TW333662B - The apparatus for cleaning semiconductor wafers - Google Patents

The apparatus for cleaning semiconductor wafers

Info

Publication number
TW333662B
TW333662B TW086105579A TW86105579A TW333662B TW 333662 B TW333662 B TW 333662B TW 086105579 A TW086105579 A TW 086105579A TW 86105579 A TW86105579 A TW 86105579A TW 333662 B TW333662 B TW 333662B
Authority
TW
Taiwan
Prior art keywords
sensor
space
chamber
semiconductor wafers
cleaning semiconductor
Prior art date
Application number
TW086105579A
Other languages
English (en)
Inventor
Tae-Chel Kang
Chang-Yong Jung
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW333662B publication Critical patent/TW333662B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW086105579A 1996-06-08 1997-04-28 The apparatus for cleaning semiconductor wafers TW333662B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960020494A KR100193733B1 (ko) 1996-06-08 1996-06-08 반도체 웨이퍼 세정장치

Publications (1)

Publication Number Publication Date
TW333662B true TW333662B (en) 1998-06-11

Family

ID=19461213

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086105579A TW333662B (en) 1996-06-08 1997-04-28 The apparatus for cleaning semiconductor wafers

Country Status (4)

Country Link
US (1) US5827986A (zh)
JP (1) JPH1055994A (zh)
KR (1) KR100193733B1 (zh)
TW (1) TW333662B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6667244B1 (en) 2000-03-24 2003-12-23 Gerald M. Cox Method for etching sidewall polymer and other residues from the surface of semiconductor devices
KR100387526B1 (ko) * 2001-02-07 2003-06-18 삼성전자주식회사 반도체 제조장비의 웨이퍼 감지 오동작 방지장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3467113A (en) * 1964-01-21 1969-09-16 Detrex Chem Ind Sight glass cleaning
JPS56125615A (en) * 1980-03-07 1981-10-02 Mitsubishi Electric Corp Outdoor instrument box
US4541277A (en) * 1983-09-23 1985-09-17 Southwire Company Self-sealing, self-cleaning sight glass
US4757255A (en) * 1986-03-03 1988-07-12 National Semiconductor Corporation Environmental box for automated wafer probing
US4872356A (en) * 1988-12-27 1989-10-10 Micron Technology Inc. Resistivity probe fixture
US5199308A (en) * 1991-01-03 1993-04-06 Betz Laboratories, Inc. Multi-functional level probe mounting device

Also Published As

Publication number Publication date
KR980005708A (ko) 1998-03-30
JPH1055994A (ja) 1998-02-24
US5827986A (en) 1998-10-27
KR100193733B1 (ko) 1999-06-15

Similar Documents

Publication Publication Date Title
DE69728438D1 (de) Vorrichtung zur pflege feuchtigkeitsempfindlicher artikel
DE69934668D1 (de) Schleusenkammer für zwei wafer für eine waferverarbeitungsvorrichtung und be- und entladeverfahren dafür
TW200737290A (en) Method of a single wafer wet/dry cleaning apparatus
GB9211892D0 (en) Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection
WO2003021642A3 (en) Method and apparatus for processing a wafer
TW376550B (en) Apparatus for and method of cleaning objects to be processed
TW366516B (en) Cleaning device for semiconductor wafers
GB2334374B (en) Process for wet etching of semiconductor wafers
EP0884764A3 (en) Cleaning and drying apparatus for objects to be processed
SG87080A1 (en) Single wafer in-situ dry clean and seasoning for plasma etching process
IL122034A0 (en) Thermal processor for semiconductor wafers
US6006767A (en) Door/sill interface for a warewasher
GB2358578B (en) Bath system for semiconductor wafers with obliquely mounted sonic transducers
TW333662B (en) The apparatus for cleaning semiconductor wafers
SG67503A1 (en) Process for etching semiconductor wafers
SG83159A1 (en) Process for the wet chemical treatment of semiconductor wafers
KR970067675A (ko) 폴리싱 장치
JPS57206046A (en) Wafer conveying device
KR20040021427A (ko) 웨이퍼 카세트의 로딩상태 확인수단을 갖는 캐리어
TW358224B (en) Chemical vapor deposition apparatus
JPH0552720A (ja) ガス検知器
WO2003030325A3 (de) Vorrichtung zur aufnahme eines versorgungsmittels an einem elektrischen gerät
RU98113040A (ru) Способ очистки поверхности полупроводников
JPH03188383A (ja) 半導体素子の加熱試験装置
KR970077465A (ko) 반도체웨이퍼 탑재용 캐리어

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees