經濟部中央標準局員工消費合作社印製 322585 at _ B7 五、發明説明（） 發明背景 (1) 發明領域： 此發明創作與陰極射線管和平面顯示器之彩色螢幕及其製 作方法相關。 (2) 習知技藝： · 陰極射線管(cathode ray tube)所用之彩色螢幕基本上由許 多的小區域所構成，每一小區域均由一螢光粉層所覆蓋。通常 會使用三種可產生不同顏色的螢光粉在螢幕上，分別是可產生 藍色、紅色及綠色的螢光粉；而在螢幕上的每小區域即構成顯 示器的一個副像素(sub-pixel)，其形狀則可爲圓點狀或長條 不同的副像素區域並不相互重疊，爲了使光不會從分隔副 像素區域之間隔區間逸出，在此間隔區間常會塡充一層抗反射 及抗穿透的材質，此阻隔層被稱爲黑矩陣(black matrix)。若 製作副像素之技術夠精準到使不同區域之間隔非常小的話，則 亦可不需使用黑矩陣，雖然此緊密之沈積區域可用如光蝕刻 (photolithography)技術來達成，但也只有在此_技術具有便宜 的經濟效益時才會有其應用的重要性。 有許多不同的方法可用於沈積螢光粉層，最普遍使用之方 式是以漿料(slurry)或乾粉粒塗於一有黏性之附著層上；無論 使用何種方法，在螢光粉內之添加物如漿料內之凝聚物(binder) 或乾粉粒所用之附著層均必須在封合前被移除，如果此移除步 驟沒有完成，則這些添加材料將會在眞空內繼續逸氣並眞空效 果降低，而移除添加物較常使用的方法是將其在空氣或氧氣中 加熱。 如前所述，當對螢光粉區域需要有緊密的控制時，則光蝕 刻技術是較佳的使用方法，有一種使用方式是將一層阻擋層沈 積於一預先沈積之螢光粉層上，然後此阻擋層經過光蝕刻後形 成一個可抗拒後續蝕刻的網罩(offset printing)方式將附著層蝕 刻成互相隔離的區塊，之後使用粉塗（dusting)，沈澱 (sedimentation)或類似方的螢光粉粒即可分別塗附於區域上； 對上述的方法而言，在早期技術上已有使用一分離式的光蝕刻 網罩於製作不同螢光粉之製程上，對於三種螢光粉區域之製作 表紙張尺度適用中國國家標準（CNS ) A4規格（2丨0X297公羡） I.----^----裝---.--1訂----丨丨線 • 1 (請先閲讀背面之注意事項再填寫本頁) A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（ 若僅需使用單一的光蝕刻網罩的話，則此方法將具有很大的經 濟效益，本發明的一個重點即是提供此一製作方法。 早期之技術設計可以Modshita等人所提之方法爲例(美國 專利號碼5081394 ’ 1992年1月），此方法描述了具有黑矩陣的 彩色映像管之製作方法，在製作方法中使用了一個遮蔽網罩 (shadow mask)去定義不同螢光粉區域之位置。 發明的簡要說明 本發明的一個目標是提供一種製作陰極射線管彩色螢幕之方 法，此方法之精準度並不亞於目前一般所使用之製造方法，且其 花費可以更便宜。 本發明更進一步之目標是提供一種可同時適用於具有或不具 有黑矩陣之映像管製作方法。 上述之目標可經由使用單一光蝕刻光罩來定義多種圖案之方 式達成，此單一光罩被使用於決定不同螢光粉層所在之不同位置 區域；傳統光蝕刻f序所使用之光罩由一些完^3^或完全不透 光之圖案區域所組成，而本發明所使用之光罩則包含了並不是完 全透光亦不是完全不透光之區域，此區域具有將光線分成有灰階 之強度，在經由準確地控制曝光及顯影時間之後，被經過光罩穿 透性較強區域之光線所曝到之正光阻或負光阻可以選擇性地的被 移除，當某一部分的光阻被移除後，在其下的附著層即可露出， 此露出區域即可做爲螢光粉粒使用之區域，上述之步驟可重覆依 序地進行而使不同的螢光粉依序完成。 圖式的簡要說明 圖一至圖六爲本發明中製作彩色螢幕方法之連續步驟示意 圖。 . 發明的詳細說明 本發明設計保持了光蝕刻方式的精確性，而且由於只使用一 個光印刷光罩及一次曝光做爲形成三種(或更多)不同副像素區域 之用，因而降低了此光蝕刻方式的成本。 浪尺度適用中國國家標準（CNS ) A4規格（2丨0X297公釐） I:--------裝------1 訂----：--線 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 322585 A7 B7 五、發明説明（） 依圖一所示，製作程序從準一具有適合表面的基板1(通常爲 玻璃)開始，此表面通常爲陰極射線管面板的內層表面，在表面上 可選擇性地鍍上一層如氧化銦錫(indium-tin-oxide)的透明導體， 之後沈積一層黑色不透光的材料於此表面上，此不透光層經顯影 蝕刻後形成黑矩陣2，其示意圖如圖一所示。 在黑矩陣形成之後，再沈積一層樹脂類(例如acrylic resin)之 附著材料3，此附著材料覆蓋住基板表面和黑矩陣，形成附著層較 佳之方法可用旋轉覆蓋(spin coating)或疊合(laminating)之方式， 而其它可製作出約l〇um至50um均勻層之方法亦可使用，上完附 著層之後，再以旋轉覆蓋或疊合之方式覆上一層樹脂類(例如 Novolac resin)的正光阻4，並得到如圖二之結構。 正光阻具有曝光顯影之特性，在未受到適合的光源(通常爲近 紫外光)曝照之前並不會溶於顯影液中(顯影液爲如氫氧化鈉之類 的溶液），而在曝照之後則可溶解於顯影液中，光阻溶解度的增加 與否並不是依據曝光的有無來決定，而是依據曝光時間的增加而 增加(此時間爲在一最低感應週期後所接續之時間），因此，對一 接受短時間曝光之光阻其所需完成顯影(即溶解)之時間比起接受 較長時間曝光之光阻要長。 傳統上光蝕刻程序所使用之光罩由一些完全可透光或完全不 透光之圖形區域所構成，而在本發明中所使用之光罩則包含了不 是完全透光亦不是完全不透光之區域。換句話說，即是具有將光 線分成有灰階強度的區域。 一般來說，以本發明中製作每一丕風的_螢光粉層而言，其在 光罩均有一特定的光線強虔';，因此，普遍來說，除了完全不透光 之區域外，在光罩上則需要三種不同的光線強度之區域以配合三 種不同的螢光粉，此3¾¾線強度我們將其標示爲完全g光(fully transparent)、重度透朵（largely transparent)、及輕微透光 (Slightly transparent).，此三種特別的分類等效於下歹丨J之穿透率： 完全透光可穿透1〇〇%的入射光 _ 重度透光可穿透約60%至7〇%之入射光 輕微光可穿透約30%至40%之入射光 參照圖三所示，正光阻層4經由一光罩(未繪出)而受到適合的 光量曝光，曝光的時間週期約控制在半分鐘至一分鐘之間，在此 條件下，被光罩上完全透光區域所曝照到的光阻區域5變成了具可 溶性，而受到光罩其它部分曝照的光阻1 2在此時僅具輕微的溶解 ： 裝---；----訂------線 (請先閱讀背面之注意事項再填寫本頁) 1 2 本紙張尺度適用中國國家標準（CNS ) A1規格（210X297公釐） A7 B7 經濟部中央標準局員工消費合作杜印製 五、發明説明（） 度；若精細地控制顯影時間’例如介於一分鐘和一分半之間，則 #阻5區域可被溶解移除且留下光阻4之區域，其結果如圖三所 不0 光阻區域5之移除使得其下的附著層3露出，露出區域即是三 種不同螢光粉中之第一種(例如紅色，亦轉其它顔色)所要沈積之 區域，要將螢光粉沈檟於區域表面上可使角許多標準的方法，這 些方法包括粉塗法，即經由適合的噴嘴將螢光粉粒吹塗於附著層 表面上，或沈澱法，即經由在凝態流體中懸浮的螢光粉沈澱而 成；無論是使用何種方法，特別重要的地方在於螢光粉粒對附著 層3的附著性要好但同時不能附著於光阻層4上，以便接著將未與 附著層3附著之螢光粉粒吹走；在選擇性的沈積紅色螢光粉層6(舉 例來說)之後，其結構將如圖四所示。. 