TW291612B - - Google Patents

Info

Publication number
TW291612B
TW291612B TW084102079A TW84102079A TW291612B TW 291612 B TW291612 B TW 291612B TW 084102079 A TW084102079 A TW 084102079A TW 84102079 A TW84102079 A TW 84102079A TW 291612 B TW291612 B TW 291612B
Authority
TW
Taiwan
Application number
TW084102079A
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Application granted granted Critical
Publication of TW291612B publication Critical patent/TW291612B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/346—Preventing or reducing leakage fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0053—Printed inductances with means to reduce eddy currents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F2027/348—Preventing eddy currents

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW084102079A 1994-12-06 1995-03-04 TW291612B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/350,358 US5635892A (en) 1994-12-06 1994-12-06 High Q integrated inductor

Publications (1)

Publication Number Publication Date
TW291612B true TW291612B (zh) 1996-11-21

Family

ID=23376373

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084102079A TW291612B (zh) 1994-12-06 1995-03-04

Country Status (7)

Country Link
US (1) US5635892A (zh)
EP (1) EP0716433B1 (zh)
JP (1) JPH08227814A (zh)
KR (1) KR960026744A (zh)
CN (1) CN1078382C (zh)
DE (1) DE69524554T2 (zh)
TW (1) TW291612B (zh)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118351A (en) * 1997-06-10 2000-09-12 Lucent Technologies Inc. Micromagnetic device for power processing applications and method of manufacture therefor
US6440750B1 (en) 1997-06-10 2002-08-27 Agere Systems Guardian Corporation Method of making integrated circuit having a micromagnetic device
US6013939A (en) 1997-10-31 2000-01-11 National Scientific Corp. Monolithic inductor with magnetic flux lines guided away from substrate
US5959522A (en) * 1998-02-03 1999-09-28 Motorola, Inc. Integrated electromagnetic device and method
US6166422A (en) * 1998-05-13 2000-12-26 Lsi Logic Corporation Inductor with cobalt/nickel core for integrated circuit structure with high inductance and high Q-factor
US6169008B1 (en) * 1998-05-16 2001-01-02 Winbond Electronics Corp. High Q inductor and its forming method
JP2000022085A (ja) * 1998-06-29 2000-01-21 Toshiba Corp 半導体装置及びその製造方法
US6255714B1 (en) 1999-06-22 2001-07-03 Agere Systems Guardian Corporation Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor
US6870456B2 (en) * 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6856228B2 (en) 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6891461B2 (en) * 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
US6815220B2 (en) * 1999-11-23 2004-11-09 Intel Corporation Magnetic layer processing
JP3438704B2 (ja) * 2000-07-14 2003-08-18 株式会社村田製作所 導体パターンおよび該導体パターンを備えた電子部品
US6309922B1 (en) * 2000-07-28 2001-10-30 Conexant Systems, Inc. Method for fabrication of on-chip inductors and related structure
US6535101B1 (en) * 2000-08-01 2003-03-18 Micron Technology, Inc. Low loss high Q inductor
CA2355674A1 (en) * 2000-08-21 2002-02-21 Sirific Wireless Corporation Improvements to filters implemented in integrated circuits
US6801585B1 (en) 2000-10-16 2004-10-05 Rf Micro Devices, Inc. Multi-phase mixer
US6807406B1 (en) 2000-10-17 2004-10-19 Rf Micro Devices, Inc. Variable gain mixer circuit
US6748204B1 (en) 2000-10-17 2004-06-08 Rf Micro Devices, Inc. Mixer noise reduction technique
US20020158305A1 (en) * 2001-01-05 2002-10-31 Sidharth Dalmia Organic substrate having integrated passive components
US6509777B2 (en) 2001-01-23 2003-01-21 Resonext Communications, Inc. Method and apparatus for reducing DC offset
US6606489B2 (en) 2001-02-14 2003-08-12 Rf Micro Devices, Inc. Differential to single-ended converter with large output swing
US6458611B1 (en) 2001-03-07 2002-10-01 Intel Corporation Integrated circuit device characterization
US6778022B1 (en) 2001-05-17 2004-08-17 Rf Micro Devices, Inc. VCO with high-Q switching capacitor bank
US6700472B2 (en) 2001-12-11 2004-03-02 Intersil Americas Inc. Magnetic thin film inductors
US6714112B2 (en) * 2002-05-10 2004-03-30 Chartered Semiconductor Manufacturing Limited Silicon-based inductor with varying metal-to-metal conductor spacing
