TW289175B - - Google Patents

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Publication number
TW289175B
TW289175B TW084111953A TW84111953A TW289175B TW 289175 B TW289175 B TW 289175B TW 084111953 A TW084111953 A TW 084111953A TW 84111953 A TW84111953 A TW 84111953A TW 289175 B TW289175 B TW 289175B
Authority
TW
Taiwan
Prior art keywords
electrode
active layer
conductivity type
end surface
layer
Prior art date
Application number
TW084111953A
Other languages
English (en)
Chinese (zh)
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW289175B publication Critical patent/TW289175B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0287—Facet reflectivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/1228—DFB lasers with a complex coupled grating, e.g. gain or loss coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/124—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers incorporating phase shifts

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
TW084111953A 1995-04-07 1995-11-11 TW289175B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8237895 1995-04-07

Publications (1)

Publication Number Publication Date
TW289175B true TW289175B (enExample) 1996-10-21

Family

ID=13772930

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111953A TW289175B (enExample) 1995-04-07 1995-11-11

Country Status (3)

Country Link
US (1) US5684816A (enExample)
KR (1) KR960039512A (enExample)
TW (1) TW289175B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3314616B2 (ja) * 1995-10-05 2002-08-12 株式会社デンソー 大出力用半導体レーザ素子
JPWO2005088790A1 (ja) * 2004-03-15 2008-01-31 三洋電機株式会社 半導体レーザ素子、およびその製造方法
WO2006008269A1 (en) * 2004-07-23 2006-01-26 Eblana Photonics Ltd. Single mode laser
FR2879840B1 (fr) * 2004-12-22 2007-03-09 Thales Sa Laser a semiconducteur stable en temperature et a faisceau homogene
US7359113B2 (en) * 2005-02-02 2008-04-15 Covega Corp. Semiconductor optical amplifier having a non-uniform injection current density
US7860141B2 (en) * 2005-04-28 2010-12-28 Kyoto University Photonic crystal laser
GB2427752A (en) * 2005-06-28 2007-01-03 Bookham Technology Plc High power semiconductor laser diode
IES20050574A2 (en) * 2005-08-31 2007-02-21 Eblana Photonics Ltd Semiconductor laser and method of manufacture
IES20050587A2 (en) * 2005-09-08 2007-02-21 Eblana Photonics Ltd Multi-stripe laser diode designs which exhibit a high degree of manafacturability
US9368935B2 (en) * 2008-04-28 2016-06-14 Northrop Grumman Systems Corporation Method for mode control in multimode semiconductor waveguide lasers
GB201005696D0 (en) * 2010-04-06 2010-05-19 Oclaro Technology Plc Semiconductor laser diodes
WO2017039767A1 (en) * 2015-06-05 2017-03-09 Teh Government Of The United States Of America, As Represented By The Secretary Of The Navy Interband cascade lasers with low-fill factor top contact for reduced loss
WO2019160039A1 (ja) 2018-02-16 2019-08-22 古河電気工業株式会社 光半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3660780A (en) * 1969-05-28 1972-05-02 Tokyo Shibaura Electric Co Semiconductor lasers
US3790902A (en) * 1972-09-05 1974-02-05 Bell Telephone Labor Inc Fundamental transverse mode operation in solid state lasers
JPS61207091A (ja) * 1985-03-11 1986-09-13 Sharp Corp 半導体レ−ザ素子
JPS61216383A (ja) * 1985-03-20 1986-09-26 Nec Corp 分布帰還型半導体レ−ザ
JPS6237909A (ja) * 1985-08-13 1987-02-18 Hitachi Metals Ltd 巻線機器
NL8700904A (nl) * 1987-04-16 1988-11-16 Philips Nv Halfgeleiderlaserinrichting en werkwijze voor het vervaardigen daarvan.
JP2637763B2 (ja) * 1988-04-18 1997-08-06 富士通株式会社 半導体レーザ装置
JPH0750814B2 (ja) * 1988-09-27 1995-05-31 三菱電機株式会社 多点発光型半導体レーザ装置
US5088105A (en) * 1991-03-26 1992-02-11 Spectra Diode Laboratories, Inc. Optical amplifier with folded light path and laser-amplifier combination
FR2686753B1 (fr) * 1992-01-24 1994-04-08 France Telecom Photorecepteur pour signaux optiques modules en frequence, emetteur-recepteur et liaison optique correspondants.

Also Published As

Publication number Publication date
US5684816A (en) 1997-11-04
KR960039512A (ko) 1996-11-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees