title
TW333678B (en) Method and apparatus for testing a semiconductor wafer
JPS5661136A (en) Semiconductor test equipment
EP0841571A3 (en) Wafer level burn-in base unit substrate and assembly
EP0841568A3 (en) A method of wafer level burn-in
EP0841698A3 (en) Wafer level contact sheet and method of assembly
MY114198A (en) Ic receiving tray storage device and mounting apparatus for the same
EP0285799A3 (en) Device for the functional electric testing of wiring arrays, in particular of circuit boards
EP0841695A3 (en) High planarity, low CTE base and method of making the same
EP0202905A3 (en) Semiconductor integrated circuit (ic) including circuit elements for evaluating the ic and means for testing the circuit elements
DE3869761D1 (de) Gleichrichtereinrichtung.
MY111843A (en) Automatic testing system and method for semiconductor devices
MY134764A (en) Electronic device testing apparatus
ATE371196T1 (de) Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten
EP1045438A3 (en) Probe card for testing semiconductor device, and semiconductor device test method
MY121425A (en) Ic testing apparatus.
WO2001036990A3 (en) Wafer level interposer
KR900006789A (ko) 전자장치를 시험하는 시험장치 및 방법과 시험장치를 갖춘 반도체장치
MY131035A (en) Method and apparatus for calibration and validation of high performance dut power supplies
CH694831A5 (de) Vorrichtung zur Prüfung vereinzelter Halbleiterchips.
US5570033A (en) Spring probe BGA (ball grid array) contactor with device stop and method therefor
TW334607B (en) Method for high speed testing a semiconductor device
TW376456B (en) Semiconductor IC tester
ATE49303T1 (de) Einrichtung fuer die funktionspruefung integrierter schaltkreise.
CA2324135A1 (en) Apparatus for testing bare-chip lsi mounting board
HK1052746A1 (en) A method and a device for testing a power module

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees