322586 經濟部中央標準局員工消費合作衽印製 A7 B7 五、發明説明（） (1) 發明範疇： 本發明是敘述一種新穎之螢光幕製作法，特別是指陰極射 線管(CRT)或是平面顯示器的螢光赛製作得以本法完成之。 (2) 先前技術 一彩色陰極射線管(CRT)或是彩色電漿顯示器包含'一個非常 重要覆善著一層螢光粉的部位。三種不同之螢光粉通常被採用 以發出三種不同顏色，一種發藍光，一種發紅光另一種則發綠 光。塗佈的區域一般作成點狀或長條狀形成一個次圖素(8111)_ pixel) ’每一個次圖素均規貝丨j排歹，而沒有相互重疊。有一里占 非常重要的是顯示管內次圖素與次圖素之間是沒有光透過的部 位’所以一般在次圖素以外的地方用一不反射，不穿透的材料 塗佈，此材料稱爲黑矩陣(Black Matrix)。 、 塗佈螢光粉的方法有許多種，最常用的是漿料塗佈，或是 在黏著性物質上以乾粉塗佈，若是能夠在要塗佈螢光粉的區域 選擇性的形成電圖案，則螢光粉的塗佈可利用電泳法來作選擇 性的塗佈，此法就像電鍍法一樣。 同樣地，形成各種圖案黑矩陣也有許多方法。一般最常用 網印法，那是將碳黑狀之膏用網印的技術使碳黑膏通過具有細 網目的網版，並在網版上製作陰極圖案以達到圖案轉印的效 果’另一種是用微影成像的技術，利用光阻劑塗佈在黑矩陣 上’再予曝光，_影蝕刻而得到所需的圖案。應用網印的技術 具有塗佈快速，經濟效應高的優勢，但是它的解析度比較受限 制’相反的，微影技術較費時、所需費用亦較高，但是可得到 較高的解析度。 黑矩陣的厚度與解析度有密切關係，若要高解析度的要 求·，則形成的黑矩陣厚度最好就只有能夠擋掉光源厚度即可， 而不要太厚。典型的厚度在20微米左右。螢光粉塗佈後，厚度 比黑矩陣微高，並與次圖素點則稍微覆蓋黑矩陣，如此一來， 整個螢幕不是覆蓋著黑矩陣，就是螢光粉，而沒有空白處。 這種結構有一個嚴重的缺點，那就是這種幾何結構對於不 是直接由影像掃描產的電子流產生的電無法很好的處理。這些 電子可能來自撞撃螢光粉或陽極板的散射電子·，或是來自螢光 * 粉寄陽極板的二次電子。無論這些電子來源爲何，此等非影像 的電子會激發額外的螢光出來，尤其是鄰近的圖素或次圖素， 因此降低影像的忠實性。 尽紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 裝------tr----------A - . - (請先閲讀背面之注意事項再填寫本頁j 32^586 A7 B7 五、發明説明（） 解決上述問題尺(^&16等人(美專利4,325,002，1982年4月) 提出一種方法，他們提出一種先在基材製作深溝紋結構，黑矩 陣則塗佈在基材峰面(原來基材面），而螢光粉則塗佈在溝槽底 部與溫牆側面。如此一來，任何由散射或是二次電子最壞的狀 況是在溝槽內撞撃，因爲每一個溝槽包含一個次圖素，因此鄰 近圖素受電子激發的現象就不再發生。但是Kobale結構雖然可 以解決問題，然而其製作成本將非常的高。 發明的簡要說明 本發明主要目的在說明一種螢光幕的製作方法，這種方法能 消除二次電子或是散射電子造成影像扭曲或互相干擾的現象，同 時可提高螢光幕之亮度。 、進一步的目的是本製程，具有低價格之經濟效應。 另外，本發明所製出之產品與目前所製作者相比毫不遜色， 並且有過之而無不及。 本發明的i多目的之實現端賴以下的螢光幕製作流程。首先 在基板表面上形成一層比一般厚的黑矩陣(約70微米），並且刻劃 成上細下粗的形狀。這種上細下粗的形狀可應用網印技術或過度 蝕刻的方法來達成。隨後再鍍上一層透明導電膜材料如ΠΌ，在 導電膜上面應用電泳的方法再把不同的螢光粉電鏟其上而構成次 圖素。 圖示的簡要說明 圖一到圖四，爲本發明的第一個實施例之剖面示意圖。 圖五到圖八，說明本發明的第二實施例。 圖九與圖十，是應用第二實施例的各種製程到第三實施例。 發明的詳細說明 · 如前所述，黑矩陣與次圖素採用溝槽結構的螢光板對於降低 由散射電子與二次電子造成影像破壞或千擾的情形有很大的助 益。本發明即提出一些具有經濟性，不必增加比傳統製造法多太 多成本的製程以製作溝槽結構。 本紙張尺度適用中國國家標準（CNS ) A4规格（210 X 297公釐） ----------I------、訂--!„——^ (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 A7 經濟部中央標準局員工消費合作社印製 五、發明説明（） 本發明第一個實施例之示意圖可由圖一之剖面圖表示，一般 而言對於陰極射線管或是電漿顯示器而言，圖中基材料1是內面平 坦的一個表面。黑矩陣2則用低成本的網印法將碳黑膏(carbon pastr)或是矽土膏（silica paste)塗佈其上。網印的方式則選擇 能夠使黑矩陣形成如圖中所示的剖面，亦即低部較寬，頂部較窄 的結構，黑矩陣的厚度可選擇7〇微米，但是在20到15〇微米範內 的尺寸都可使用，在黑矩陣之間寬約70微米的露出部位12將被用 來作爲次圖素的地方。 參考圖二，將透明導體如ITO用濺鍍的方式塗佈到基材1與黑 矩陣2而形成一薄層3，其厚度約1000到2000A之間。然後在薄層3 上選擇件的除去而使黑矩陣局部露出如圖3中4的部位。 z導電部位是紅色(以紅色爲例)螢光粉將塗佈之處。將此結構 浸入含有約4微米大小顆粒的懸浮電解液中，應用電泳法施加一個 負電壓到前述選擇性的次圖素區域以鍍出紅色螢光粉層。施加電 壓時間約0.5分鐘就可以建立約有20微米厚的螢光粉層。 重覆應用電泳法的程序可以將其他螢光粉塗佈上去，一般有 綠色與藍色螢光粉。特別強調的是塗佈不同螢光粉的數目與次序 對於本發明不重要，均不影響其可工作性，本文敘述之紅、綠、 藍螢光粉僅作說明之用。 完成上述步驟所形成之結構如圖四所示，爲了說明方便，將 紅色螢光粉標號5，綠色標號6，而藍色則標號7。 本發明的第二實施例的製程起始點，適合作爲第一實施例的 基材，所不同的是本實施例不經過網印程序，而是形成一個連續 的膜如圖五所示。層9是一層由旋轉塗佈(spin coating)，網印或 其他相關技術塗佈的碳黑膏或是矽土膏，層9的厚度爲70微米， 但是在20到150微米間的厚度範圍均可用，在層9上覆蓋一層光阻 形成的遮罩8。遮罩能夠形成黑矩陣區域，但設計上則故意做得大 一些。層9可用氫氟酸(對砂土膏)触刻直到基材1。触刻的程序持 續到基材1表面露出而且造成層9過度蝕刻的現象，由於過度蝕刻 使得光阻遮罩下形成過陷入的現象，並且如圖六所示的黑矩陣形 成底寬頂窄的錐形。 參考圖七，用標準的方法將遮罩除去，將透明導電層(層11) 如ITO以濺鍍的方式沈積在基材1及黑矩陣10之上，其厚度在1000 與2000A之間，然後將層11選擇性的除去，黑矩陣露出部份如圖 八中的14所示。 _4 A4規格（210X297公釐） ^-------11!^--L—^ (請先閲讀背面之注意事項再填寫本頁) A7 B7 五、發明説明（） 至此製作完成的結構與圖三相同，因此第2實施例到此以後 的製程完全與上述第1實施例的製程相同。意即在層11上用電泳 的方式將不同的螢光粉，塗佈在其上，在第2實施例的最後完成步 驟所得到的結構便與第1實施例的圖4結構一樣。 第3實施例可參考圖六在於第2實施例中過度蝕刻後未除去光 遮罩8之圖。在不除去光罩下，將透明導體ITO以濺鍍或蒸鍍的方 式鍍在基材1，光罩8以及黑矩陣10的內壁。該導電層21的厚度， 約1000到2000A之間。 光阻遮罩8然後再用標準的光阻除去製程將遮罩8除去，在這 個步驟中在黑矩陣20頂部21A的部份會隨之除去，其結構如圖十 所示。在黑矩陣10面上的表面24到此完全沒有覆蓋其他物質，第 三實施例以後的製程就與前兩製程相同，意即在導電層21上進行 選擇性的電泳鍍上螢光粉，本實施例完全完成後的結構，與圖四 之結構一樣，只是本法形成之一螢光粉圖案並沒有與黑矩陣重 疊。 1_：--------私衣------、玎--!__!--.e (請先閱讀背面之注％事項再填寫本頁) 經濟部中央檩準局員工消費合作，社印製 衣紙張尺度適用中國國家標準（CNS ) M規格（210X297公釐）322586 Ministry of Economic Affairs Central Standards Bureau employee consumption cooperation printing A7 B7 V. Description of the invention () (1) The scope of the invention: This invention describes a novel method of making a fluorescent screen, especially referring to the cathode ray tube (CRT) or The production of the fluorescent game of the flat panel display can be completed by this method. (2) Prior art A color cathode ray tube (CRT) or color plasma display contains' a very important part covered with a layer of phosphor. Three different phosphors are usually used to emit three different colors, one emitting blue light, one emitting red light and the other emitting green light. The coated area is generally made into dots or strips to form a sub-pixel (8111) _pixel). Each sub-pixel is arranged regularly, without overlapping each other. It is very important to show that there is no light transmission between the sub-pixels and the sub-pixels in the tube. So it is generally coated with a non-reflective and non-penetrating material outside the sub-pixels. This material It is called Black Matrix. There are many ways to apply phosphor powder, the most commonly used is slurry coating, or dry powder coating on an adhesive substance, if it can selectively form an electrical pattern in the area where phosphor powder is to be applied Then, the coating of fluorescent powder can be selectively coated by electrophoresis, which is just like electroplating. Similarly, there are many ways to form various patterns of black matrices. Generally, the most commonly used screen printing method is to use a carbon black paste to pass the carbon black paste through a screen with fine mesh, and make a cathode pattern on the screen to achieve the effect of pattern transfer. It is a technique of imaging with lithography. It is coated on the black matrix with photoresist and then exposed to light, and etched to obtain the desired pattern. The technology of applying screen printing has the advantages of rapid coating and high economic effect, but its resolution is relatively limited. On the contrary, the lithography technology is more time-consuming and requires higher costs, but can obtain higher resolution. The thickness of the black matrix is closely related to the resolution. If a high resolution is required, the thickness of the formed black matrix should only be able to block the thickness of the light source, not too thick. Typical thickness is around 20 microns. After the phosphor is coated, the thickness is slightly higher than that of the black matrix, and the sub-pixel dots slightly cover the black matrix. In this way, the entire screen is covered with either the black matrix or the phosphor, and there is no blank space. This structure has a serious shortcoming, that is, this geometric structure cannot deal well with electricity that is not directly generated by the electron flow generated by image scanning. These electrons may come from scattered electrons that hit the fluorescent powder or the anode plate, or secondary electrons from the fluorescent * powder anode plate. Regardless of the source of these electrons, these non-image electrons will excite additional fluorescence, especially adjacent pixels or sub-pixels, thus reducing the faithfulness of the image. The Chinese National Standard (CNS) A4 specification (210X297mm) is applicable to all paper standards. ------ tr ---------- A-.-(Please read the precautions on the back before filling in this Page j 32 ^ 586 A7 B7 V. Description of invention () Solve the above problem Ruler (^ & 16 et al. (US Patent 4,325,002, April 1982) proposed a method, they proposed a method of making deep groove structure on the substrate first, The black matrix is coated on the peak surface of the substrate (the original substrate surface), and the phosphor is coated on the bottom of the trench and the side of the warm wall. In this way, any worst-case condition caused by scattering or secondary electrons is Strike in the trench, because each trench contains a sub-pixel, so the phenomenon of neighboring pixels being excited by electrons no longer occurs. However, although the Kobale structure can solve the problem, its manufacturing cost will be very high. Brief description of the invention The main purpose of the present invention is to describe a method for manufacturing a fluorescent screen, which can eliminate the phenomenon of image distortion or mutual interference caused by secondary electrons or scattered electrons, and at the same time can improve the brightness of the fluorescent screen. The purpose is this process, with a low price In addition, the products made by the present invention are inferior to those currently produced, and there are more than that. The realization of the multi-purpose of the present invention depends on the following production process of the fluorescent screen. First A thicker black matrix (approximately 70 microns) is formed on the surface of the substrate, and is scribed into an upper thin and lower thick shape. This upper thin and lower thick shape can be achieved by applying screen printing technology or over-etching methods. Then, a layer of transparent conductive film material such as ΠΌ is plated, and the electrophoresis method is applied on the conductive film, and then different phosphor powder is shoveled on it to form a sub-pixel. Brief description of the figures A schematic cross-sectional view of the first embodiment of the invention. Figures 5 to 8 illustrate the second embodiment of the present invention. Figures 9 and 10 illustrate the application of various processes of the second embodiment to the third embodiment. Explanation · As mentioned above, the fluorescent plate with groove structure in black matrix and sub-pixel is very helpful to reduce the situation of image damage or disturbance caused by scattered electrons and secondary electrons. The present invention proposes a It is economical and does not need to increase the cost of the manufacturing process to make the groove structure. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) --------- -I ------ 、 Subscribe-! „—— ^ (Please read the precautions on the back before filling out this page) A7 A7 Employee Consumer Cooperative of the Ministry of Economic Affairs Central Standards Bureau Employee Consumer Cooperative Print 5. Description of the invention () The schematic diagram of the first embodiment of the present invention can be represented by the cross-sectional view of FIG. One surface. The black matrix 2 is coated with carbon pastr or silica paste using a low-cost screen printing method. The method of screen printing is to make the black matrix form a profile as shown in the figure, that is, the structure of the lower part is wider and the top is narrower. The thickness of the black matrix can be selected from 70 microns, but in the range of 20 to 15 microns The internal dimensions can be used. The exposed part 12 with a width of about 70 microns between the black matrices will be used as the sub-pixel. Referring to Fig. 2, a transparent conductor such as ITO is applied to the substrate 1 and the black matrix 2 by sputtering to form a thin layer 3 with a thickness of about 1000 to 2000A. Then, the removal of the selective member on the thin layer 3 causes the black matrix to be partially exposed as shown in 4 in FIG. 3. z The conductive part is where red (in the case of red) phosphor powder will be applied. This structure was immersed in a suspended electrolyte containing particles of about 4 microns in size, and a negative voltage was applied to the aforementioned selective sub-pixel area by electrophoresis to deposit a red phosphor layer. A phosphor layer with a thickness of about 20 microns can be established by applying a voltage for about 0.5 minutes. Repeating the application of electrophoresis can apply other phosphors, usually green and blue phosphors. It is particularly emphasized that the number and order of coating different phosphors are not important to the present invention and do not affect their workability. The red, green, and blue phosphors described in this article are for illustrative purposes only. The structure formed by completing the above steps is shown in FIG. 4. For convenience of description, the red phosphor is labeled 5, the green is labeled 6, and the blue is labeled 7. The starting point of the process of the second embodiment of the present invention is suitable as the substrate of the first embodiment. The difference is that this embodiment does not go through the screen printing process, but forms a continuous film as shown in Figure 5. Layer 9 is a layer of carbon black paste or silica paste coated by spin coating, screen printing or other related technologies. The thickness of layer 9 is 70 microns, but the thickness ranges from 20 to 150 microns. Available, a layer 8 of photoresist is formed on the layer 9. The mask can form a black matrix area, but the design is intentionally made larger. Layer 9 can be etched up to substrate 1 with hydrofluoric acid (for sand paste). The engraving process continues until the surface of the substrate 1 is exposed and the over-etching of the layer 9 is caused. Due to the over-etching, the over-trapping phenomenon is formed under the photoresist mask, and the black matrix shown in FIG. Tapered. Referring to FIG. 7, the mask is removed by a standard method, and a transparent conductive layer (layer 11) such as ITO is deposited on the substrate 1 and the black matrix 10 by sputtering, with a thickness between 1000 and 2000 A, and then The layer 11 is selectively removed, and the exposed part of the black matrix is shown as 14 in FIG. 8. _4 A4 specification (210X297mm) ^ ------- 11! ^-L-^ (Please read the notes on the back before filling in this page) A7 B7 5. Description of invention () As in FIG. 3, the manufacturing process of the second embodiment up to this point is completely the same as the manufacturing process of the first embodiment described above. This means that different phosphors are coated on the layer 11 by electrophoresis, and the structure obtained at the last step of the second embodiment is the same as the structure of FIG. 4 of the first embodiment. In the third embodiment, reference may be made to FIG. 6 in which the photomask 8 is not removed after over-etching in the second embodiment. Without removing the photomask, the transparent conductor ITO is plated on the inner walls of the substrate 1, the photomask 8 and the black matrix 10 by sputtering or vapor deposition. The thickness of the conductive layer 21 is between about 1000 and 2000A. The photoresist mask 8 is then removed using a standard photoresist removal process. In this step, the part 21A on the top 21A of the black matrix 20 is removed. The structure is shown in FIG. The surface 24 on the surface of the black matrix 10 has not been covered with other substances at this point. The process after the third embodiment is the same as the previous two processes, which means that selective electrophoresis is applied on the conductive layer 21 with phosphor powder. The structure after the embodiment is completely completed is the same as the structure in FIG. 4 except that one phosphor pattern formed by this method does not overlap with the black matrix. 1 _: -------- private clothing --------, 玎-! __!-. E (please read the notes on the back first and then fill out this page) Employees of Central Purification Bureau of Ministry of Economic Affairs Consumption cooperation, the standard of social printing paper for garments is in accordance with Chinese National Standard (CNS) M specifications (210X297mm)