MY118387A - Method for testing electronic devices attached to a leadframe. - Google Patents

Method for testing electronic devices attached to a leadframe.

Info

Publication number
MY118387A
MY118387A MYPI9403047A MY118387A MY 118387 A MY118387 A MY 118387A MY PI9403047 A MYPI9403047 A MY PI9403047A MY 118387 A MY118387 A MY 118387A
Authority
MY
Malaysia
Prior art keywords
leadframe
electronic devices
test fixture
attached
devices attached
Prior art date
Application number
Inventor
Law Yiu Kam
Simon H S She
Glenn K T Cheung
Lie Pak Soe
Ho Kwok Keung
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of MY118387A publication Critical patent/MY118387A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A METHOD FOR TESTING ELECTRONIC DEVICE (10, 12, 14) ATTACHED TO A LEADFRAME (20) INCLUDES POSITIONING MORE THAN ONE ELECTRONIC DEVICE (10, 12,14) ATTACHED TO A COMMON LEADFRAME (20) UNDERNEATH A TEST FIXTURE (50). THE TEST FIXTURE (50) THEN CONTACTS THE DEVICES (10, 12, 14) TO PERFORM AN ELECTRICAL TEST. TESTING MORE THAN ONE DEVICE AT A TIME WHILE THEY ARE ATTACHED TO A COMMON LEADFRAME GREATLY IMPROVES EFFICIENCY OF THE TESTING PROCESS. FURTHERMORE, POSITIONING THE DEVICES (10, 12, 14) BELOW THE TEST FIXTURE (50) REDUCES THE AMOUNT OF CONTAMINATION THAT MAY SETTLE ON THE TEST FIXTURE. (FIG.2)
MYPI9403047 1993-11-25 1994-11-16 Method for testing electronic devices attached to a leadframe. MY118387A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9324219A GB2285139B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a leadframe

Publications (1)

Publication Number Publication Date
MY118387A true MY118387A (en) 2004-10-30

Family

ID=10745664

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9403047 MY118387A (en) 1993-11-25 1994-11-16 Method for testing electronic devices attached to a leadframe.

Country Status (4)

Country Link
JP (1) JPH07253450A (en)
CN (1) CN1104647C (en)
GB (3) GB2285139B (en)
MY (1) MY118387A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG82566A1 (en) * 1996-10-17 2001-08-21 Motorola Inc Method and apparatus for transporting ang testing electronic devices attached to a leadframe
NL1008697C2 (en) 1998-03-25 1999-09-28 Fico Bv Test device, test assembly, method for testing and method for calibrating a test device.
WO2000004395A1 (en) * 1998-07-15 2000-01-27 Siemens Aktiengesellschaft Device for the electric testing of integrated circuits
NL1012420C2 (en) * 1999-06-23 2000-12-28 Johannes Nicolaas Peperkamp Method for measuring electronic components, in particular integrated circuits, and device for that purpose.
JP4111767B2 (en) 2002-07-26 2008-07-02 株式会社ルネサステクノロジ Manufacturing method of semiconductor device and electrical property inspection method of small element
US20080265923A1 (en) * 2007-04-27 2008-10-30 Microchip Technology Incorporated Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like
CN102565652A (en) * 2010-12-30 2012-07-11 展晶科技(深圳)有限公司 Detection device and detection method of encapsulation structure of light-emitting diode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855672A (en) * 1987-05-18 1989-08-08 Shreeve Robert W Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same
US4985988A (en) * 1989-11-03 1991-01-22 Motorola, Inc. Method for assembling, testing, and packaging integrated circuits
US5008615A (en) * 1989-11-03 1991-04-16 Motorola, Inc. Means and method for testing integrated circuits attached to a leadframe
GB2249868B (en) * 1990-11-15 1994-11-30 Sgs Thompson Microelectronics Improvements in or relating to a testing and finishing system for integrated circuit package units

Also Published As

Publication number Publication date
CN1104647C (en) 2003-04-02
GB9804054D0 (en) 1998-04-22
GB2285139A (en) 1995-06-28
JPH07253450A (en) 1995-10-03
GB9804053D0 (en) 1998-04-22
CN1106926A (en) 1995-08-16
GB2320964B (en) 1998-08-26
GB2285139B (en) 1998-06-24
GB2320964A (en) 1998-07-08
GB2320965A (en) 1998-07-08
GB2320965B (en) 1998-08-26
GB9324219D0 (en) 1994-01-12

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