螢光粉層6製作完成之後，此一結構直接再做顯影，在細心控 制顯影時間(約介於一分鐘至一分半之間)下，剩餘之光阻層4在重 度透光區之光阻，將可選擇性地被去除且露出第二種螢光粉(例如 綠色)黏附之附著層3區域，此第二種螢光粉(圖五中標示爲7)則依 製作第一種螢光粉層同樣之方法製作於附著區域表面上。 相同的步驟重覆一遍之後即可製作最後一種螢光粉層(例如藍 色，圖五中標示爲8)，完成後之整體結構將如圖五所示，如同前 面之方法，此結構直接再做顯影，而顯影時間約介於一分鐘至一 分半之間，在此條件下，剩餘之光阻層4在輕微光穿透區之光阻被 去除。 製作至此步驟時，可選擇性地鍍上一層乳狀物之釉料 (lacquer，例如acryl emulsion)，此釉料層之功能是使表面平坦化 以使下一步驟之薄鋁層(厚度約15〇〇Α之間)蒸鍍在此表面上時得到 較好的功效，此鋁層是爲撞撃電子的陽極；最後，所有可能會逸 氣的物質，特別是附著材料、漿料凝結物(若有使用的話)和釉 料，均經由在空氣或氧氣中之燒結而去除，此燒結是在約450度 至470度之溫度下持續60分鐘至120分鐘而完成，最後的結果如圖 六戶斤示。 本發明的第二個特色是可以不需使用黑矩陣，在縮小製造成 本是第一考慮以及顯示器之對比有些微損失(肇因於無黑矩陣)尙 可容忍之情況下，本發明之方法即可應用於無黑矩陣顯示器螢幕 之製作，而其製作程序與前面所述含有黑矩陣結構之製作方式是 相同的。 ___5____ 尺度適用"中國國家標準（CNS ) A4規格（210X297公麥1 " ： 裝---^---.—訂------線 (請先閱讀背面之注意事項再填寫本頁)Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 322585 at _ B7 V. Description of the invention () Background of the invention (1) Field of invention: This invention is related to the color screen of the cathode ray tube and the flat panel display and the manufacturing method thereof. (2) Known skills: · The color screen used in a cathode ray tube is basically composed of many small areas, each of which is covered by a layer of phosphor powder. Generally, three kinds of phosphors that can produce different colors are used on the screen, which can produce blue, red, and green phosphors; and each small area on the screen constitutes a sub-pixel of the display (sub-pixel ), The shape can be dot-shaped or long sub-pixel areas do not overlap each other. In order to prevent light from escaping from the interval between sub-pixel areas, this interval is often filled with a layer of anti-reflection and A barrier-resistant material, this barrier layer is called a black matrix. If the technology of making sub-pixels is accurate enough to make the distance between different areas very small, then no black matrix is needed. Although this tightly deposited area can be achieved by using photolithography technology, it is only here. Only when it has cheap economic benefits will it have the importance of its application. There are many different methods for depositing the phosphor layer. The most commonly used method is to apply a slurry or dry powder particles to a sticky adhesive layer; no matter what method is used, in the phosphor The additives such as binders in the slurry or the adhesive layer used for dry powder must be removed before sealing. If this removal step is not completed, these additives will continue to escape in the void The effect of parallel voiding is reduced, and the more commonly used method of removing additives is to heat it in air or oxygen. As mentioned earlier, when tight control of the phosphor area is required, photoetching is the preferred method of use. One method of use is to deposit a barrier layer on a pre-deposited phosphor layer. The barrier layer is then photoetched to form an offset printing method that resists subsequent etching. The adhesion layer is etched into blocks that are isolated from each other, and then dusting, sedimentation, or the like is used. The powder particles can be applied to the areas separately. For the above method, in the early technology, a separate photo-etching screen has been used in the process of making different phosphors. For three phosphor areas The scale of the table paper is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 0X297 public envy) I .---- ^ ---- installation ---.-- 1 order ---- 丨 丨 line • 1 (Please read the precautions on the back before filling out this page) A7 B7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Invention Instructions (If only a single photoetched net cover is needed, this method will have a great Economic benefit, an important point of the invention This production method is provided. Early technical design can take the method proposed by Modshita et al. As an example (US Patent No. 5081394 'January 1992). This method describes the production method of a color picture tube with a black matrix. A shadow mask is used in the method to define the location of different phosphor regions. Brief description of the invention An object of the present invention is to provide a method for making a cathode ray tube color screen, the accuracy of this method is not It is less than the current commonly used manufacturing method, and its cost can be cheaper. A further object of the present invention is to provide a method for manufacturing a picture tube that can be used with or without a black matrix at the same time. The above goal can be achieved by using a single light Etching the photomask to define multiple patterns is achieved. This single photomask is used to determine the different locations of different phosphor layers; the photomask used in the traditional photo-etching f sequence is completely opaque or completely opaque. The pattern area of light is composed of, and the mask used in the present invention includes not completely transparent or not completely The area of light, this area has the intensity of dividing the light into gray scales. After accurately controlling the exposure and development time, the positive or negative photoresist exposed to the light passing through the area with strong penetration of the mask can be It is selectively removed. When a part of the photoresist is removed, the adhesion layer under it can be exposed. The exposed area can be used as the area for the phosphor particles. The above steps can be repeated It is carried out in order to complete different phosphors in sequence. Brief description of the drawings Figures 1 to 6 are schematic diagrams of the successive steps of the method of making a color screen in the present invention. Detailed description of the invention The design of the present invention maintains the photoetching method Accuracy, and because only one photoprinted mask and one exposure are used to form three (or more) different sub-pixel regions, the cost of this photo-etching method is reduced. The wave scale is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 0X297mm) I: -------- installed ------ 1 order ----:-line (please read the back first Please pay attention to this page and then fill out this page) Printed 322585 A7 B7 by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Description of the invention () As shown in Figure 1, the production process starts from a substrate 1 (usually glass) with a suitable surface This surface is usually the inner surface of the cathode ray tube panel. A transparent conductor such as indium-tin-oxide can be selectively plated on the surface, and then a layer of black opaque material is deposited here On the surface, this opaque layer is developed and etched to form a black matrix 2, the schematic diagram of