TW269657B - Lead-free low melting solder with improved mechanical properties - Google Patents

Lead-free low melting solder with improved mechanical properties

Info

Publication number
TW269657B
TW269657B TW084102154A TW84102154A TW269657B TW 269657 B TW269657 B TW 269657B TW 084102154 A TW084102154 A TW 084102154A TW 84102154 A TW84102154 A TW 84102154A TW 269657 B TW269657 B TW 269657B
Authority
TW
Taiwan
Prior art keywords
solder
lead
mechanical properties
low melting
improved mechanical
Prior art date
Application number
TW084102154A
Other languages
English (en)
Inventor
Ho-Sou Chen
Sungho Jin
Mark Thomas Mccormack
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Application granted granted Critical
Publication of TW269657B publication Critical patent/TW269657B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW084102154A 1994-11-08 1995-03-07 Lead-free low melting solder with improved mechanical properties TW269657B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/335,619 US5569433A (en) 1994-11-08 1994-11-08 Lead-free low melting solder with improved mechanical properties

Publications (1)

Publication Number Publication Date
TW269657B true TW269657B (en) 1996-02-01

Family

ID=23312549

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084102154A TW269657B (en) 1994-11-08 1995-03-07 Lead-free low melting solder with improved mechanical properties

Country Status (5)

Country Link
US (1) US5569433A (zh)
EP (1) EP0711629B1 (zh)
KR (1) KR100400121B1 (zh)
DE (1) DE69521762T2 (zh)
TW (1) TW269657B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109352208A (zh) * 2018-11-21 2019-02-19 华南理工大学 一种Sn-Bi系低银无铅钎料合金及其制备方法

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
JP3592486B2 (ja) 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置
JP3622462B2 (ja) * 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
US6204490B1 (en) * 1998-06-04 2001-03-20 Hitachi, Ltd. Method and apparatus of manufacturing an electronic circuit board
US6451127B1 (en) 1999-06-01 2002-09-17 Motorola, Inc. Conductive paste and semiconductor component having conductive bumps made from the conductive paste
JP4338854B2 (ja) * 1999-11-25 2009-10-07 三井金属鉱業株式会社 スズ−ビスマス系無鉛はんだ
US6503338B1 (en) * 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品
JP2002217434A (ja) * 2001-01-19 2002-08-02 Sharp Corp 太陽電池、太陽電池用インターコネクターおよびストリング
DE10117404A1 (de) * 2001-04-06 2002-10-17 Paff Stannol Loetmittel Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
GB0302230D0 (en) * 2003-01-30 2003-03-05 Pilkington Plc Vehicular glazing panel
JP4230251B2 (ja) * 2003-03-04 2009-02-25 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用材料
US20050085062A1 (en) * 2003-10-15 2005-04-21 Semitool, Inc. Processes and tools for forming lead-free alloy solder precursors
JP4799997B2 (ja) * 2005-10-25 2011-10-26 富士通株式会社 電子機器用プリント板の製造方法およびこれを用いた電子機器
KR100790978B1 (ko) * 2006-01-24 2008-01-02 삼성전자주식회사 저온에서의 접합 방법, 및 이를 이용한 반도체 패키지 실장 방법
JP5411503B2 (ja) * 2006-08-28 2014-02-12 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法並びに回路基板
EP2183076A1 (en) * 2007-07-23 2010-05-12 Henkel Limited Solder flux
EP2096905A1 (en) * 2008-02-26 2009-09-02 ROAL ELECTRONICS S.p.A. Process for mounting electronic and/or electro-optical devices on an electronic board
KR100996650B1 (ko) 2008-06-25 2010-11-26 서경대학교 산학협력단 저융점 나노 잉크 제조 방법
JP4811437B2 (ja) * 2008-08-11 2011-11-09 日本テキサス・インスツルメンツ株式会社 Ｉｃチップ上への電子部品の実装
DE202011100906U1 (de) * 2011-05-03 2011-06-09 FEW Fahrzeugelektrikwerk GmbH & Co. KG, 04442 Elektrisches Anschlusselement
KR20210008568A (ko) * 2011-08-02 2021-01-22 알파 어셈블리 솔루션스 인크. 고 충격 인성 땜납 합금
EP3766631A3 (en) 2011-08-02 2021-03-24 Alpha Assembly Solutions Inc. Solder compositions
EP2834037A4 (en) * 2012-03-20 2016-03-16 Alpha Metals LOTFORFORM AND SOLDER ALLOY ASSEMBLY METHOD
CN107076858A (zh) 2015-05-26 2017-08-18 西门子医疗有限公司 辐射检测器设备
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物
EP3718678A1 (de) * 2019-04-03 2020-10-07 Felder GmbH Löttechnik Verfahren zur herstellung eines snbi-lötdrahtes, lötdraht und vorrichtung
US11267080B2 (en) * 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
DE102020105180A1 (de) * 2020-02-27 2021-09-02 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät
US20230241725A1 (en) * 2022-01-19 2023-08-03 Ning-Cheng Lee Solder pastes and methods of using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2712517C2 (de) * 1977-03-22 1979-05-23 Et. Dentaire Ivoclar, Schaan (Liechtenstein) Verwendung einer Wismut-Zinn-Legierung zur Herstellung von Modellen in der Zahntechnik
US5320272A (en) * 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5389160A (en) * 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109352208A (zh) * 2018-11-21 2019-02-19 华南理工大学 一种Sn-Bi系低银无铅钎料合金及其制备方法
CN109352208B (zh) * 2018-11-21 2021-07-20 华南理工大学 一种Sn-Bi系低银无铅钎料合金及其制备方法

Also Published As

Publication number Publication date
KR100400121B1 (ko) 2004-06-23
DE69521762D1 (de) 2001-08-23
DE69521762T2 (de) 2002-05-23
EP0711629B1 (en) 2001-07-18
KR960017041A (ko) 1996-06-17
EP0711629A1 (en) 1996-05-15
US5569433A (en) 1996-10-29

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