TW270216B - - Google Patents

Info

Publication number
TW270216B
TW270216B TW084101427A TW84101427A TW270216B TW 270216 B TW270216 B TW 270216B TW 084101427 A TW084101427 A TW 084101427A TW 84101427 A TW84101427 A TW 84101427A TW 270216 B TW270216 B TW 270216B
Authority
TW
Taiwan
Application number
TW084101427A
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TW270216B publication Critical patent/TW270216B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW084101427A 1980-03-03 1995-02-16 TW270216B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/126,807 US4316757A (en) 1980-03-03 1980-03-03 Method and apparatus for wax mounting of thin wafers for polishing

Publications (1)

Publication Number Publication Date
TW270216B true TW270216B (zh) 1996-02-11

Family

ID=22426787

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084101427A TW270216B (zh) 1980-03-03 1995-02-16

Country Status (7)

Country Link
US (1) US4316757A (zh)
JP (1) JPS571656A (zh)
KR (1) KR850001056B1 (zh)
DE (1) DE3107995A1 (zh)
GB (1) GB2079532B (zh)
IT (1) IT1194026B (zh)
TW (1) TW270216B (zh)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
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US4463927A (en) * 1983-02-24 1984-08-07 The United States Of America As Represented By The United States Department Of Energy Apparatus for sectioning demountable semiconductor samples
NL8702493A (nl) * 1986-10-31 1988-05-16 Seiko Epson Corp Optisch opnamemedium en werkwijze voor het vervaardigen daarvan.
US4818323A (en) * 1987-06-26 1989-04-04 Motorola Inc. Method of making a void free wafer via vacuum lamination
JPH07264B2 (ja) * 1987-08-10 1995-01-11 住友電気工業株式会社 半導体ウエハの貼付方法および装置
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
US5160560A (en) * 1988-06-02 1992-11-03 Hughes Aircraft Company Method of producing optically flat surfaces on processed silicon wafers
US5217563A (en) * 1988-12-01 1993-06-08 Bayer Aktiengesellschaft Apparatus for producing a deep-drawn formed plastic piece
JP2648638B2 (ja) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 ウェーハの接着方法およびその装置
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5273615A (en) * 1992-04-06 1993-12-28 Motorola, Inc. Apparatus and method for handling fragile semiconductor wafers
US5256599A (en) * 1992-06-01 1993-10-26 Motorola, Inc. Semiconductor wafer wax mounting and thinning process
US5476566A (en) * 1992-09-02 1995-12-19 Motorola, Inc. Method for thinning a semiconductor wafer
JPH06131705A (ja) * 1992-10-16 1994-05-13 Hitachi Ltd 光ディスク貼り合わせ装置
JPH0737768A (ja) * 1992-11-26 1995-02-07 Sumitomo Electric Ind Ltd 半導体ウェハの補強方法及び補強された半導体ウェハ
US5300175A (en) * 1993-01-04 1994-04-05 Motorola, Inc. Method for mounting a wafer to a submount
US5534053A (en) * 1993-01-12 1996-07-09 Rodel, Inc. Composition for reducing or eliminating static charge in adhesive film
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5556493A (en) * 1995-01-13 1996-09-17 Libbey-Owens-Ford Co. Mounting an optical moisture sensor on a windshield using a vacuum chamber device
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
JP3055401B2 (ja) * 1994-08-29 2000-06-26 信越半導体株式会社 ワークの平面研削方法及び装置
DE19616073A1 (de) * 1996-04-23 1997-10-30 Teves Gmbh Alfred Vorrichtung zum blasenfreien Fixieren von zu klebenden Komponenten
US5972780A (en) * 1996-08-22 1999-10-26 Nippon Telegraph Telephone Corporation Thin film forming apparatus and method
US5716258A (en) * 1996-11-26 1998-02-10 Metcalf; Robert L. Semiconductor wafer polishing machine and method
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US5975998A (en) * 1997-09-26 1999-11-02 Memc Electronic Materials , Inc. Wafer processing apparatus
