TW267294B - - Google Patents

Info

Publication number
TW267294B
TW267294B TW083112143A TW83112143A TW267294B TW 267294 B TW267294 B TW 267294B TW 083112143 A TW083112143 A TW 083112143A TW 83112143 A TW83112143 A TW 83112143A TW 267294 B TW267294 B TW 267294B
Authority
TW
Taiwan
Application number
TW083112143A
Other languages
Chinese (zh)
Original Assignee
Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics Nv filed Critical Philips Electronics Nv
Application granted granted Critical
Publication of TW267294B publication Critical patent/TW267294B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/022—Feeding of components with orientation of the elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Collation Of Sheets And Webs (AREA)
TW083112143A 1993-12-10 1994-12-24 TW267294B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9301370A BE1007866A3 (nl) 1993-12-10 1993-12-10 Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager.

Publications (1)

Publication Number Publication Date
TW267294B true TW267294B (OSRAM) 1996-01-01

Family

ID=3887628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083112143A TW267294B (OSRAM) 1993-12-10 1994-12-24

Country Status (7)

Country Link
US (1) US5680699A (OSRAM)
EP (1) EP0658080B1 (OSRAM)
JP (1) JP3548615B2 (OSRAM)
KR (1) KR100327455B1 (OSRAM)
BE (1) BE1007866A3 (OSRAM)
DE (1) DE69417168T2 (OSRAM)
TW (1) TW267294B (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324752B1 (en) 1999-11-05 2001-12-04 U.S. Philips Corporation Component placement machine
WO2002037921A1 (en) 2000-11-02 2002-05-10 Koninklijke Philips Electronics N.V. Component placement machine
NL1024819C2 (nl) * 2003-11-20 2005-05-23 Fico Bv Inrichting en werkwijze voor het productafhankelijk instellen van een inrichting voor het verwerken van een drager met elektronische componenten.
TWI331491B (en) * 2007-04-04 2010-10-01 Unimicron Technology Corp Apparatus for transplanting multi-circuit boards
FR2926890B1 (fr) * 2008-01-30 2011-01-07 St Microelectronics Grenoble Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques
CN115009676B (zh) * 2022-05-31 2023-06-20 安徽明天氢能科技股份有限公司 一种燃料电池极板转运工装

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1294973A (OSRAM) * 1969-02-12 1972-11-01
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3949925A (en) * 1974-10-03 1976-04-13 The Jade Corporation Outer lead bonder
US4624358A (en) * 1983-03-07 1986-11-25 Tokyo Shibaura Denki Kabushiki Kaisha Device for transferring lead frame
US4943342A (en) * 1988-08-29 1990-07-24 Golemon Valia S Component feeding device for circuit board mounting apparatus
DE3919080A1 (de) * 1989-06-10 1990-12-13 Georg Sillner Vorrichtung zum einsetzen von bauteilen, insbesondere elektrischen bauteilen in ausnehmungen eines gurtes
WO1991012109A1 (fr) * 1990-02-06 1991-08-22 Citizen Watch Co., Ltd. Procede et dispositif pour usiner une tole plaquee
JP2767970B2 (ja) * 1990-04-04 1998-06-25 松下電器産業株式会社 電子部品の実装装置及び実装方法
JPH0574865A (ja) * 1991-09-11 1993-03-26 Furukawa Electric Co Ltd:The テープキヤリアの製造方法

Also Published As

Publication number Publication date
KR950017689A (ko) 1995-07-20
EP0658080B1 (en) 1999-03-17
KR100327455B1 (ko) 2002-08-14
EP0658080A1 (en) 1995-06-14
JP3548615B2 (ja) 2004-07-28
DE69417168T2 (de) 1999-09-23
US5680699A (en) 1997-10-28
BE1007866A3 (nl) 1995-11-07
JPH07195237A (ja) 1995-08-01
DE69417168D1 (de) 1999-04-22

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