TW312846B - - Google Patents

Download PDF

Info

Publication number
TW312846B
TW312846B TW085103214A TW85103214A TW312846B TW 312846 B TW312846 B TW 312846B TW 085103214 A TW085103214 A TW 085103214A TW 85103214 A TW85103214 A TW 85103214A TW 312846 B TW312846 B TW 312846B
Authority
TW
Taiwan
Prior art keywords
wiring
layer
wiring layer
circuit
many
Prior art date
Application number
TW085103214A
Other languages
English (en)
Chinese (zh)
Original Assignee
Hitachi Ltd
Hitachi Microcomp System Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomp System Kk filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW312846B publication Critical patent/TW312846B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW085103214A 1995-12-26 1996-03-18 TW312846B (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33839895A JP3636523B2 (ja) 1995-12-26 1995-12-26 半導体集積回路装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW312846B true TW312846B (cs) 1997-08-11

Family

ID=18317791

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085103214A TW312846B (cs) 1995-12-26 1996-03-18

Country Status (2)

Country Link
JP (1) JP3636523B2 (cs)
TW (1) TW312846B (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216264A (ja) 1999-01-22 2000-08-04 Mitsubishi Electric Corp Ｃｍｏｓ論理回路素子、半導体装置とその製造方法およびその製造方法において用いる半導体回路設計方法
JP3616611B2 (ja) 2002-05-14 2005-02-02 株式会社東芝 半導体集積回路装置の設計装置、半導体集積回路の設計方法および半導体集積回路設計プログラム

Also Published As

Publication number Publication date
JP3636523B2 (ja) 2005-04-06
JPH09181184A (ja) 1997-07-11

Similar Documents

Publication Publication Date Title
US12080804B2 (en) Semiconductor integrated circuit device
US6489688B1 (en) Area efficient bond pad placement
KR101054665B1 (ko) 집적 회로 다이 ｉ／ｏ 셀들
TW515054B (en) Flip chip pad arrangement on chip for reduction of impedance
US11749757B2 (en) Semiconductor chip
WO2020066797A1 (ja) 半導体集積回路装置および半導体パッケージ構造
US12159814B2 (en) Semiconductor packages and methods for forming the same
US5892276A (en) Semiconductor integrated circuit
JP3825252B2 (ja) フリップチップ型半導体装置
TW312846B (cs)
JPS6035524A (ja) 半導体装置
JPH01225137A (ja) 半導体集積回路装置
US6310402B1 (en) Semiconductor die having input/output cells and contact pads in the periphery of a substrate
JPH05243482A (ja) 半導体集積回路
JPH0194636A (ja) 半導体装置
JPS6070742A (ja) マスタ・スライス型半導体装置
JPS6080250A (ja) 半導体装置
JPS5844592Y2 (ja) 半導体集積回路装置
JP3075858B2 (ja) 半導体集積回路装置
JPS59139646A (ja) 半導体集積回路装置
US6674176B2 (en) Wire bond package with core ring formed over I/O cells
JPS6156441A (ja) 半導体装置
DE102022120358A1 (de) Mikroelektronische vorrichtungen und zugehörige speichervorrichtungen und elektronische systeme
JPH05166932A (ja) 半導体集積回路装置
JPH0548048A (ja) マスタスライス型半導体集積回路装置