KR20010004157A - Method for fabricating back panel of plasma display panel - Google Patents

Abstract

PURPOSE: A method for manufacturing a back panel of a plasma display panel is provided to prevent a misalign between a barrier rib and an address electrode and to prevent damage of the address electrode without forming an additional protection layer during the barrier rib forming process using a sandblast method. CONSTITUTION: A method for manufacturing a back panel of a plasma display panel comprises the following steps. The first step is to form a barrier rib(11) on one surface of a glass substrate(10) by using a sandblast method, a screen print method, an additive method or a press method. The second step is to form a positive photoresist on the other surface of the glass substrate(10). The third step is to expose the positive photoresist by using the barrier rib as a mask. The fourth step is to form a trench of a predetermined depth by etching the glass substrate(10). The fifth step is to fill an electrode material(13) for an address electrode into the trench and remove the photoresist. Therefore, the address electrode is not damaged because it is positioned under the barrier rib(11) and an additional address electrode protection layer is unnecessary. A misalign between the barrier rib(11) and the address electrode can be prevented because the barrier rib(11) is used as the exposing mask during the address electrode forming process.

Description

Method for fabricating back panel of plasma display panel {Method for fabricating back panel of plasma display panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (PDP) manufacturing technology, and more particularly, to a method for manufacturing a back panel of a plasma display panel.

PDP is a device that displays characters or images by using light emitted from plasma generated during gas discharge, and is also called a gas discharge display device. PDP is largely exposed to direct plasma because the electrode used to apply external voltage to form plasma is directly exposed because the direct current (DC) type and conduction current flowing through the electrode are covered with dielectric. Therefore, it is classified into AC type through which displacement current flows. In addition, according to the electrode structure of the discharge cell, it is classified into a counter discharge type, a surface discharge type, a barrier discharge type, and the like. In the case of directly using the visible light emitted from the discharge gas, it is mostly used in a monochromatic display PDP device. There is a PDP using orange color, and when full color display is required, ultraviolet light emitted from discharge gas such as Kr or Xe excites red (R), green (G) and blue (B) phosphors. Visible light is used. Among various flat panel displays, PDP is attracting attention as a display device that can realize a large screen, but it is still produced due to low brightness and contrast ratio, high driving voltage, low power consumption efficiency, and difficult manufacturing process technology due to large size. There is a problem that the yield is low, there is a problem that the low price should be made in addition to the improvement of the above characteristics.

In the case of the surface discharge type AC PDP which is currently mainstream, a transparent electrode, a bus electrode, a transparent dielectric, a dielectric protective film, and a black stripe are formed on the front plate, and an address electrode, a white dielectric, a partition wall, etc. are formed on the back plate. Is formed. Phosphors for realizing color in the PDP are formed on the front plate for the transmissive type and on the back plate for the reflective type. In the back plate of the PDP having such a configuration, the address electrode must be located exactly between the partition walls and the partition walls to easily obtain discharge of a desired cell.

However, deformation of the glass substrate is caused by a thermal process including a firing process in forming the address electrode, which causes the alignment of the address electrode and the partition wall to become an important issue. Moreover, in accordance with the trend toward larger glass substrates and higher resolution, such barrier and electrode alignment problems will lead to greater problems in the manufacture of large, high-resolution PDPs in the future.

On the other hand, in the case of forming a partition wall using a sand blast method, etc., which has recently been in the spotlight, currently, an additional protective layer is formed on the address electrode to prevent damage to the electrode. There is a problem that deformation of the additional glass substrate occurs by a predetermined process for forming a protective layer.

The present invention provides a method of manufacturing a back panel of a plasma display panel which prevents misalignment of a partition wall and an address electrode and prevents damage to the address electrode without forming an additional protective layer even when a partition wall is formed using a sand blast method. There is this.

1 to 6 is a rear plate manufacturing process diagram of the surface discharge AC PDP according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

10: glass substrate

11: bulkhead

12: photoresist

13: electrode material for address electrode

R, G, B: phosphor

The present invention prevents misalignment of barrier ribs and address electrodes due to deformation of the glass substrate accompanying the firing process in forming the address electrodes by forming barrier ribs before forming the address electrodes and forming the address electrodes using the formed barrier ribs. In addition, the barrier rib and the address electrode are formed on the other side of the glass substrate, respectively, to prevent damage to the address electrode without an additional electrode protective layer forming process even during the barrier rib forming process using a sand blast method. At this time, the thickness and composition of the glass substrate to be used is designed to consider the dielectric properties.

