TW256937B - Method of forming buried contact - Google Patents
Method of forming buried contactInfo
- Publication number
- TW256937B TW256937B TW84103449A TW84103449A TW256937B TW 256937 B TW256937 B TW 256937B TW 84103449 A TW84103449 A TW 84103449A TW 84103449 A TW84103449 A TW 84103449A TW 256937 B TW256937 B TW 256937B
- Authority
- TW
- Taiwan
- Prior art keywords
- buried contact
- conductive layer
- area
- forming
- layer
- Prior art date
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
Abstract
A method of forming buried contact without damage includes: (1) forming an oxide layer on a Si substrate; (2) forming one first conductive layer on the oxide layer; (3) determining the area to be formed as buried contact by photolithography; (4) removing the first conductive layer of the buried contact area located on the oxide layer; (5) implanting ion to the buried contact area bottom to form an ion implant area; (6) removing the oxide layer of the buried contact area located on the Si substrate to form a buried contact; (7) forming one second conductive layer on the buried contact and the first conductive layer; (8) forming one polysilicon layer on the second conductive layer; (9) determining the area to be formed as source/drain electrode by photolithography; (10) removing the polysilicon, the first conductive layer and the second conductive layer located on the source/drain electrode area to form source/drain electrode area.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW84103449A TW256937B (en) | 1995-04-10 | 1995-04-10 | Method of forming buried contact |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW84103449A TW256937B (en) | 1995-04-10 | 1995-04-10 | Method of forming buried contact |
Publications (1)
Publication Number | Publication Date |
---|---|
TW256937B true TW256937B (en) | 1995-09-11 |
Family
ID=51401680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW84103449A TW256937B (en) | 1995-04-10 | 1995-04-10 | Method of forming buried contact |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW256937B (en) |
-
1995
- 1995-04-10 TW TW84103449A patent/TW256937B/en active
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