TW291595B - - Google Patents
Info
- Publication number
- TW291595B TW291595B TW084112807A TW84112807A TW291595B TW 291595 B TW291595 B TW 291595B TW 084112807 A TW084112807 A TW 084112807A TW 84112807 A TW84112807 A TW 84112807A TW 291595 B TW291595 B TW 291595B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
- H10W72/9232—Bond pads having multiple stacked layers with additional elements interposed between layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/981—Auxiliary members, e.g. spacers
- H10W72/983—Reinforcing structures, e.g. collars
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US45404995A | 1995-05-30 | 1995-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW291595B true TW291595B (enExample) | 1996-11-21 |
Family
ID=23803086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084112807A TW291595B (enExample) | 1995-05-30 | 1995-12-01 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0746024A3 (enExample) |
| JP (1) | JPH08330525A (enExample) |
| KR (1) | KR960043151A (enExample) |
| TW (1) | TW291595B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09167827A (ja) * | 1995-12-14 | 1997-06-24 | Tokai Rika Co Ltd | 半導体装置 |
| KR19990072936A (ko) | 1998-02-27 | 1999-09-27 | 가나이 쓰도무 | 아이솔레이터및그것을사용하는모뎀장치 |
| KR100294449B1 (ko) * | 1998-07-15 | 2001-07-12 | 윤종용 | 본딩패드하부에형성되는커패시터를구비한반도체집적회로장치 |
| FR2925980B1 (fr) * | 2007-12-28 | 2010-06-04 | St Microelectronics Sa | Plot de contact electrique |
| GB2491111B (en) * | 2011-05-19 | 2015-08-19 | Oxford Instr Nanotechnology Tools Ltd | Charge-sensitive amplifier |
| WO2014021358A1 (ja) | 2012-08-02 | 2014-02-06 | 株式会社堀場製作所 | 増幅器及び放射線検出器 |
| JP6149503B2 (ja) * | 2013-05-17 | 2017-06-21 | 住友電気工業株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134951A (ja) * | 1984-07-26 | 1986-02-19 | Toshiba Corp | 半導体装置の容量評価用モニタ部 |
| JPS63184358A (ja) * | 1987-01-27 | 1988-07-29 | Oki Electric Ind Co Ltd | 半導体集積回路 |
| JPH02304963A (ja) * | 1989-05-19 | 1990-12-18 | Nec Corp | 半導体集積回路装置 |
| FR2714528B1 (fr) * | 1993-12-27 | 1996-03-15 | Sgs Thomson Microelectronics | Structure de test de circuit intégré. |
-
1995
- 1995-12-01 TW TW084112807A patent/TW291595B/zh active
-
1996
- 1996-05-21 EP EP96303618A patent/EP0746024A3/en not_active Withdrawn
- 1996-05-30 JP JP8136203A patent/JPH08330525A/ja active Pending
- 1996-05-30 KR KR1019960018643A patent/KR960043151A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0746024A3 (en) | 1997-03-26 |
| EP0746024A2 (en) | 1996-12-04 |
| JPH08330525A (ja) | 1996-12-13 |
| KR960043151A (ko) | 1996-12-23 |