TW330881B - The apparatus & method for shaping a polishing pad & polishing semiconductor wafers - Google Patents

The apparatus & method for shaping a polishing pad & polishing semiconductor wafers

Info

Publication number
TW330881B
TW330881B TW086103642A TW86103642A TW330881B TW 330881 B TW330881 B TW 330881B TW 086103642 A TW086103642 A TW 086103642A TW 86103642 A TW86103642 A TW 86103642A TW 330881 B TW330881 B TW 330881B
Authority
TW
Taiwan
Prior art keywords
polishing pad
polishing
shaping
pad
shaping tool
Prior art date
Application number
TW086103642A
Other languages
English (en)
Inventor
j walsh Robert
Original Assignee
Memc Electronic Materials Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials Spa filed Critical Memc Electronic Materials Spa
Application granted granted Critical
Publication of TW330881B publication Critical patent/TW330881B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW086103642A 1996-04-26 1997-03-22 The apparatus & method for shaping a polishing pad & polishing semiconductor wafers TW330881B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/639,185 US5840202A (en) 1996-04-26 1996-04-26 Apparatus and method for shaping polishing pads

Publications (1)

Publication Number Publication Date
TW330881B true TW330881B (en) 1998-05-01

Family

ID=24563073

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086103642A TW330881B (en) 1996-04-26 1997-03-22 The apparatus & method for shaping a polishing pad & polishing semiconductor wafers

Country Status (8)

Country Link
US (1) US5840202A (zh)
EP (1) EP0803327A3 (zh)
JP (1) JPH1071558A (zh)
KR (1) KR970072158A (zh)
CN (1) CN1076249C (zh)
MY (1) MY133665A (zh)
SG (1) SG55295A1 (zh)
TW (1) TW330881B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI806944B (zh) * 2018-01-09 2023-07-01 日商信越半導體股份有限公司 研磨裝置及研磨方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10235552A (ja) 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
US6120350A (en) * 1999-03-31 2000-09-19 Memc Electronic Materials, Inc. Process for reconditioning polishing pads
US6135863A (en) * 1999-04-20 2000-10-24 Memc Electronic Materials, Inc. Method of conditioning wafer polishing pads
US6293139B1 (en) * 1999-11-03 2001-09-25 Memc Electronic Materials, Inc. Method of determining performance characteristics of polishing pads
US6432823B1 (en) * 1999-11-04 2002-08-13 International Business Machines Corporation Off-concentric polishing system design
KR100383324B1 (ko) * 2000-11-24 2003-05-12 삼성전자주식회사 반도체 장치의 제조에서 연마 패드 검사 방법과 이를 수행하기 위한 검사 장치 및 이를 채용한 연마 장치.
JP4058904B2 (ja) * 2000-12-19 2008-03-12 株式会社Ｓｕｍｃｏ 研磨布のドレッシング方法、半導体ウェーハの研磨方法及び研磨装置
CN1792553B (zh) * 2005-12-30 2010-05-12 广东工业大学 抛光垫修整装置及修整方法
CN100441377C (zh) * 2006-12-05 2008-12-10 中国科学院上海光学精密机械研究所 用于环行抛光机的校正板
US20150111478A1 (en) * 2013-10-23 2015-04-23 Applied Materials, Inc. Polishing system with local area rate control
US9751189B2 (en) 2014-07-03 2017-09-05 Applied Materials, Inc. Compliant polishing pad and polishing module
CN109155249B (zh) * 2016-03-25 2023-06-23 应用材料公司 局部区域研磨系统以及用于研磨系统的研磨垫组件
CN109075054B (zh) * 2016-03-25 2023-06-09 应用材料公司 具有局部区域速率控制及振荡模式的研磨系统
CN106078413B (zh) * 2016-06-28 2018-12-25 东莞捷荣技术股份有限公司 一种平面打磨无动力辅助转动装置及打磨机
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
CN106392884B (zh) * 2016-12-14 2019-10-18 北京中电科电子装备有限公司 一种砂轮的修整控制系统及方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH640766A5 (en) * 1981-07-16 1984-01-31 Raymond Ansermoz Lapping machine
JPS59129663A (ja) * 1983-01-18 1984-07-26 Toshiba Corp ウエハラツピング装置
JPS6190868A (ja) * 1984-10-08 1986-05-09 Toshiba Corp 研磨装置
US4720938A (en) * 1986-07-31 1988-01-26 General Signal Corp. Dressing fixture
JPS63283859A (ja) * 1987-05-13 1988-11-21 Hitachi Ltd ウェハ研磨用治具
DE3926673A1 (de) * 1989-08-11 1991-02-14 Wacker Chemitronic Verfahren und vorrichtung zur poliertuchaufbereitung beim chemomechanischen polieren, insbesondere von halbleiterscheiben
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
JP3173041B2 (ja) * 1991-05-15 2001-06-04 不二越機械工業株式会社 ドレッサー付きウェハー研磨装置及びその研磨布表面のドレッシング方法
JPH05228829A (ja) * 1992-02-19 1993-09-07 Mitsubishi Materials Corp ウェーハ研磨装置
US5384986A (en) * 1992-09-24 1995-01-31 Ebara Corporation Polishing apparatus
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
JP2622069B2 (ja) * 1993-06-30 1997-06-18 三菱マテリアル株式会社 研磨布のドレッシング装置
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
JPH07299738A (ja) * 1994-05-11 1995-11-14 Mitsubishi Materials Corp ウエハ研磨装置
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
JP3637977B2 (ja) * 1995-01-19 2005-04-13 株式会社荏原製作所 ポリッシングの終点検知方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI806944B (zh) * 2018-01-09 2023-07-01 日商信越半導體股份有限公司 研磨裝置及研磨方法

Also Published As

Publication number Publication date
EP0803327A2 (en) 1997-10-29
MY133665A (en) 2007-11-30
KR970072158A (ko) 1997-11-07
SG55295A1 (en) 1998-12-21
EP0803327A3 (en) 1998-08-19
JPH1071558A (ja) 1998-03-17
CN1167667A (zh) 1997-12-17
CN1076249C (zh) 2001-12-19
US5840202A (en) 1998-11-24

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