US6900708B2 (en) * 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US7260890B2 (en) * 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
US6987307B2 (en) * 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
US7302011B1 (en) 2002-10-16 2007-11-27 Rf Micro Devices, Inc. Quadrature frequency doubling system
US7489914B2 (en) * 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
US7852185B2 (en) * 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
US8345433B2 (en) * 2004-07-08 2013-01-01 Avx Corporation Heterogeneous organic laminate stack ups for high frequency applications
US8134548B2 (en) 2005-06-30 2012-03-13 Micron Technology, Inc. DC-DC converter switching transistor current measurement technique
TWI259481B (en) * 2005-08-08 2006-08-01 Realtek Semiconductor Corp Apparatus for enhancing Q factor of inductor
US7439840B2 (en) 2006-06-27 2008-10-21 Jacket Micro Devices, Inc. Methods and apparatuses for high-performing multi-layer inductors
US7808434B2 (en) * 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7989895B2 (en) * 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
TWI484569B (zh) * 2012-07-20 2015-05-11 Nat Univ Tsing Hua 系統級封裝方法
US9844141B2 (en) 2012-09-11 2017-12-12 Ferric, Inc. Magnetic core inductor integrated with multilevel wiring network
US11064610B2 (en) 2012-09-11 2021-07-13 Ferric Inc. Laminated magnetic core inductor with insulating and interface layers
US10244633B2 (en) 2012-09-11 2019-03-26 Ferric Inc. Integrated switched inductor power converter
US11116081B2 (en) 2012-09-11 2021-09-07 Ferric Inc. Laminated magnetic core inductor with magnetic flux closure path parallel to easy axes of magnetization of magnetic layers
US11197374B2 (en) 2012-09-11 2021-12-07 Ferric Inc. Integrated switched inductor power converter having first and second powertrain phases
US11058001B2 (en) 2012-09-11 2021-07-06 Ferric Inc. Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer
US10893609B2 (en) 2012-09-11 2021-01-12 Ferric Inc. Integrated circuit with laminated magnetic core inductor including a ferromagnetic alloy
US9337251B2 (en) 2013-01-22 2016-05-10 Ferric, Inc. Integrated magnetic core inductors with interleaved windings
US9647053B2 (en) 2013-12-16 2017-05-09 Ferric Inc. Systems and methods for integrated multi-layer magnetic films
US9991040B2 (en) 2014-06-23 2018-06-05 Ferric, Inc. Apparatus and methods for magnetic core inductors with biased permeability
US10629357B2 (en) 2014-06-23 2020-04-21 Ferric Inc. Apparatus and methods for magnetic core inductors with biased permeability
US11302469B2 (en) 2014-06-23 2022-04-12 Ferric Inc. Method for fabricating inductors with deposition-induced magnetically-anisotropic cores
US10354950B2 (en) 2016-02-25 2019-07-16 Ferric Inc. Systems and methods for microelectronics fabrication and packaging using a magnetic polymer
CN108111144B (zh) * 2017-12-08 2021-06-08 北京航天广通科技有限公司 栅极谐振部件和栅极谐振装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873105A (ja) * 1981-10-27 1983-05-02 Nec Corp うず巻コイル
JPS6320810A (ja) * 1986-07-15 1988-01-28 Hitachi Ltd 変圧器鉄心
US4979016A (en) * 1988-05-16 1990-12-18 Dallas Semiconductor Corporation Split lead package
US5027255A (en) * 1988-10-22 1991-06-25 Westinghouse Electric Co. High performance, high current miniaturized low voltage power supply
JPH0377360A (ja) * 1989-08-18 1991-04-02 Mitsubishi Electric Corp 半導体装置
MY105486A (en) * 1989-12-15 1994-10-31 Tdk Corp A multilayer hybrid circuit.
JPH03212913A (ja) * 1990-01-18 1991-09-18 Matsushita Electric Ind Co Ltd インダクタンス部品
JPH0666193B2 (ja) * 1990-03-19 1994-08-24 株式会社アモルファス・電子デバイス研究所 磁性薄膜トランス
IL94340A (en) * 1990-05-09 1994-05-30 Vishay Israel Ltd Selectable high precision resistor and technique for production thereof
JP2997729B2 (ja) * 1990-06-29 2000-01-11 日本電信電話株式会社 インダクタンス素子形成法
JPH0583017A (ja) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp マイクロ波集積回路装置
US5243319A (en) * 1991-10-30 1993-09-07 Analog Devices, Inc. Trimmable resistor network providing wide-range trims

Also Published As

Publication number Publication date
CN1078382C (zh) 2002-01-23
CN1132918A (zh) 1996-10-09
EP0716433B1 (en) 2001-12-12
EP0716433A1 (en) 1996-06-12
JPH08227814A (ja) 1996-09-03
DE69524554D1 (de) 2002-01-24
US5635892A (en) 1997-06-03
KR960026744A (zh) 1996-07-20
DE69524554T2 (de) 2002-08-01

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