DE69521762D1 - Bleifreies niedrigschmelzendes Lot mit verbesserten mechanischen Eigenschaften und mit diesem Lot verbundene Gegenstände - Google Patents
Bleifreies niedrigschmelzendes Lot mit verbesserten mechanischen Eigenschaften und mit diesem Lot verbundene GegenständeInfo
- Publication number
- DE69521762D1 DE69521762D1 DE69521762T DE69521762T DE69521762D1 DE 69521762 D1 DE69521762 D1 DE 69521762D1 DE 69521762 T DE69521762 T DE 69521762T DE 69521762 T DE69521762 T DE 69521762T DE 69521762 D1 DE69521762 D1 DE 69521762D1
- Authority
- DE
- Germany
- Prior art keywords
- solder
- lead
- free
- low
- mechanical properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/335,619 US5569433A (en) | 1994-11-08 | 1994-11-08 | Lead-free low melting solder with improved mechanical properties |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69521762D1 true DE69521762D1 (de) | 2001-08-23 |
DE69521762T2 DE69521762T2 (de) | 2002-05-23 |
Family
ID=23312549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69521762T Expired - Lifetime DE69521762T2 (de) | 1994-11-08 | 1995-11-01 | Bleifreies niedrigschmelzendes Lot mit verbesserten mechanischen Eigenschaften und mit diesem Lot verbundene Gegenstände |
Country Status (5)
Country | Link |
---|---|
US (1) | US5569433A (de) |
EP (1) | EP0711629B1 (de) |
KR (1) | KR100400121B1 (de) |
DE (1) | DE69521762T2 (de) |
TW (1) | TW269657B (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6184475B1 (en) * | 1994-09-29 | 2001-02-06 | Fujitsu Limited | Lead-free solder composition with Bi, In and Sn |
JP3592486B2 (ja) | 1997-06-18 | 2004-11-24 | 株式会社東芝 | ハンダ付け装置 |
JP3622462B2 (ja) * | 1997-12-16 | 2005-02-23 | 株式会社日立製作所 | 半導体装置 |
US6156132A (en) * | 1998-02-05 | 2000-12-05 | Fuji Electric Co., Ltd. | Solder alloys |
US6204490B1 (en) * | 1998-06-04 | 2001-03-20 | Hitachi, Ltd. | Method and apparatus of manufacturing an electronic circuit board |
US6451127B1 (en) | 1999-06-01 | 2002-09-17 | Motorola, Inc. | Conductive paste and semiconductor component having conductive bumps made from the conductive paste |
JP4338854B2 (ja) * | 1999-11-25 | 2009-10-07 | 三井金属鉱業株式会社 | スズ−ビスマス系無鉛はんだ |
US6503338B1 (en) * | 2000-04-28 | 2003-01-07 | Senju Metal Industry Co., Ltd. | Lead-free solder alloys |
JP3671815B2 (ja) * | 2000-06-12 | 2005-07-13 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
JP2002217434A (ja) * | 2001-01-19 | 2002-08-02 | Sharp Corp | 太陽電池、太陽電池用インターコネクターおよびストリング |
DE10117404A1 (de) * | 2001-04-06 | 2002-10-17 | Paff Stannol Loetmittel | Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten |
GB2380964B (en) | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
GB0302230D0 (en) * | 2003-01-30 | 2003-03-05 | Pilkington Plc | Vehicular glazing panel |
JP4230251B2 (ja) * | 2003-03-04 | 2009-02-25 | 内橋エステック株式会社 | 合金型温度ヒューズ及び温度ヒューズエレメント用材料 |
US20050085062A1 (en) * | 2003-10-15 | 2005-04-21 | Semitool, Inc. | Processes and tools for forming lead-free alloy solder precursors |
JP4799997B2 (ja) * | 2005-10-25 | 2011-10-26 | 富士通株式会社 | 電子機器用プリント板の製造方法およびこれを用いた電子機器 |
