TW267240B - - Google Patents
Info
- Publication number
- TW267240B TW267240B TW082106943A TW82106943A TW267240B TW 267240 B TW267240 B TW 267240B TW 082106943 A TW082106943 A TW 082106943A TW 82106943 A TW82106943 A TW 82106943A TW 267240 B TW267240 B TW 267240B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H10P70/15—
-
- H10P52/00—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
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- H10P72/0416—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US89041592A | 1992-05-29 | 1992-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW267240B true TW267240B (OSRAM) | 1996-01-01 |
Family
ID=25396646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082106943A TW267240B (OSRAM) | 1992-05-29 | 1993-08-27 |
Country Status (4)
| Country | Link |
|---|---|
| EP (2) | EP0702400A3 (OSRAM) |
| JP (1) | JPH0661217A (OSRAM) |
| KR (1) | KR930024112A (OSRAM) |
| TW (1) | TW267240B (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6296714B1 (en) * | 1997-01-16 | 2001-10-02 | Mitsubishi Materials Silicon Corporation | Washing solution of semiconductor substrate and washing method using the same |
| US6482269B1 (en) * | 1997-05-29 | 2002-11-19 | Memc Electronic Materials, Inc. | Process for the removal of copper and other metallic impurities from silicon |
| JP3510562B2 (ja) | 2000-04-28 | 2004-03-29 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置の製造方法及び処理装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61275200A (ja) * | 1985-05-28 | 1986-12-05 | Tokai Carbon Co Ltd | ＳｉＣウイスカ−の精製方法 |
| JPH0719764B2 (ja) * | 1986-07-28 | 1995-03-06 | 大日本スクリ−ン製造株式会社 | 表面洗浄方法 |
| EP0286233B1 (en) * | 1987-03-11 | 1992-01-02 | Omco Co. Ltd. | Water electrolyzing apparatus |
| JP2540583B2 (ja) * | 1988-03-07 | 1996-10-02 | 日本電信電話株式会社 | 基板の清浄化処理方法およびその装置 |
| JPH02102529A (ja) * | 1988-10-12 | 1990-04-16 | Matsushita Electron Corp | マスク洗浄方法 |
| JPH069195B2 (ja) * | 1989-05-06 | 1994-02-02 | 大日本スクリーン製造株式会社 | 基板の表面処理方法 |
| JPH0382029A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | 湿式処理装置 |
| JPH0475339A (ja) * | 1990-07-17 | 1992-03-10 | Seiko Epson Corp | 電界洗浄法 |
| EP0502356A3 (en) * | 1991-02-28 | 1993-03-10 | Texas Instruments Incorporated | Photo-stimulated removal of trace metals |
| EP0567939A3 (en) * | 1992-04-29 | 1993-12-15 | Texas Instruments Inc | Method of removing small particles from a surface |
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1993
- 1993-05-25 EP EP95118166A patent/EP0702400A3/en not_active Withdrawn
- 1993-05-25 EP EP19930108425 patent/EP0571950A3/en not_active Withdrawn
- 1993-05-27 KR KR1019930009303A patent/KR930024112A/ko not_active Ceased
- 1993-05-28 JP JP5127338A patent/JPH0661217A/ja active Pending
- 1993-08-27 TW TW082106943A patent/TW267240B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP0702400A2 (en) | 1996-03-20 |
| KR930024112A (ko) | 1993-12-21 |
| EP0571950A2 (en) | 1993-12-01 |
| EP0571950A3 (en) | 1993-12-15 |
| EP0702400A3 (en) | 1996-05-15 |
| JPH0661217A (ja) | 1994-03-04 |