TW283109B - In-situ polishing pad flatness control - Google Patents

In-situ polishing pad flatness control

Info

Publication number
TW283109B
TW283109B TW085101282A TW85101282A TW283109B TW 283109 B TW283109 B TW 283109B TW 085101282 A TW085101282 A TW 085101282A TW 85101282 A TW85101282 A TW 85101282A TW 283109 B TW283109 B TW 283109B
Authority
TW
Taiwan
Prior art keywords
polishing pad
flatness control
situ polishing
pad flatness
workpiece
Prior art date
Application number
TW085101282A
Other languages
English (en)
Inventor
V Cesna Joseph
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Application granted granted Critical
Publication of TW283109B publication Critical patent/TW283109B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW085101282A 1995-06-02 1996-01-31 In-situ polishing pad flatness control TW283109B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/460,501 US5868605A (en) 1995-06-02 1995-06-02 In-situ polishing pad flatness control

Publications (1)

Publication Number Publication Date
TW283109B true TW283109B (en) 1996-08-11

Family

ID=23828964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101282A TW283109B (en) 1995-06-02 1996-01-31 In-situ polishing pad flatness control

Country Status (7)

Country Link
US (1) US5868605A (zh)
JP (1) JPH09103955A (zh)
KR (1) KR970000448A (zh)
DE (1) DE19622004A1 (zh)
GB (1) GB2301544B (zh)
SG (1) SG50733A1 (zh)
TW (1) TW283109B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113246003A (zh) * 2021-06-07 2021-08-13 杨定萍 一种木材加工用杯垫抛光设备

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US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US6099954A (en) 1995-04-24 2000-08-08 Rodel Holdings, Inc. Polishing material and method of polishing a surface
KR100440417B1 (ko) * 1995-10-23 2004-10-22 텍사스 인스트루먼츠 인코포레이티드 화학-기계적연마응용을위해패드컨디셔너와웨이퍼캐리어를통합시키는장치
US5875559A (en) * 1995-10-27 1999-03-02 Applied Materials, Inc. Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system
WO1997045543A2 (en) * 1996-05-28 1997-12-04 The Government Of The United States Of America, As Represented By The Secretary Of Health And Human Services, National Institutes Of Health Cc chemokine receptor 5, antibodies thereto, transgenic animals
JPH10230451A (ja) * 1997-02-20 1998-09-02 Speedfam Co Ltd 研磨装置及びワーク測定方法
KR100524054B1 (ko) 1997-11-21 2005-10-26 가부시키가이샤 에바라 세이사꾸쇼 폴리싱 장치와 이에 사용되는 대상물 홀더 및 폴리싱 방법 및 웨이퍼제조방법
JPH11254314A (ja) * 1998-03-10 1999-09-21 Speedfam Co Ltd ワーク面加工装置
JP3858462B2 (ja) * 1998-07-30 2006-12-13 株式会社日立製作所 半導体装置の製造方法
US6439967B2 (en) 1998-09-01 2002-08-27 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
WO2001007967A1 (en) * 1999-07-22 2001-02-01 Corning Incorporated Extreme ultraviolet soft x-ray projection lithographic method and mask devices
JP3766802B2 (ja) 1999-07-22 2006-04-19 コーニング インコーポレイテッド 遠紫外軟ｘ線投影リソグラフィー法システムおよびリソグラフィーエレメント
US7008301B1 (en) * 1999-08-26 2006-03-07 Advanced Micro Devices, Inc. Polishing uniformity via pad conditioning
US6306008B1 (en) 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6376378B1 (en) * 1999-10-08 2002-04-23 Chartered Semiconductor Manufacturing, Ltd. Polishing apparatus and method for forming an integrated circuit
US6302774B1 (en) * 2000-01-21 2001-10-16 Martin Thomas Black Orbital disc sander support
US6616513B1 (en) 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
US6776006B2 (en) 2000-10-13 2004-08-17 Corning Incorporated Method to avoid striae in EUV lithography mirrors
US6409580B1 (en) * 2001-03-26 2002-06-25 Speedfam-Ipec Corporation Rigid polishing pad conditioner for chemical mechanical polishing tool
JP2003019649A (ja) * 2001-07-05 2003-01-21 Seiko Instruments Inc 端面研磨装置
US20030083003A1 (en) * 2001-10-29 2003-05-01 West Thomas E. Polishing pads and manufacturing methods
US6702646B1 (en) 2002-07-01 2004-03-09 Nevmet Corporation Method and apparatus for monitoring polishing plate condition
KR100546355B1 (ko) * 2003-07-28 2006-01-26 삼성전자주식회사 국부 단차 형성용 삽입 패드를 구비하는 ｃｍｐ 장치
US7226959B2 (en) 2003-11-06 2007-06-05 Sun Chemical Corporation Water soluble energy curable stereo-crosslinkable ionomer compositions
US20070298687A1 (en) * 2006-06-22 2007-12-27 3M Innovative Properties Company Apparatus and method for modifying an edge
US20070298240A1 (en) * 2006-06-22 2007-12-27 Gobena Feben T Compressible abrasive article
TWI409868B (zh) * 2008-01-30 2013-09-21 Iv Technologies Co Ltd 研磨方法、研磨墊及研磨系統
WO2009137685A2 (en) * 2008-05-07 2009-11-12 Zygo Corporation Configuring of lapping and polishing machines
KR101583818B1 (ko) * 2014-09-30 2016-01-08 주식회사 케이씨텍 화학 기계적 연마 장치 및 이에 사용되는 연마 정반 조립체

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US3699722A (en) * 1970-11-23 1972-10-24 Radiation Inc Precision polishing of semiconductor crystal wafers
GB1592498A (en) * 1977-11-28 1981-07-08 Moskov Vysshee Tekh Uchilis Im Method of finishing workpiece on surface-lapping machines and machine for realization thereof
US4239567A (en) * 1978-10-16 1980-12-16 Western Electric Company, Inc. Removably holding planar articles for polishing operations
US4270314A (en) * 1979-09-17 1981-06-02 Speedfam Corporation Bearing mount for lapping machine pressure plate
DE3585200D1 (de) * 1984-10-15 1992-02-27 Nissei Ind Co Flachschleifmaschine.
US5234867A (en) * 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5081796A (en) * 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5154021A (en) * 1991-06-26 1992-10-13 International Business Machines Corporation Pneumatic pad conditioner
US5209705A (en) * 1992-05-29 1993-05-11 The Goodyear Tire & Rubber Company Synchronous drive belt with oblique and offset teeth
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5435772A (en) * 1993-04-30 1995-07-25 Motorola, Inc. Method of polishing a semiconductor substrate
US5394655A (en) * 1993-08-31 1995-03-07 Texas Instruments Incorporated Semiconductor polishing pad
JPH07297195A (ja) * 1994-04-27 1995-11-10 Speedfam Co Ltd 半導体装置の平坦化方法及び平坦化装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113246003A (zh) * 2021-06-07 2021-08-13 杨定萍 一种木材加工用杯垫抛光设备

Also Published As

Publication number Publication date
US5868605A (en) 1999-02-09
KR970000448A (ko) 1997-01-21
GB2301544B (en) 1999-07-14
SG50733A1 (en) 1998-07-20
JPH09103955A (ja) 1997-04-22
GB9611397D0 (en) 1996-08-07
DE19622004A1 (de) 1997-01-16
GB2301544A (en) 1996-12-11

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