TW281794B - - Google Patents
Info
- Publication number
- TW281794B TW281794B TW084103697A TW84103697A TW281794B TW 281794 B TW281794 B TW 281794B TW 084103697 A TW084103697 A TW 084103697A TW 84103697 A TW84103697 A TW 84103697A TW 281794 B TW281794 B TW 281794B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6327513A JPH08186222A (ja) | 1994-12-28 | 1994-12-28 | Ｉｃのリードの矯正方法及び矯正装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW281794B true TW281794B (fr) | 1996-07-21 |
Family
ID=18199965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084103697A TW281794B (fr) | 1994-12-28 | 1995-04-15 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH08186222A (fr) |
| KR (1) | KR0178082B1 (fr) |
| CN (1) | CN1125897A (fr) |
| TW (1) | TW281794B (fr) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4734857B2 (ja) * | 2004-06-25 | 2011-07-27 | シンフォニアテクノロジー株式会社 | Ｉｃチップ実装体の製造装置 |
| CN106879245A (zh) * | 2012-02-08 | 2017-06-20 | Juki株式会社 | 电子部件安装装置、电子部件安装系统以及电子部件安装方法 |
| CN102738011A (zh) * | 2012-07-09 | 2012-10-17 | 上海华岭集成电路技术股份有限公司 | 芯片引脚调整装置 |
| CN103182462B (zh) * | 2013-02-26 | 2014-11-19 | 山东迪一电子科技有限公司 | 电子元件引线校直机 |
| CN107204305B (zh) * | 2017-04-28 | 2019-07-23 | 北京时代民芯科技有限公司 | 一种便携式扁平封装电路引线检查与整形装置 |
| CN108213123B (zh) * | 2017-12-29 | 2023-08-29 | 上海富驰高科技股份有限公司 | 一种医用取样钳的整形装置及使用方法 |
| CN108376649B (zh) * | 2018-04-12 | 2023-10-10 | 盐城芯丰微电子有限公司 | 用于qfp半导体器件的整形装置 |
| JP7411904B2 (ja) * | 2019-04-16 | 2024-01-12 | パナソニックＩｐマネジメント株式会社 | 部品供給装置および部品実装装置ならびに部品供給方法 |
| CN110586804A (zh) * | 2019-09-04 | 2019-12-20 | 珠海智新自动化科技有限公司 | 一种多引脚整形机构 |
| CN115132603B (zh) * | 2022-08-31 | 2022-11-15 | 徐州领测半导体科技有限公司 | 一种半导体芯片检测装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0412560A (ja) * | 1990-05-01 | 1992-01-17 | Futaba Corp | Ｉｃリード端子の矯正方法 |
| JPH06295968A (ja) * | 1991-12-02 | 1994-10-21 | Meiritsu Kikai Kogyo:Kk | デジタル素子のリード配列修正方法および修正装置 |
| JPH0730031A (ja) * | 1993-07-09 | 1995-01-31 | Nec Corp | リード成形方法 |
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1994
- 1994-12-28 JP JP6327513A patent/JPH08186222A/ja active Pending
-
1995
- 1995-04-15 TW TW084103697A patent/TW281794B/zh active
- 1995-07-04 KR KR1019950019382A patent/KR0178082B1/ko not_active IP Right Cessation
- 1995-07-10 CN CN95109918A patent/CN1125897A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR960026715A (ko) | 1996-07-22 |
| CN1125897A (zh) | 1996-07-03 |
| KR0178082B1 (ko) | 1999-03-20 |
| JPH08186222A (ja) | 1996-07-16 |