TW241381B - - Google Patents
Info
- Publication number
- TW241381B TW241381B TW083104241A TW83104241A TW241381B TW 241381 B TW241381 B TW 241381B TW 083104241 A TW083104241 A TW 083104241A TW 83104241 A TW83104241 A TW 83104241A TW 241381 B TW241381 B TW 241381B
- Authority
- TW
- Taiwan
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66356—Gated diodes, e.g. field controlled diodes [FCD], static induction thyristors [SITh], field controlled thyristors [FCTh]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66196—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices with an active layer made of a group 13/15 material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8616—Charge trapping diodes
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14712893 | 1993-05-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW241381B true TW241381B (zh) | 1995-02-21 |
Family
ID=15423194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083104241A TW241381B (zh) | 1993-05-12 | 1994-05-11 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5485017A (zh) |
EP (1) | EP0631326B1 (zh) |
KR (1) | KR0157662B1 (zh) |
DE (1) | DE69416619T2 (zh) |
TW (1) | TW241381B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0744777B1 (en) * | 1995-05-25 | 2000-08-30 | Matsushita Electric Industrial Co., Ltd. | Nonlinear element and bistable memory device |
JP3397516B2 (ja) * | 1995-06-08 | 2003-04-14 | 三菱電機株式会社 | 半導体記憶装置及び半導体集積回路装置 |
EP0843360A1 (en) * | 1996-11-15 | 1998-05-20 | Hitachi Europe Limited | Memory device |
JP3853905B2 (ja) * | 1997-03-18 | 2006-12-06 | 株式会社東芝 | 量子効果装置とblトンネル素子を用いた装置 |
US6421682B1 (en) | 1999-07-26 | 2002-07-16 | Microsoft Corporation | Catalog management system architecture having data table objects and logic table objects |
EP2346071B1 (en) * | 2008-10-29 | 2017-04-05 | Fujitsu Limited | Compound semiconductor device and method for manufacturing the same |
US10103226B2 (en) * | 2012-04-30 | 2018-10-16 | International Business Machines Corporation | Method of fabricating tunnel transistors with abrupt junctions |
US9508854B2 (en) | 2013-12-06 | 2016-11-29 | Ecole Polytechnique Federale De Lausanne (Epfl) | Single field effect transistor capacitor-less memory device and method of operating the same |
DE102016015475B3 (de) * | 2016-12-28 | 2018-01-11 | 3-5 Power Electronics GmbH | IGBT Halbleiterstruktur |
KR20180129457A (ko) * | 2017-05-26 | 2018-12-05 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3972059A (en) * | 1973-12-28 | 1976-07-27 | International Business Machines Corporation | Dielectric diode, fabrication thereof, and charge store memory therewith |
JPS5591166A (en) * | 1978-12-28 | 1980-07-10 | Nippon Gakki Seizo Kk | Semiconductor memory |
JPS56124273A (en) * | 1980-03-04 | 1981-09-29 | Semiconductor Res Found | Semiconductor device |
JPS5940576A (ja) * | 1982-08-30 | 1984-03-06 | Junichi Nishizawa | フオトサイリスタ |
JPS60254777A (ja) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | 半導体装置 |
JPS61158184A (ja) * | 1984-12-29 | 1986-07-17 | Fujitsu Ltd | 半導体装置 |
US5216262A (en) * | 1992-03-02 | 1993-06-01 | Raphael Tsu | Quantum well structures useful for semiconductor devices |
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1994
- 1994-05-10 EP EP94107261A patent/EP0631326B1/en not_active Expired - Lifetime
- 1994-05-10 DE DE69416619T patent/DE69416619T2/de not_active Expired - Fee Related
- 1994-05-11 US US08/241,447 patent/US5485017A/en not_active Expired - Lifetime
- 1994-05-11 TW TW083104241A patent/TW241381B/zh active
- 1994-05-12 KR KR1019940010400A patent/KR0157662B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0631326A3 (en) | 1995-05-31 |
DE69416619D1 (de) | 1999-04-01 |
US5485017A (en) | 1996-01-16 |
KR0157662B1 (ko) | 1998-10-15 |
EP0631326A2 (en) | 1994-12-28 |
DE69416619T2 (de) | 1999-09-30 |
EP0631326B1 (en) | 1999-02-24 |
KR940027148A (ko) | 1994-12-10 |