TW245835B - - Google Patents
Info
- Publication number
- TW245835B TW245835B TW081104313A TW81104313A TW245835B TW 245835 B TW245835 B TW 245835B TW 081104313 A TW081104313 A TW 081104313A TW 81104313 A TW81104313 A TW 81104313A TW 245835 B TW245835 B TW 245835B
- Authority
- TW
- Taiwan
Links
Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/211—Design considerations for internal polarisation
- H10D89/213—Design considerations for internal polarisation in field-effect devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910010194A KR930001392A (ko) | 1991-06-19 | 1991-06-19 | 반도체 메모리 장치의 전원 접지선 배선방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW245835B true TW245835B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1995-04-21 |
Family
ID=19316015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW081104313A TW245835B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-06-19 | 1992-06-02 |
Country Status (7)
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100249166B1 (ko) * | 1997-03-07 | 2000-03-15 | 김영환 | 이에스디(esd) 보호회로 및 그 제조방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5780828A (en) * | 1980-11-07 | 1982-05-20 | Hitachi Ltd | Semiconductor integrated circuit device |
JPS5922357A (ja) * | 1982-07-28 | 1984-02-04 | Toshiba Corp | Cmos形半導体集積回路 |
JPH0693497B2 (ja) * | 1986-07-30 | 1994-11-16 | 日本電気株式会社 | 相補型mis集積回路 |
GB2199695B (en) * | 1987-01-06 | 1990-07-25 | Samsung Semiconductor Inc | Dynamic random access memory with selective well biasing |
EP0283046B1 (en) * | 1987-03-18 | 1996-06-12 | Nec Corporation | Complementary integrated circuit device equipped with latch-up preventing means |
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1991
- 1991-06-19 KR KR1019910010194A patent/KR930001392A/ko not_active Abandoned
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1992
- 1992-06-02 TW TW081104313A patent/TW245835B/zh active
- 1992-06-12 IT ITMI921460A patent/IT1258990B/it active IP Right Grant
- 1992-06-17 FR FR9207335A patent/FR2678109B1/fr not_active Expired - Fee Related
- 1992-06-17 GB GB9212830A patent/GB2256968A/en not_active Withdrawn
- 1992-06-17 DE DE4219927A patent/DE4219927A1/de not_active Ceased
- 1992-06-19 JP JP4161159A patent/JPH0719851B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ITMI921460A0 (it) | 1992-06-12 |
JPH06112435A (ja) | 1994-04-22 |
DE4219927A1 (de) | 1992-12-24 |
IT1258990B (it) | 1996-03-11 |
JPH0719851B2 (ja) | 1995-03-06 |
GB2256968A (en) | 1992-12-23 |
GB9212830D0 (en) | 1992-07-29 |
FR2678109B1 (fr) | 1994-01-21 |
KR930001392A (ko) | 1993-01-16 |
FR2678109A1 (fr) | 1992-12-24 |
ITMI921460A1 (it) | 1993-12-12 |