which is shown in FIG. After the formation of the black matrix, a layer of resin (such as acrylic resin) adhesion material 3 is deposited. This adhesion material covers the surface of the substrate and the black matrix. The preferred method for forming the adhesion layer can be spin coating or laminating. ) Method, and other methods that can produce a uniform layer of about 10um to 50um can also be used. After the adhesion layer is applied, a layer of resin (such as Novolac resin) is covered with positive light by spin coating or lamination. Resistance 4, and get the structure shown in Figure 2. Positive photoresist has the characteristics of exposure and development, and will not dissolve in the developing solution (the developing solution is a solution such as sodium hydroxide) before being exposed to a suitable light source (usually near ultraviolet light), but after exposure It can be dissolved in the developer. The increase in the solubility of the photoresist is not determined by the presence or absence of exposure, but by the increase of the exposure time (this time is the time after a minimum induction period), so For a photoresist that accepts a short time exposure, the time required to complete development (ie, dissolution) is longer than a photoresist that accepts a longer time exposure. Traditionally, the photomask used in the photoetching process is composed of some completely transparent or completely opaque graphic areas, and the photomask used in the present invention includes neither completely transparent nor completely opaque. Of the area. In other words, it has areas that divide the light into gray-scale intensity. Generally speaking, as far as the _phosphor powder layer made in the present invention is concerned, it has a specific light intensity in the reticle; therefore, generally speaking, except for completely opaque areas , On the photomask, three different light intensity areas are needed to match three different phosphors. This 3¾¾ line intensity is labeled as fully transparent, fully transparent, and slightly light. Light transmission (Slightly transparent). These three special classifications are equivalent to the penetration rate of the following: J. Complete light transmission can penetrate 100% of incident light _ heavy light transmission can penetrate about 60% to 7 〇% of the incident light is slightly light and can penetrate about 30% to 40% of the incident light. Referring to FIG. 3, the positive photoresist layer 4 is exposed to a suitable amount of light through a photomask (not shown). Control between half a minute and one minute, under this condition, the photoresist area 5 exposed by the completely transparent area of the photomask becomes soluble, and the photoresist exposed by other parts of the photomask 1 2 At this time there is only a slight dissolution: install ---; --- order --- line (please read first (Please fill in this page for more details) 1 2 The paper size is in accordance with Chinese National Standard (CNS) A1 (210X297mm) A7 B7 Centralized Bureau of Ministry of Economic Affairs Employee consumption cooperation du printing 5. Invention description () degree; if Finely control the development time, for example, between one minute and one and a half, the #resistance 5 area can be dissolved and removed and the area of the photoresist 4 is left. The result is as shown in FIG. 3. The photoresist area 5 After removing, the adhesion layer 3 underneath is exposed, and the exposed area is the area where the first of three different phosphors (such as red and other colors) are to be deposited. The phosphor should be deposited on the surface of the area Many standard methods can be used. These methods include powder coating, that is, blowing phosphor particles onto the surface of the adhesion layer through a suitable nozzle, or precipitation, that is, precipitation of phosphor powder suspended in a condensed fluid No matter what method is used, the most important thing is that the phosphor powder has good adhesion to the adhesion layer 3 but cannot be attached to the photoresist layer 4 at the same time, so that the fluorescent light that is not attached to the adhesion layer 3 can then be attached. Blown away After the red phosphor layer 6 (for example) is deposited, the structure will be as shown in Fig. 4. . After the phosphor layer 6 is completed, this structure is directly developed. Under careful control of the development time (about one minute to one and a half), the remaining photoresist layer 4 is in the heavily transmissive area. The photoresist will be selectively removed and expose the area of the adhesion layer 3 to which the second phosphor (for example, green) adheres. The second phosphor (marked as 7 in Figure 5) is made according to the first The phosphor layer is made on the surface of the attachment area in the same way. After repeating the same steps again, the final phosphor layer can be made (for example, blue, marked as 8 in Figure 5). The completed overall structure will be as shown in Figure 5, just like the previous method, this structure is directly Development is carried out, and the development time is between about one minute and one and a half minutes. Under this condition, the remaining photoresist layer 4 is removed in the light transmission region. At the time of this step, a layer of lacquer (such as acryl emulsion) can be selectively plated. The function of this glaze layer is to flatten the surface to make the next step of the thin aluminum layer (thickness about 15) 〇〇Α) vapor deposition on this surface to get better efficiency, this aluminum layer is an anode for knocking electrons; Finally, all substances that may outgas, especially adhesion materials, slurry condensate ( If used) and glaze are removed by sintering in air or oxygen. This sintering is completed at a temperature of about 450 degrees to 470 degrees for 60 minutes to 120 minutes. The final result is shown in Figure 6 Jin Shi. The second feature of the present invention is that it is not necessary to use a black matrix. When reducing the manufacturing cost is the first consideration and there is a slight loss in the contrast of the display (due to the lack of black matrix), the method of the present invention is It can be applied to the production of black matrix-free display screens, and the production process is the same as the production method with black matrix structure described above. ___5____ Standards are applicable " Chinese National Standard (CNS) A4 specification (210X297 rye 1 ": Packing --- ^ ---.-- order ------ line (please read the precautions on the back before filling in this page)