TW295732B - - Google Patents
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- Publication number
- TW295732B TW295732B TW83110832A TW83110832A TW295732B TW 295732 B TW295732 B TW 295732B TW 83110832 A TW83110832 A TW 83110832A TW 83110832 A TW83110832 A TW 83110832A TW 295732 B TW295732 B TW 295732B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- resistance
- cathode
- source
- pole
- Prior art date
Links
- 230000005684 electric field Effects 0.000 claims description 37
- 230000005855 radiation Effects 0.000 claims description 20
- 238000010304 firing Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 3
- 241000283973 Oryctolagus cuniculus Species 0.000 claims 1
- 239000013065 commercial product Substances 0.000 claims 1
- 230000005284 excitation Effects 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000002285 radioactive effect Effects 0.000 claims 1
- 230000002336 repolarization Effects 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 62
- 239000000758 substrate Substances 0.000 description 25
- 229910021417 amorphous silicon Inorganic materials 0.000 description 14
- 239000012535 impurity Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000011049 filling Methods 0.000 description 10
- 229910052750 molybdenum Inorganic materials 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000010955 niobium Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052758 niobium Inorganic materials 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 230000000875 corresponding effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 241000239226 Scorpiones Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910008814 WSi2 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002079 cooperative effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Cold Cathode And The Manufacture (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32092393A JP2737618B2 (ja) | 1993-11-29 | 1993-11-29 | 電界放出形電子源 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW295732B true TW295732B (enrdf_load_stackoverflow) | 1997-01-11 |
Family
ID=18126793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW83110832A TW295732B (enrdf_load_stackoverflow) | 1993-11-29 | 1994-11-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2737618B2 (enrdf_load_stackoverflow) |
| TW (1) | TW295732B (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2970539B2 (ja) * | 1996-06-27 | 1999-11-02 | 日本電気株式会社 | 電界放出型陰極およびこれを用いた陰極線管 |
| JPH11111156A (ja) * | 1997-10-02 | 1999-04-23 | Futaba Corp | 電界放出素子 |
| KR100334017B1 (ko) * | 1999-03-18 | 2002-04-26 | 김순택 | 평판 디스플레이 |
| KR100326218B1 (ko) * | 1999-12-10 | 2002-03-08 | 구자홍 | 전계방출 표시소자 및 그 제조방법 |
| KR20060104659A (ko) | 2005-03-31 | 2006-10-09 | 삼성에스디아이 주식회사 | 전자 방출 소자 |
| KR20060104655A (ko) * | 2005-03-31 | 2006-10-09 | 삼성에스디아이 주식회사 | 전자 방출 소자 |
| KR101107134B1 (ko) | 2005-08-26 | 2012-01-31 | 삼성에스디아이 주식회사 | 전자 방출 소자, 전자 방출 디바이스 및 그 제조 방법 |
| KR20070041983A (ko) | 2005-10-17 | 2007-04-20 | 삼성에스디아이 주식회사 | 전자 방출 표시 디바이스 |
-
1993
- 1993-11-29 JP JP32092393A patent/JP2737618B2/ja not_active Expired - Fee Related
-
1994
- 1994-11-22 TW TW83110832A patent/TW295732B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2737618B2 (ja) | 1998-04-08 |
| JPH07153369A (ja) | 1995-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |