TW310445B - - Google Patents
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- TW310445B TW310445B TW083105982A TW83105982A TW310445B TW 310445 B TW310445 B TW 310445B TW 083105982 A TW083105982 A TW 083105982A TW 83105982 A TW83105982 A TW 83105982A TW 310445 B TW310445 B TW 310445B
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- 238000012545 processing Methods 0.000 claims description 268
- 238000010438 heat treatment Methods 0.000 claims description 174
- 239000007789 gas Substances 0.000 claims description 138
- 239000000463 material Substances 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 24
- 229910052582 BN Inorganic materials 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 22
- 238000011282 treatment Methods 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 238000001179 sorption measurement Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 238000012546 transfer Methods 0.000 claims description 18
- 230000000875 corresponding effect Effects 0.000 claims description 16
- 230000003746 surface roughness Effects 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 14
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 13
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 11
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 8
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 8
- 230000003068 static effect Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000002079 cooperative effect Effects 0.000 claims description 6
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- 230000001276 controlling effect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 210000003625 skull Anatomy 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000009489 vacuum treatment Methods 0.000 claims 5
- 239000007921 spray Substances 0.000 claims 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 229910017083 AlN Inorganic materials 0.000 claims 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- 102000040350 B family Human genes 0.000 claims 1
- 108091072128 B family Proteins 0.000 claims 1
- 230000033228 biological regulation Effects 0.000 claims 1
- 238000005253 cladding Methods 0.000 claims 1
- 238000005034 decoration Methods 0.000 claims 1
- 230000014759 maintenance of location Effects 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 210000002784 stomach Anatomy 0.000 claims 1
- 239000010410 layer Substances 0.000 description 123
- 235000012431 wafers Nutrition 0.000 description 97
- 239000004065 semiconductor Substances 0.000 description 60
- 239000010408 film Substances 0.000 description 25
- 238000009826 distribution Methods 0.000 description 22
- 239000000498 cooling water Substances 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 16
- 239000004020 conductor Substances 0.000 description 13
- 238000003860 storage Methods 0.000 description 12
- 208000037998 chronic venous disease Diseases 0.000 description 11
- 238000007664 blowing Methods 0.000 description 10
- 239000011800 void material Substances 0.000 description 10
- 238000009413 insulation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 230000006837 decompression Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000013589 supplement Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000009717 reactive processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 241000283074 Equus asinus Species 0.000 description 1
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 241000218206 Ranunculus Species 0.000 description 1
- 206010041349 Somnolence Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002680 soil gas Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18085193 | 1993-06-24 | ||
JP18551993 | 1993-06-29 | ||
JP18550293A JP3342118B2 (ja) | 1993-06-29 | 1993-06-29 | 処理装置 |
JP18550393 | 1993-06-29 | ||
JP26441293 | 1993-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW310445B true TW310445B (enrdf_load_stackoverflow) | 1997-07-11 |
Family
ID=51566342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083105982A TW310445B (enrdf_load_stackoverflow) | 1993-06-24 | 1994-06-30 |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW310445B (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI746468B (zh) * | 2015-11-26 | 2021-11-21 | 日商東洋炭素股份有限公司 | 薄型SiC晶圓之製造方法及薄型SiC晶圓 |
-
1994
- 1994-06-30 TW TW083105982A patent/TW310445B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI746468B (zh) * | 2015-11-26 | 2021-11-21 | 日商東洋炭素股份有限公司 | 薄型SiC晶圓之製造方法及薄型SiC晶圓 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |