KR20010004160A - Method for fabricating back panel of plasma display panel - Google Patents

Abstract

PURPOSE: A method for manufacturing a back panel for a plasma display panel is provided to prevent a partition and mis-aligning of an address electrode by transforming a glass board in a manufacturing progress of forming the address electrode. CONSTITUTION: A method for manufacturing a back panel for a plasma display panel includes a few stages. In the first stage the address electrode(11) is formed on the whole surface of the glass board(10). In the second stage the positive photoresist(12) is formed on the whole structure. In the third stage, the back panel of the positive photoresist(12) is exposed by the light with using the address electrode(11) as a mask. In the fourth stage a pattern of the photoresist(12) is formed by developing the positive photoresist(12). In the fifth stage the partition materials(13) are reclaimed on the place made by the patterned photoresist(12).

Description

Method for fabricating back panel of plasma display panel {Method for fabricating back panel of plasma display panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (PDP) manufacturing technology, and more particularly, to a method for manufacturing a back panel of a plasma display panel.

PDP is a device that displays characters or images by using light emitted from plasma generated during gas discharge, and is also called a gas discharge display device. PDP is largely exposed to direct plasma because the electrode used to apply external voltage to form plasma is directly exposed because the direct current (DC) type and conduction current flowing through the electrode are covered with dielectric. Therefore, it is classified into AC type through which displacement current flows. In addition, according to the electrode structure of the discharge cell, it is classified into a counter discharge type, a surface discharge type, a barrier discharge type, and the like. In the case of directly using the visible light emitted from the discharge gas, it is mostly used in a monochromatic display PDP device. There is a PDP using orange color, and when full color display is required, ultraviolet light emitted from discharge gas such as Kr or Xe excites red (R), green (G) and blue (B) phosphors. Visible light is used. Among various flat panel displays, PDP is attracting attention as a display device that can realize a large screen, but it is still produced due to low brightness and contrast ratio, high driving voltage, low power consumption efficiency, and difficult manufacturing process technology due to large size. There is a problem that the yield is low, there is a problem that the low price should be made in addition to the improvement of the above characteristics.

In the case of the surface discharge type AC PDP which is currently mainstream, a transparent electrode, a bus electrode, a transparent dielectric, a dielectric protective film, and a black stripe are formed on the front plate, and an address electrode, a white dielectric, a partition wall, etc. are formed on the back plate. Is formed. Phosphors for realizing color in the PDP are formed on the front plate for the transmissive type and on the back plate for the reflective type. In the back plate of the PDP having such a configuration, the address electrode must be located exactly between the partition walls and the partition walls to easily obtain discharge of a desired cell.

However, deformation of the glass substrate is caused by a thermal process including a firing process in forming the address electrode, which causes the alignment of the address electrode and the partition wall to become an important issue. Moreover, in accordance with the trend toward larger glass substrates and higher resolution, such barrier and electrode alignment problems may cause more problems in the manufacture of large-size high-definition PDPs in the future.

It is an object of the present invention to provide a method for manufacturing a back plate of a plasma display panel which can prevent misalignment of partition walls and address electrodes caused by deformation of a glass substrate.

1 to 7 is a manufacturing process of the back plate of the surface discharge AC PDP according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

10: glass substrate

11: address electrode

12: photoresist

13: bulkhead material

13a: bulkhead

14: white dielectric

15: phosphor

According to the present invention, after the address electrode is formed on the entire surface of the glass substrate, a space pattern for forming the partition wall is formed through the back exposure using the address electrode as the exposure mask while the photoresist is applied on the entire surface, and the partition material is formed in the pattern. It is a technique to prevent the misalignment of the partition wall and the address electrode due to the deformation of the glass substrate accompanying the firing process at the time of forming the address electrode.

According to another aspect of the present invention, there is provided a method of manufacturing a back plate of a plasma display panel, the method including: forming an address electrode on a front surface of a glass substrate; A second step of forming a positive photoresist on the entire structure after performing the first step; A third step of back exposing the positive photoresist using the address electrode as a mask; Developing a positive photoresist to form a photoresist pattern; A fifth step of embedding a barrier material in a space formed by the photoresist pattern; And a sixth step of carrying out the firing process.

Also, in the sixth step, it is preferable to remove the photoresist pattern.

Hereinafter, preferred embodiments of the present invention will be introduced in order to enable those skilled in the art to more easily carry out the present invention.

1 to 7 illustrate a back plate manufacturing process of a surface discharge type AC PDP according to an embodiment of the present invention, which will be described with reference to the following.

In the process according to the present embodiment, first, as shown in FIG. 1, the address electrode 11 is formed on one surface of the glass substrate 10 for the back plate. In this case, all previously published methods such as a printing method, a photo method, and a thin film deposition method may be applied to form the address electrode 11.

Next, as shown in FIG. 2, the photoresist 12 is coated on the entire structure of the glass substrate 20 on which the address electrode 11 is formed. The photoresist 12 uses a positive type and may be used without distinguishing a liquid resist or a dry film resist (DFR). In addition, the thickness of the photoresist 12 is determined in consideration of the height of the partition wall to be formed. That is, the thickness of the photoresist 12 is formed at least to reach the height of the partition wall.

Next, as shown in FIG. 3, back exposure is performed using the address electrode 11 as a mask. That is, exposure is performed on the back side of the glass substrate 10. At this time, in performing the exposure, the exposure time is set smaller than the reference time so that the underexposure is performed.

Next, as shown in FIG. 4, development is performed to pattern the photoresist 12. At this time, the patterned photoresist 12 overlaps the partition wall 11 constantly, and because the underexposure is performed during exposure, the patterned photoresist 12 overlaps with a larger line width than the partition wall. The application, exposure, and development of the photoresist 12 illustrated in FIGS. 2 to 4 may be performed in various ways in consideration of the height of the partition wall. That is, the coating may be carried out several times, the exposure and the development may proceed, and the coating / exposure / developing may be repeatedly performed several times.

Subsequently, the partition material 13 is filled in the space created by the patterned photoresist 12 as shown in FIG. The method of filling the partition material 13 can also use all possible methods.

Subsequently, as shown in FIG. 6, baking is performed at a predetermined temperature or more to remove the remaining photoresist 12 and to form a partition 13a.

Next, as shown in FIG. 7, the white dielectric 14 and the phosphors (R, G, B) 15 are formed to complete a back plate manufacturing process. In the case of the transmission type, the phosphor 15 is formed on the front plate.

As the above process proceeds, the address electrode 11 is used as the exposure mask to form the partition 13a as shown in FIG. Therefore, even if the glass substrate 10 is deformed by performing the firing process after the address electrode 11 is formed, it does not cause a big problem.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes can be made in the art without departing from the technical spirit of the present invention. It will be apparent to those of ordinary knowledge.

The present invention described above has an effect of preventing misalignment of barrier ribs and address electrodes due to deformation of the glass substrate accompanying the firing process when forming the address electrode, thereby enabling the production of high resolution PDP, and screen forming barrier ribs. Since no mask is required, the production cost can be reduced and the defect rate can be reduced.

Claims (4)

A first step of forming an address electrode on the front surface of the glass substrate; A second step of forming a positive photoresist on the entire structure after performing the first step; A third step of back exposing the positive photoresist using the address electrode as a mask; Developing a positive photoresist to form a photoresist pattern; A fifth step of embedding a barrier material in a space formed by the photoresist pattern; And Sixth step of carrying out the firing process Back plate manufacturing method of the plasma display panel comprising a. The method of claim 1, After performing the sixth step, A seventh step of forming a white dielectric in the partition wall; And an eighth step of applying a phosphor in the partition wall in which the white dielectric is formed. The method of claim 1, In the sixth step, And the photoresist pattern is removed. The method according to claim 1 or 3, In the second step, The thickness of the photoresist is at least the height of the partition wall manufacturing method of the back plate of the plasma display panel.