DE69521762D1 - Bleifreies niedrigschmelzendes Lot mit verbesserten mechanischen Eigenschaften und mit diesem Lot verbundene Gegenstände - Google Patents

Bleifreies niedrigschmelzendes Lot mit verbesserten mechanischen Eigenschaften und mit diesem Lot verbundene Gegenstände

Info

Publication number
DE69521762D1
DE69521762D1 DE69521762T DE69521762T DE69521762D1 DE 69521762 D1 DE69521762 D1 DE 69521762D1 DE 69521762 T DE69521762 T DE 69521762T DE 69521762 T DE69521762 T DE 69521762T DE 69521762 D1 DE69521762 D1 DE 69521762D1
Authority
DE
Germany
Prior art keywords
solder
lead
free
low
mechanical properties
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69521762T
Other languages
English (en)
Other versions
DE69521762T2 (de
Inventor
Ho Sou Chen
Mark T Mccormack
Sungho Jin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69521762D1 publication Critical patent/DE69521762D1/de
Application granted granted Critical
Publication of DE69521762T2 publication Critical patent/DE69521762T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69521762T 1994-11-08 1995-11-01 Bleifreies niedrigschmelzendes Lot mit verbesserten mechanischen Eigenschaften und mit diesem Lot verbundene Gegenstände Expired - Lifetime DE69521762T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/335,619 US5569433A (en) 1994-11-08 1994-11-08 Lead-free low melting solder with improved mechanical properties

Publications (2)

Publication Number Publication Date
DE69521762D1 true DE69521762D1 (de) 2001-08-23
DE69521762T2 DE69521762T2 (de) 2002-05-23

Family

ID=23312549

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69521762T Expired - Lifetime DE69521762T2 (de) 1994-11-08 1995-11-01 Bleifreies niedrigschmelzendes Lot mit verbesserten mechanischen Eigenschaften und mit diesem Lot verbundene Gegenstände

Country Status (5)

Country Link
US (1) US5569433A (de)
EP (1) EP0711629B1 (de)
KR (1) KR100400121B1 (de)
DE (1) DE69521762T2 (de)
TW (1) TW269657B (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
JP3592486B2 (ja) 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置
JP3622462B2 (ja) 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
US6204490B1 (en) * 1998-06-04 2001-03-20 Hitachi, Ltd. Method and apparatus of manufacturing an electronic circuit board
US6451127B1 (en) 1999-06-01 2002-09-17 Motorola, Inc. Conductive paste and semiconductor component having conductive bumps made from the conductive paste
JP4338854B2 (ja) * 1999-11-25 2009-10-07 三井金属鉱業株式会社 スズ−ビスマス系無鉛はんだ
US6503338B1 (en) * 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品
JP2002217434A (ja) * 2001-01-19 2002-08-02 Sharp Corp 太陽電池、太陽電池用インターコネクターおよびストリング
DE10117404A1 (de) * 2001-04-06 2002-10-17 Paff Stannol Loetmittel Verfahren zum Löten von elektronischen Baugruppen mit niedrig schmelzenden Weichloten
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
GB0302230D0 (en) * 2003-01-30 2003-03-05 Pilkington Plc Vehicular glazing panel
JP4230251B2 (ja) 2003-03-04 2009-02-25 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用材料
US20050085062A1 (en) * 2003-10-15 2005-04-21 Semitool, Inc. Processes and tools for forming lead-free alloy solder precursors
JP4799997B2 (ja) * 2005-10-25 2011-10-26 富士通株式会社 電子機器用プリント板の製造方法およびこれを用いた電子機器
KR100790978B1 (ko) * 2006-01-24 2008-01-02 삼성전자주식회사 저온에서의 접합 방법, 및 이를 이용한 반도체 패키지 실장 방법
CN101437900B (zh) 2006-08-28 2012-09-19 松下电器产业株式会社 热固性树脂组合物、其制备方法及电路板
EP2183076A1 (de) * 2007-07-23 2010-05-12 Henkel Limited Lötflussmittel
EP2096905A1 (de) * 2008-02-26 2009-09-02 ROAL ELECTRONICS S.p.A. Verfahren zum Aufbauen von elektronischen und/oder elektrooptischen Vorrichtungen auf einer Elektroleiterplatte
KR100996650B1 (ko) 2008-06-25 2010-11-26 서경대학교 산학협력단 저융점 나노 잉크 제조 방법
JP4811437B2 (ja) * 2008-08-11 2011-11-09 日本テキサス・インスツルメンツ株式会社 Ｉｃチップ上への電子部品の実装
DE202011100906U1 (de) * 2011-05-03 2011-06-09 FEW Fahrzeugelektrikwerk GmbH & Co. KG, 04442 Elektrisches Anschlusselement
EP3907037A1 (de) 2011-08-02 2021-11-10 Alpha Assembly Solutions Inc. Lötlegierung mit hoher kerbschlagzähigkeit
RU2627822C2 (ru) 2011-08-02 2017-08-11 Альфа Эссембли Солюшнз Инк. Составы для припоя
KR102087004B1 (ko) * 2012-03-20 2020-03-10 알파 어셈블리 솔루션스 인크. 솔더 프리폼과 솔더 합금 조립 방법
JP6356351B2 (ja) 2015-05-26 2018-07-11 シーメンス ヘルスケア ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 放射線検出装置
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物
CN109352208B (zh) * 2018-11-21 2021-07-20 华南理工大学 一种Sn-Bi系低银无铅钎料合金及其制备方法
EP3718678A1 (de) * 2019-04-03 2020-10-07 Felder GmbH Löttechnik Verfahren zur herstellung eines snbi-lötdrahtes, lötdraht und vorrichtung
US11267080B2 (en) * 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
DE102020105180A1 (de) * 2020-02-27 2021-09-02 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät
US20230241725A1 (en) * 2022-01-19 2023-08-03 Ning-Cheng Lee Solder pastes and methods of using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2712517C2 (de) * 1977-03-22 1979-05-23 Et. Dentaire Ivoclar, Schaan (Liechtenstein) Verwendung einer Wismut-Zinn-Legierung zur Herstellung von Modellen in der Zahntechnik
US5320272A (en) * 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5389160A (en) * 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys

Also Published As

Publication number Publication date
TW269657B (en) 1996-02-01
US5569433A (en) 1996-10-29
DE69521762T2 (de) 2002-05-23
KR960017041A (ko) 1996-06-17
EP0711629B1 (de) 2001-07-18
KR100400121B1 (ko) 2004-06-23
EP0711629A1 (de) 1996-05-15

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