TW315420B - - Google Patents

Download PDF

Info

Publication number
TW315420B
TW315420B TW084105932A TW84105932A TW315420B TW 315420 B TW315420 B TW 315420B TW 084105932 A TW084105932 A TW 084105932A TW 84105932 A TW84105932 A TW 84105932A TW 315420 B TW315420 B TW 315420B
Authority
TW
Taiwan
Prior art keywords
lead
optical element
package
height
lens
Prior art date
Application number
TW084105932A
Other languages
English (en)
Chinese (zh)
Original Assignee
Sony Co Ltd
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Co Ltd, Nippon Electric Co filed Critical Sony Co Ltd
Application granted granted Critical
Publication of TW315420B publication Critical patent/TW315420B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Communication System (AREA)
  • Led Device Packages (AREA)
TW084105932A 1994-06-10 1995-06-10 TW315420B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6152583A JPH07335914A (ja) 1994-06-10 1994-06-10 光学装置

Publications (1)

Publication Number Publication Date
TW315420B true TW315420B (https=) 1997-09-11

Family

ID=15543642

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105932A TW315420B (https=) 1994-06-10 1995-06-10

Country Status (5)

Country Link
US (1) US5591966A (https=)
JP (1) JPH07335914A (https=)
KR (1) KR100344149B1 (https=)
CN (1) CN1106692C (https=)
TW (1) TW315420B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100475339B1 (ko) * 1997-08-18 2005-05-18 삼성전자주식회사 리드프레임및그를이용한반도체칩패키지
US6740870B1 (en) * 1998-11-18 2004-05-25 Micron Technology, Inc. Clear plastic packaging in a CMOS active pixel image sensor
US7376212B2 (en) 2004-06-03 2008-05-20 Silicon Laboratories Inc. RF isolator with differential input/output
US7302247B2 (en) * 2004-06-03 2007-11-27 Silicon Laboratories Inc. Spread spectrum isolator
US8441325B2 (en) 2004-06-03 2013-05-14 Silicon Laboratories Inc. Isolator with complementary configurable memory
US7577223B2 (en) 2004-06-03 2009-08-18 Silicon Laboratories Inc. Multiplexed RF isolator circuit
US8198951B2 (en) * 2004-06-03 2012-06-12 Silicon Laboratories Inc. Capacitive isolation circuitry
US8169108B2 (en) * 2004-06-03 2012-05-01 Silicon Laboratories Inc. Capacitive isolator
US7737871B2 (en) 2004-06-03 2010-06-15 Silicon Laboratories Inc. MCU with integrated voltage isolator to provide a galvanic isolation between input and output
US8049573B2 (en) * 2004-06-03 2011-11-01 Silicon Laboratories Inc. Bidirectional multiplexed RF isolator
US7821428B2 (en) * 2004-06-03 2010-10-26 Silicon Laboratories Inc. MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link
US7149405B2 (en) * 2004-10-29 2006-12-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Electro-optical subassemblies and method for assembly thereof
JP2006179767A (ja) * 2004-12-24 2006-07-06 Sharp Corp リモコン受光ユニットおよびそれを用いた電子機器
TWI598538B (zh) 2015-07-31 2017-09-11 宏齊科技股份有限公司 無需使用預儲電源的可攜式發光裝置及其發光二極體封裝結構
US10880004B2 (en) 2016-11-01 2020-12-29 Jeong-Soo Kim Variable wavelength filter, and light receiver and light receiving method using variable wavelength filter

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818859A (en) * 1987-06-01 1989-04-04 Carroll Touch Inc. Low profile opto-device assembly with specific optoelectronic lead mount
AU631000B2 (en) * 1990-08-28 1992-11-12 Sumitomo Electric Industries, Ltd. Optical module

Also Published As

Publication number Publication date
CN1106692C (zh) 2003-04-23
US5591966A (en) 1997-01-07
JPH07335914A (ja) 1995-12-22
CN1126399A (zh) 1996-07-10
KR100344149B1 (ko) 2002-11-11

Similar Documents

Publication Publication Date Title
TW315420B (https=)
EP0582992A1 (en) Optical module with improved grounding of an optical element
TW313687B (https=)
JPS60233601A (ja) 光学装置の製造に関する改良
CN100561282C (zh) 数码相机模组
TW459429B (en) Simplified microelectronic connector and method of manufacturing
EP0472755A1 (en) Optical module
US7275962B1 (en) Connector
JP3772304B2 (ja) プリント基板の相互間接続構造
US4829582A (en) Electrodynamic transducer
TW411696B (en) Image sensor
JP2881806B2 (ja) 光モジュール及びその製造方法
JP3138845B2 (ja) イメージセンサ
JPH0453001Y2 (https=)
CN112995453B (zh) 深度信息摄像模组及其组装方法
CN215377865U (zh) 一种连接器
CN215377864U (zh) 一种连接器
JP3756249B2 (ja) 表面実装型光学装置
JP2501867Y2 (ja) ル―プアンテナ
JP2557419Y2 (ja) 回路基板用コネクタ
CN215377863U (zh) 一种连接器
JP3505168B2 (ja) 光プラグ及びこれを用いた光ファイバーケーブル
CN212783873U (zh) 一种导线连接端子
CN215266877U (zh) 一种稳定的防磨损tf卡卡槽
JPH04128811A (ja) 光電変換装置