According to another aspect of the present invention, there is provided a method of manufacturing a back plate of a plasma display panel, the method including: forming a barrier rib on a front surface of a glass substrate; Forming a positive photoresist on a rear surface of the glass substrate; Exposing the positive photoresist using the barrier as a mask; Developing the positive photoresist to form a photoresist pattern; Forming a trench by etching the back surface of the glass substrate by a predetermined depth using the photoresist pattern as an etching mask; And embedding a material for an address electrode in the trench.

The back plate of the plasma display panel of the present invention for achieving the above technical problem, the glass substrate; A partition provided on the front surface of the glass substrate; And an address electrode embedded in a rear surface of the glass substrate except for an area overlapped with the partition wall.

Hereinafter, preferred embodiments of the present invention will be introduced in order to enable those skilled in the art to more easily carry out the present invention.

1 to 6 illustrate a back plate manufacturing process of a surface discharge type AC PDP according to an embodiment of the present invention, which will be described with reference to the following.

In the process according to the present embodiment, first, as shown in FIG. 1, the partition 11 is formed on one surface of the glass substrate 10 for the back plate by using the sand blasting method. In this case, the sand blasting method is formed through the formation of a barrier paste, photoresist deposition, exposure / development, etching and photoresist peeling, and in addition to the sand blasting method, screen printing, additive, photo-filling methods The partition 11 can be formed using a press method or the like.

Next, as shown in FIG. 2, the positive photoresist 12 is formed on the rear surface of the glass substrate 10 (opposite to the surface on which the partition wall is formed).

Next, as shown in FIG. 3, exposure is performed using the partition 11 as a mask. That is, exposure is performed on one surface side of the glass substrate 10 on which the partition wall 11 is formed.

Next, as shown in FIG. 4, development is performed to pattern the photoresist 12. At this time, the patterned photoresist 12 accurately overlaps the partition 11. Subsequently, the glass substrate 11 is etched using the patterned photoresist 12 as an etching mask to form a trench having a predetermined depth.

Subsequently, as shown in FIG. 5, the electrode material 13 for the address electrode is filled in the trench, and the photoresist 12 is removed.

FIG. 6 illustrates a state in which the back plate manufacturing process is completed by forming the phosphors R, G, and B. In the case of a transmissive type, the phosphors R, G, and B are formed on the front plate.

In the above process, first, referring to FIG. 1, even if the partition wall 11 is formed by using the sand blasting method, since the address electrode is not located below the address electrode, there is no fear of damaging the address electrode. Thus, no additional address electrode protective layer is required.

As shown in FIG. 3, since the partition 11 is used as an exposure mask when forming the address electrode, the possibility of misalignment becomes slim. Therefore, even if the glass substrate 10 is deformed by performing the firing process after the address electrode is formed, the partition wall is already formed so that it does not cause a big problem.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes can be made in the art without departing from the technical spirit of the present invention. It will be apparent to those of ordinary knowledge.

The present invention described above has an effect of preventing misalignment of barrier ribs and address electrodes due to deformation of the glass substrate accompanying the firing process at the time of forming the address electrode, and additionally during the barrier rib forming process using a sand blast method. There is an effect that it is possible to prevent damage to the address electrode without forming an electrode protective film.

Claims (3)

Forming a partition on a front surface of the glass substrate; Forming a positive photoresist on a rear surface of the glass substrate; Exposing the positive photoresist using the barrier as a mask; Developing the positive photoresist to form a photoresist pattern; Forming a trench by etching the back surface of the glass substrate by a predetermined depth using the photoresist pattern as an etching mask; And Embedding a material for an address electrode in the trench Back plate manufacturing method of the plasma display panel comprising a. The method of claim 1, After the step of filling the material for the address electrode, The method of manufacturing a back plate of the plasma display panel further comprising the step of applying a phosphor in the partition wall. Glass substrates; A partition provided on the front surface of the glass substrate; And An address electrode buried in the rear surface of the glass substrate except for the region overlapping the partition wall A back plate of the plasma display panel having a.