KR20000044617A - Fabrication method of back panel for pdp - Google Patents

Abstract

PURPOSE: A fabrication method of back panel for PDP(Plasma Display Panel) is provided to easily align address electrodes and barrier ribs and enhance the reflection efficiency of white dielectric without adding reflective substance by forming the barrier ribs without coating the white dielectric after forming the address electrodes and forming the white dielectric between the barrier ribs. CONSTITUTION: A fabrication method of back panel for PDP comprises: a first step forming address electrodes on the back plate; a second step forming barrier ribs on the back substrate; a third step forming white dielectric between the barrier ribs; and a forth step phosphor between the barrier ribs which the white dielectric is formed on.

Description

Manufacturing method of back plate of plasma display panel

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to plasma display panel (PDP) technology, and more particularly to a method for manufacturing a back panel of a plasma display panel.

PDP is a device that displays characters or images by using light emitted from plasma generated during gas discharge, and is also called a gas discharge display device. PDP is largely exposed to direct plasma because the electrode used to apply external voltage to form plasma is directly exposed because the direct current (DC) type and conduction current flowing through the electrode are covered with dielectric. Therefore, it is classified into AC type through which displacement current flows. In addition, according to the electrode structure of the discharge cell, it is classified into a counter discharge type, a surface discharge type, a barrier discharge type, and the like. In the case of directly using the visible light emitted from the discharge gas, it is mostly used in a monochromatic display PDP device. There is a PDP using orange color, and when full color display is required, ultraviolet light emitted from discharge gas such as Kr or Xe excites red (R), green (G) and blue (B) phosphors. Visible light is used. However, there are still problems such as low brightness and contrast ratio, high driving voltage, low power consumption efficiency, and low manufacturing yield due to the difficulty in manufacturing process technology due to large size. I have a problem to do.

1 is a cross-sectional view of a back plate of a general PDP, in which a back electrode of the PDP is provided with an address electrode 11 and a white dielectric 12 covering the upper surface of the PDP. Phosphors R, G, and B 14 provided between the partition wall 13 and the partition wall 13 are disposed.

2 is a flowchart illustrating a process of manufacturing the back plate illustrated in FIG. 1. Hereinafter, a conventional back plate manufacturing process will be described with reference to FIGS. 1 and 2.

In the conventional back plate manufacturing process, first, an address electrode 11 is formed on a glass substrate 10 by using a screen print method, a FODEL method, etc. (210), and then a baking process is performed. The white dielectric material 12 is applied to the wafer 220 (220), and the firing process is performed.

Next, the partition 13 is formed 230 using a screen printing method, a photo-filling method, a sand blast method, a press method, or the like, and the firing process is performed.

Subsequently, phosphors R, G, and B are applied between the partition walls 13 (240). Thereafter, a calcination process is performed (250).

However, such a conventional back plate manufacturing technique causes the glass substrate 10 to be deformed during the address electrode 11 firing process and the white dielectric 12 firing process. 11) and misalignment of the partition 13 occurs, resulting in a non-uniformity of discharge voltage, thereby lowering the reliability of the PDP.

In addition, the white dielectric 12 serves to protect the electrode and to effectively reflect light generated during gas discharge, and usually contains a large amount of reflective material to improve reflection characteristics. However, there has been a problem that the addition of such a reflective material makes the film porous and loses its original dielectric properties.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a back plate of a plasma display panel which facilitates alignment of address electrodes and partition walls and increases reflection efficiency of a white dielectric without adding a reflective material.

1 is a cross-sectional configuration diagram of a back plate of a general PDP.

2 is a process flow chart for manufacturing the back plate shown in FIG.

Figure 3 is a cross-sectional view of the back plate of the PDP produced according to an embodiment of the present invention.

Figure 4 is a flow chart of the back plate manufacturing process of the PDP according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

30: glass substrate

31: address electrode

32: barrier rib

33: white dielectric

34: phosphor

In order to solve the problem of misalignment between the address electrode and the barrier rib, the barrier rib is directly formed without coating a white dielectric material after forming the address electrode. Subsequently, after the barrier rib is fired, a white dielectric is formed between the barrier ribs so that the white dielectric is also applied to the side surfaces of the barrier ribs, thereby securing a large reflection area, thereby obtaining a PDP luminance improvement effect. At this time, the process of forming the white dielectric is performed in the same manner as the method of forming the phosphor.

In order to achieve the above technical problem, there is provided a method of manufacturing a back plate of a characteristic plasma display panel, the method comprising: forming an address electrode on an upper side of a back substrate; A second step of forming a partition on the rear substrate; Forming a white dielectric between the barrier ribs; And a fourth step of forming a phosphor between the partition walls on which the white dielectric is formed.

Hereinafter, preferred embodiments of the present invention will be introduced in order to enable those skilled in the art to more easily carry out the present invention.

3 is a cross-sectional view of a back plate of a PDP manufactured according to an embodiment of the present invention. An address electrode 31 and a partition wall 32 are disposed on a glass substrate 30, and between partition walls. The white dielectric 33 is disposed, and the phosphor 34 is disposed on the surface of the white dielectric 33.

4 is a flowchart illustrating a process of manufacturing a back plate of a PDP according to an embodiment of the present invention, which will be described below with reference to FIGS. 3 and 4.

In the process of manufacturing the back plate of the PDP according to the present embodiment, first, an address electrode 31 is formed on the glass substrate 30 (410). In this case, when the electrode is formed by the printing method, since the electrode may be peeled or damaged during the subsequent formation of the barrier rib, the electrode must be subjected to the firing process. In this case, since the firing process can be omitted, the electrode and the partition wall can be accurately aligned.

Next, the partition wall 32 is formed (420). Formation of the partition wall 32 may be any conventional screen printing method, photo filling method, sand blasting method, pressing method, etc. The partition wall 32 formed as described above is not formed through a white dielectric as a conventional glass substrate ( Since it is formed on 30, the height deviation is excellent, and the alignment characteristic with the address electrode 31 is improved. Thereafter, the firing step is performed.

Subsequently, a white dielectric 33 is formed between the partition wall 32 and the partition wall 32 (430). At this time, the white dielectric 33 is formed on the sidewall of the partition wall 32 using a printing method or the like as in the conventional phosphor formation method, so that the reflection area is greatly increased to improve the brightness of the PDP. Thereafter, the firing step is performed.

Subsequently, phosphors R, G, and B 34 are applied between the partition walls 32 by a conventional method (440). At this time, since the white dielectric 33 makes the inclination of the side wall of the partition 32 more gentle, it is easier to apply the phosphor 34 to the side wall of the partition 32 than in the prior art, and the entire dielectric can be evenly applied.

Finally, a firing process is performed (450).

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes can be made in the art without departing from the technical spirit of the present invention. It will be apparent to those of ordinary knowledge.

The present invention described above can improve the degree of alignment between the address electrode and the partition wall, thereby improving the uniformity of the discharge voltage. In addition, since the present invention also applies a white dielectric to the side surface of the partition wall, there is an effect of improving the luminance by increasing the reflection area, and also has the effect of uniformly applying the phosphor.

Claims (5)

A first step of forming an address electrode on the rear substrate; A second step of forming a partition on the rear substrate; Forming a white dielectric between the barrier ribs; And A fourth step of forming a phosphor between the barrier ribs on which the white dielectric is formed Back plate manufacturing method of the plasma display panel comprising a. The method of claim 1, After performing the second step, And a fifth step of carrying out the firing process. The method according to claim 1 or 2, The white dielectric, A method of manufacturing a back plate of a plasma display panel, which is formed using a printing method. The method according to claim 1 or 2, The first step, A sixth step of depositing an electrode material film using the thin film deposition method; And a seventh step of patterning the material layer. The method of claim 4, wherein The material film, A Cr / Cu / Cr film is a back plate manufacturing method of a plasma display panel.