TW280782B - - Google Patents

Info

Publication number
TW280782B
TW280782B TW083108440A TW83108440A TW280782B TW 280782 B TW280782 B TW 280782B TW 083108440 A TW083108440 A TW 083108440A TW 83108440 A TW83108440 A TW 83108440A TW 280782 B TW280782 B TW 280782B
Authority
TW
Taiwan
Application number
TW083108440A
Other languages
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Tel Kyushu Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd, Tel Kyushu Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW280782B publication Critical patent/TW280782B/zh

Links

Classifications

    • H10P52/00
    • H10P72/0416
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer
TW083108440A 1993-08-18 1994-09-13 TW280782B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22649693 1993-08-18

Publications (1)

Publication Number Publication Date
TW280782B true TW280782B (OSRAM) 1996-07-11

Family

ID=16846023

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083108440A TW280782B (OSRAM) 1993-08-18 1994-09-13

Country Status (3)

Country Link
US (1) US5482068A (OSRAM)
KR (1) KR100236412B1 (OSRAM)
TW (1) TW280782B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104868018B (zh) * 2014-02-21 2017-06-13 台湾积体电路制造股份有限公司 化学浴沉积的方法和系统

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
US6630052B1 (en) * 1996-06-26 2003-10-07 Lg. Philips Lcd Co., Ltd. Apparatus for etching glass substrate
DE19644253A1 (de) * 1996-10-24 1998-05-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
US6009890A (en) * 1997-01-21 2000-01-04 Tokyo Electron Limited Substrate transporting and processing system
US6273107B1 (en) * 1997-12-05 2001-08-14 Texas Instruments Incorporated Positive flow, positive displacement rinse tank
JPH11274282A (ja) 1998-03-23 1999-10-08 Toshiba Corp 基板収納容器、基板収納容器清浄化装置、基板収納容器清浄化方法および基板処理装置
JPH11354478A (ja) * 1998-05-29 1999-12-24 Lsi Logic Corp マイクロバブル付着防止装置
US6539963B1 (en) * 1999-07-14 2003-04-01 Micron Technology, Inc. Pressurized liquid diffuser
DE19960241A1 (de) * 1999-12-14 2001-07-05 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
JP2002164409A (ja) * 2000-11-29 2002-06-07 Tokyo Electron Ltd 移送装置,基板処理装置及び基板処理システム
US6500274B2 (en) * 2001-01-16 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for wet cleaning wafers without ammonia vapor damage
US20090029560A1 (en) * 2001-12-07 2009-01-29 Applied Materials, Inc. Apparatus and method for single substrate processing
US7582180B2 (en) * 2004-08-19 2009-09-01 Micron Technology, Inc. Systems and methods for processing microfeature workpieces
US8863763B1 (en) 2009-05-27 2014-10-21 WD Media, LLC Sonication cleaning with a particle counter
US8404056B1 (en) 2009-05-27 2013-03-26 WD Media, LLC Process control for a sonication cleaning tank
US10297472B2 (en) * 2012-11-28 2019-05-21 Acm Research (Shanghai) Inc. Method and apparatus for cleaning semiconductor wafer
JP6450653B2 (ja) * 2015-06-24 2019-01-09 東京エレクトロン株式会社 格納ユニット、搬送装置、及び、基板処理システム
JP6971124B2 (ja) * 2017-10-24 2021-11-24 東京エレクトロン株式会社 基板処理装置
CN109365382B (zh) * 2018-10-25 2024-03-12 广东西江数据科技有限公司 一种服务器清洗设备及其清洗方法
JP7178261B2 (ja) * 2018-12-27 2022-11-25 東京エレクトロン株式会社 基板液処理装置
JP7381370B2 (ja) * 2020-03-05 2023-11-15 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
US11508596B2 (en) 2020-05-28 2022-11-22 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and methods for automatically handling die carriers
TWI837779B (zh) 2022-03-16 2024-04-01 日商鎧俠股份有限公司 基板處理裝置
DE102023205058A1 (de) * 2023-05-31 2024-12-05 Singulus Technologies Aktiengesellschaft Vorrichtung und Verfahren zur Behandlung von Wafern unter Verwendung von Trennelementen
DE102023205059A1 (de) * 2023-05-31 2024-12-05 Singulus Technologies Aktiengesellschaft Vorrichtung und Verfahren zur Behandlung von Wafern unter Verwendung von Führungselementen

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000795A (en) * 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
JPH0456321A (ja) * 1990-06-26 1992-02-24 Fujitsu Ltd 半導体ウエハの洗浄装置
JPH05166793A (ja) * 1991-12-16 1993-07-02 Dainippon Screen Mfg Co Ltd 浸漬型基板処理装置
US5327921A (en) * 1992-03-05 1994-07-12 Tokyo Electron Limited Processing vessel for a wafer washing system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104868018B (zh) * 2014-02-21 2017-06-13 台湾积体电路制造股份有限公司 化学浴沉积的方法和系统

Also Published As

Publication number Publication date
KR950007014A (ko) 1995-03-21
US5482068A (en) 1996-01-09
KR100236412B1 (ko) 1999-12-15

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