TW258831B - New capacitor structure for DRAM and process thereof - Google Patents

New capacitor structure for DRAM and process thereof

Info

Publication number
TW258831B
TW258831B TW82110002A TW82110002A TW258831B TW 258831 B TW258831 B TW 258831B TW 82110002 A TW82110002 A TW 82110002A TW 82110002 A TW82110002 A TW 82110002A TW 258831 B TW258831 B TW 258831B
Authority
TW
Taiwan
Prior art keywords
forming
insulator
capacitor structure
layer
conductive layer
Prior art date
Application number
TW82110002A
Other languages
Chinese (zh)
Inventor
Cherng-Hann Hwang
Yeun-Ding Horng
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW82110002A priority Critical patent/TW258831B/en
Application granted granted Critical
Publication of TW258831B publication Critical patent/TW258831B/en

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Abstract

A process of new capacitor structure for DRAM includes the following steps: (1) supplying a Si substrate, forming field oxide layer, transistor structure, and one insulator in sequences on the substrate with each transistor structure all with source/drain electrodes and one gate layer; (2) implementing ion implantation to the insulator surface with mass of ions; (3) opening contact opening on specified source/drain area; (4) forming one first conductive layer and defining needed structure; (5) removing the insulator part with implanted ion by etching; (6) forming one dielectric layer on exposed the first conductive layer adn insulator surface; (7) forming one second conductive layer on the dielectric layer surface to complete capacitor structure.
TW82110002A 1993-11-27 1993-11-27 New capacitor structure for DRAM and process thereof TW258831B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW82110002A TW258831B (en) 1993-11-27 1993-11-27 New capacitor structure for DRAM and process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW82110002A TW258831B (en) 1993-11-27 1993-11-27 New capacitor structure for DRAM and process thereof

Publications (1)

Publication Number Publication Date
TW258831B true TW258831B (en) 1995-10-01

Family

ID=51401797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW82110002A TW258831B (en) 1993-11-27 1993-11-27 New capacitor structure for DRAM and process thereof

Country Status (1)

Country Link
TW (1) TW258831B (en)

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