KR100790978B1 (ko) * | 2006-01-24 | 2008-01-02 | 삼성전자주식회사 | 저온에서의 접합 방법, 및 이를 이용한 반도체 패키지 실장 방법 |
JP5411503B2 (ja) * | 2006-08-28 | 2014-02-12 | パナソニック株式会社 | 熱硬化性樹脂組成物及びその製造方法並びに回路基板 |
EP2183076A1 (de) * | 2007-07-23 | 2010-05-12 | Henkel Limited | Lötflussmittel |
EP2096905A1 (de) * | 2008-02-26 | 2009-09-02 | ROAL ELECTRONICS S.p.A. | Verfahren zum Aufbauen von elektronischen und/oder elektrooptischen Vorrichtungen auf einer Elektroleiterplatte |
KR100996650B1 (ko) | 2008-06-25 | 2010-11-26 | 서경대학교 산학협력단 | 저융점 나노 잉크 제조 방법 |
JP4811437B2 (ja) * | 2008-08-11 | 2011-11-09 | 日本テキサス・インスツルメンツ株式会社 | Icチップ上への電子部品の実装 |
DE202011100906U1 (de) * | 2011-05-03 | 2011-06-09 | FEW Fahrzeugelektrikwerk GmbH & Co. KG, 04442 | Elektrisches Anschlusselement |
KR20210008568A (ko) * | 2011-08-02 | 2021-01-22 | 알파 어셈블리 솔루션스 인크. | 고 충격 인성 땜납 합금 |
EP3766631A3 (de) | 2011-08-02 | 2021-03-24 | Alpha Assembly Solutions Inc. | Lötzusammensetzungen |
EP2834037A4 (de) * | 2012-03-20 | 2016-03-16 | Alpha Metals | Lotvorformen und lötlegierungsmontageverfahren |
CN107076858A (zh) | 2015-05-26 | 2017-08-18 | 西门子医疗有限公司 | 辐射检测器设备 |
JP6548537B2 (ja) * | 2015-09-10 | 2019-07-24 | 株式会社弘輝 | はんだ合金及びはんだ組成物 |
CN109352208B (zh) * | 2018-11-21 | 2021-07-20 | 华南理工大学 | 一种Sn-Bi系低银无铅钎料合金及其制备方法 |
EP3718678A1 (de) * | 2019-04-03 | 2020-10-07 | Felder GmbH Löttechnik | Verfahren zur herstellung eines snbi-lötdrahtes, lötdraht und vorrichtung |
US11267080B2 (en) * | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
DE102020105180A1 (de) * | 2020-02-27 | 2021-09-02 | Endress+Hauser SE+Co. KG | Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät |
US20230241725A1 (en) * | 2022-01-19 | 2023-08-03 | Ning-Cheng Lee | Solder pastes and methods of using the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2712517C2 (de) * | 1977-03-22 | 1979-05-23 | Et. Dentaire Ivoclar, Schaan (Liechtenstein) | Verwendung einer Wismut-Zinn-Legierung zur Herstellung von Modellen in der Zahntechnik |
US5320272A (en) * | 1993-04-02 | 1994-06-14 | Motorola, Inc. | Tin-bismuth solder connection having improved high temperature properties, and process for forming same |
US5389160A (en) * | 1993-06-01 | 1995-02-14 | Motorola, Inc. | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
US5368814A (en) * | 1993-06-16 | 1994-11-29 | International Business Machines, Inc. | Lead free, tin-bismuth solder alloys |
-
1994
- 1994-11-08 US US08/335,619 patent/US5569433A/en not_active Expired - Lifetime
-
1995
- 1995-03-07 TW TW084102154A patent/TW269657B/zh active
- 1995-11-01 DE DE69521762T patent/DE69521762T2/de not_active Expired - Lifetime
- 1995-11-01 EP EP95307804A patent/EP0711629B1/de not_active Expired - Lifetime
- 1995-11-07 KR KR1019950040016A patent/KR100400121B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW269657B (en) | 1996-02-01 |
KR100400121B1 (ko) | 2004-06-23 |
DE69521762T2 (de) | 2002-05-23 |
EP0711629B1 (de) | 2001-07-18 |
KR960017041A (ko) | 1996-06-17 |
EP0711629A1 (de) | 1996-05-15 |
US5569433A (en) | 1996-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |