TW263596B - - Google Patents

Info

Publication number
TW263596B
TW263596B TW082105506A TW82105506A TW263596B TW 263596 B TW263596 B TW 263596B TW 082105506 A TW082105506 A TW 082105506A TW 82105506 A TW82105506 A TW 82105506A TW 263596 B TW263596 B TW 263596B
Authority
TW
Taiwan
Application number
TW082105506A
Other languages
Chinese (zh)
Original Assignee
Mitsui Mining & Smelting Co
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4358607A external-priority patent/JP2509509B2/ja
Application filed by Mitsui Mining & Smelting Co, Sharp Kk filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of TW263596B publication Critical patent/TW263596B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
TW082105506A 1992-12-28 1993-07-10 TW263596B (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4358607A JP2509509B2 (ja) 1992-01-20 1992-12-28 テ―プキャリアおよびこれを用いたテ―プキャリアデバイス

Publications (1)

Publication Number Publication Date
TW263596B true TW263596B (en:Method) 1995-11-21

Family

ID=18460193

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082105506A TW263596B (en:Method) 1992-12-28 1993-07-10

Country Status (3)

Country Link
US (2) US5477080A (en:Method)
KR (1) KR0123187B1 (en:Method)
TW (1) TW263596B (en:Method)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950034696A (ko) * 1994-05-16 1995-12-28 김광호 초박형 반도체 패키지 및 그 제조방법
JP2970491B2 (ja) * 1995-09-20 1999-11-02 ソニー株式会社 半導体パッケージ及びその製造方法
JP3343642B2 (ja) * 1996-04-26 2002-11-11 シャープ株式会社 テープキャリアパッケージ及び液晶表示装置
US6074898A (en) * 1996-09-18 2000-06-13 Sony Corporation Lead frame and integrated circuit package
JPH10173003A (ja) * 1996-12-13 1998-06-26 Sharp Corp 半導体装置とその製造方法およびフィルムキャリアテープとその製造方法
US6580157B2 (en) * 1997-06-10 2003-06-17 Micron Technology, Inc. Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged part
US5780923A (en) * 1997-06-10 1998-07-14 Micron Technology, Inc. Modified bus bar with Kapton™ tape or insulative material on LOC packaged part
TWI229095B (en) 1999-04-22 2005-03-11 Ajinomoto Kk Thermosetting resin composition and flexible-circuit overcoating material comprising the same
JP3750113B2 (ja) * 2002-03-25 2006-03-01 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープ及びその製造方法
JP2007508563A (ja) * 2003-10-15 2007-04-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 装置、システム及び電気素子

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277972B1 (en) * 1988-09-29 1996-11-05 Tomoegawa Paper Co Ltd Adhesive tapes
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
US5227232A (en) * 1991-01-23 1993-07-13 Lim Thiam B Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
JP2982450B2 (ja) * 1991-11-26 1999-11-22 日本電気株式会社 フィルムキャリア半導体装置及びその製造方法
JPH0828396B2 (ja) * 1992-01-31 1996-03-21 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
US5814879A (en) 1998-09-29
KR950005125A (ko) 1995-02-18
US5477080A (en) 1995-12-19
KR0123187B1 (ko) 1997-11-22

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