TW252216B - Process of lightly doped drain transistor component - Google Patents

Process of lightly doped drain transistor component

Info

Publication number
TW252216B
TW252216B TW83110685A TW83110685A TW252216B TW 252216 B TW252216 B TW 252216B TW 83110685 A TW83110685 A TW 83110685A TW 83110685 A TW83110685 A TW 83110685A TW 252216 B TW252216 B TW 252216B
Authority
TW
Taiwan
Prior art keywords
conductive
forming
spacer
conductive layer
lightly doped
Prior art date
Application number
TW83110685A
Other languages
Chinese (zh)
Inventor
Huoo-Tiee Lu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW83110685A priority Critical patent/TW252216B/en
Application granted granted Critical
Publication of TW252216B publication Critical patent/TW252216B/en

Links

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

An improved process of lightly doped drain transistor component includes the following steps: - forming a gate oxide on substrate; - forming a conductive layer on the gate oxide surface, and defining pattern by etching; - with the conductive layer as mask implementing the first ion implantation to from lightly doped source/drain area; - forming a thin oxide on the exposed surface of conductive layer and gate oxide; - forming a conductive spacer on the thin oxide of the conductive sidewall part; - forming a insulating spacer on the sidewall of the conductive spacer; - etching to remove the exposed thin oxide to form the ditch between the conductive layer and the conductive spacer; - forming a conductive stuff to fill the ditch, and the conductive layer, conductive stuff and the conductive spacer commonly constitute a gate electrode; - with the gate electrode and the insulating spacer as mask implementing the second ion implantation to form source/drain area, completing the transistor component.
TW83110685A 1994-11-17 1994-11-17 Process of lightly doped drain transistor component TW252216B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83110685A TW252216B (en) 1994-11-17 1994-11-17 Process of lightly doped drain transistor component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83110685A TW252216B (en) 1994-11-17 1994-11-17 Process of lightly doped drain transistor component

Publications (1)

Publication Number Publication Date
TW252216B true TW252216B (en) 1995-07-21

Family

ID=51401442

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83110685A TW252216B (en) 1994-11-17 1994-11-17 Process of lightly doped drain transistor component

Country Status (1)

Country Link
TW (1) TW252216B (en)

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