TW293985B - - Google Patents

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Publication number
TW293985B
TW293985B TW84110926A TW84110926A TW293985B TW 293985 B TW293985 B TW 293985B TW 84110926 A TW84110926 A TW 84110926A TW 84110926 A TW84110926 A TW 84110926A TW 293985 B TW293985 B TW 293985B
Authority
TW
Taiwan
Prior art keywords
substrate
item
metal
gold
precious metal
Prior art date
Application number
TW84110926A
Other languages
English (en)
Chinese (zh)
Original Assignee
Rd Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rd Chemical Co filed Critical Rd Chemical Co
Application granted granted Critical
Publication of TW293985B publication Critical patent/TW293985B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
TW84110926A 1994-10-17 1995-10-17 TW293985B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32440994A 1994-10-17 1994-10-17

Publications (1)

Publication Number Publication Date
TW293985B true TW293985B (ja) 1996-12-21

Family

ID=23263456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84110926A TW293985B (ja) 1994-10-17 1995-10-17

Country Status (3)

Country Link
AU (1) AU3955595A (ja)
TW (1) TW293985B (ja)
WO (1) WO1996011751A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3371072B2 (ja) * 1997-04-25 2003-01-27 株式会社ジャパンエナジー 銅または銅合金の変色防止液並びに変色防止方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650913A (en) * 1969-09-08 1972-03-21 Macdermid Inc An electroless plating process employing a specially prepared palladium-tin activator solution
US4431685A (en) * 1982-07-02 1984-02-14 International Business Machines Corporation Decreasing plated metal defects
US4424241A (en) * 1982-09-27 1984-01-03 Bell Telephone Laboratories, Incorporated Electroless palladium process
US4770899A (en) * 1987-06-10 1988-09-13 Unisys Corporation Method of coating copper conductors on polyimide with a corrosion resistant metal, and module produced thereby

Also Published As

Publication number Publication date
AU3955595A (en) 1996-05-06
WO1996011751A1 (en) 1996-04-25

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