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US5948699A (en) * 1997-11-21 1999-09-07 Sibond, L.L.C. Wafer backing insert for free mount semiconductor polishing apparatus and process
DE19816150A1 (de) * 1998-04-09 1999-10-21 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zur Herstellung einer partikelfreien Klebeverbindung
US6222145B1 (en) * 1998-10-29 2001-04-24 International Business Machines Corporation Mechanical strength die sorting
JP3537688B2 (ja) * 1998-11-24 2004-06-14 富士通株式会社 磁気ヘッドの加工方法
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6431959B1 (en) 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6479386B1 (en) * 2000-02-16 2002-11-12 Memc Electronic Materials, Inc. Process for reducing surface variations for polished wafer
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
DE10048881A1 (de) * 2000-09-29 2002-03-07 Infineon Technologies Ag Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers
DE10054159A1 (de) * 2000-11-02 2002-05-16 Wacker Siltronic Halbleitermat Verfahren zur Montage von Halbleiterscheiben
JP3883929B2 (ja) * 2001-09-25 2007-02-21 大日本スクリーン製造株式会社 薄膜形成装置および薄膜形成方法
FR2831148B1 (fr) 2001-10-22 2004-01-02 Gemplus Card Int Procede et dispositif de manipulation d'un wafer
JP4565804B2 (ja) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
DE10242402A1 (de) * 2002-09-12 2004-04-01 Süss MicroTec Laboratory Equipment GmbH Vorrichtung und Verfahren für das Verbinden von Objekten
JP2005150235A (ja) * 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
DE102005051346B4 (de) * 2005-10-25 2011-02-10 Thallner, Erich, Dipl.-Ing. Träger für einen Wafer, Kombination aus einem Träger und einem Wafer sowie Verfahren zur Handhabung des Trägers
US20080029977A1 (en) * 2006-08-03 2008-02-07 Prime View International Co., Ltd. Chuck for a photoresist spin coater
DE102007042694A1 (de) * 2007-09-07 2009-03-12 Magna Electronics Europe Gmbh & Co.Kg Sensormodul
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
DE102009052744B4 (de) * 2009-11-11 2013-08-29 Siltronic Ag Verfahren zur Politur einer Halbleiterscheibe
JP5545640B2 (ja) * 2010-05-11 2014-07-09 株式会社ディスコ 研削方法
CN104332432B (zh) * 2014-10-15 2017-09-01 江西德义半导体科技有限公司 一种贴蜡装置及其加工方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1577469A1 (de) 1966-05-24 1970-05-06 Siemens Ag Verfahren zum Herstellen von Halbleiterscheiben gleichmaessiger Dicke durch mechanische Oberflaechenbearbeitung
US3475867A (en) * 1966-12-20 1969-11-04 Monsanto Co Processing of semiconductor wafers
DE1652170B2 (de) * 1967-03-03 1975-05-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum gleichzeitigen stirnseitigen Abarbeiten gleichdicker Werkstoffschichten an mehreren unterschiedlich dicken Halbleiterscheiben
US3492763A (en) * 1967-09-18 1970-02-03 Monsanto Co Method and apparatus for mounting semiconductor slices
US3681171A (en) * 1968-08-23 1972-08-01 Hitachi Ltd Apparatus for producing a multilayer printed circuit plate assembly
US3970494A (en) * 1975-04-18 1976-07-20 Western Electric Co., Inc. Method for adhering one surface to another
US4067764A (en) * 1977-03-15 1978-01-10 Sierracin Corporation Method of manufacture of solar cell panel
DE2712521C2 (de) * 1977-03-22 1987-03-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Aufkitten von Scheiben
JPS6035250B2 (ja) * 1978-06-19 1985-08-13 松下電器産業株式会社 可撓性フイルムの接着方法

Also Published As

Publication number Publication date
US4316757A (en) 1982-02-23
KR830005721A (ko) 1983-09-09
JPS571656A (en) 1982-01-06
GB2079532A (en) 1982-01-20
DE3107995A1 (de) 1982-01-28
KR850001056B1 (ko) 1985-07-25
IT8120086A0 (it) 1981-03-02
GB2079532B (en) 1984-02-22
IT1194026B (it) 1988-08-31

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