TW232090B - - Google Patents

Info

Publication number
TW232090B
TW232090B TW083101868A TW83101868A TW232090B TW 232090 B TW232090 B TW 232090B TW 083101868 A TW083101868 A TW 083101868A TW 83101868 A TW83101868 A TW 83101868A TW 232090 B TW232090 B TW 232090B
Authority
TW
Taiwan
Application number
TW083101868A
Other languages
Chinese (zh)
Inventor
Rista Markovich Voya
Abedin Molla Jaynal
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW232090B publication Critical patent/TW232090B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • H10P74/23—
    • H10W72/0711—
    • H10W72/07236—
    • H10W72/252—
    • H10W72/29—
    • H10W72/934—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW083101868A 1993-03-01 1994-03-03 TW232090B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2454993A 1993-03-01 1993-03-01

Publications (1)

Publication Number Publication Date
TW232090B true TW232090B (OSRAM) 1994-10-11

Family

ID=21821176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083101868A TW232090B (OSRAM) 1993-03-01 1994-03-03

Country Status (6)

Country Link
US (1) US6414509B1 (OSRAM)
EP (1) EP0614089A3 (OSRAM)
JP (1) JP2528619B2 (OSRAM)
KR (1) KR0130736B1 (OSRAM)
CA (1) CA2110472C (OSRAM)
TW (1) TW232090B (OSRAM)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US7200930B2 (en) 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
WO1996015459A1 (en) * 1994-11-15 1996-05-23 Formfactor, Inc. Mounting spring elements on semiconductor devices, and wafer-level testing methodology
DE69530103T2 (de) * 1994-11-15 2003-12-11 Formfactor, Inc. Verbindungselemente für mikroelektronische komponenten
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US6142789A (en) * 1997-09-22 2000-11-07 Silicon Graphics, Inc. Demateable, compliant, area array interconnect
US7898275B1 (en) * 1997-10-03 2011-03-01 Texas Instruments Incorporated Known good die using existing process infrastructure
JP3553791B2 (ja) 1998-04-03 2004-08-11 株式会社ルネサステクノロジ 接続装置およびその製造方法、検査装置並びに半導体素子の製造方法
DE10127351A1 (de) * 2001-06-06 2002-12-19 Infineon Technologies Ag Elektronischer Chip und elektronische Chip-Anordnung
US6764869B2 (en) * 2001-09-12 2004-07-20 Formfactor, Inc. Method of assembling and testing an electronics module
US6747472B2 (en) * 2002-01-18 2004-06-08 International Business Machines Corporation Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
US6836134B2 (en) * 2002-06-11 2004-12-28 Delphi Technologies, Inc. Apparatus and method for determining leakage current between a first semiconductor region and a second semiconductor region to be formed therein
CN101523550B (zh) * 2006-09-12 2011-06-15 皇家飞利浦电子股份有限公司 包括嵌入在灯的石英玻璃封壳中的导体的灯
US8262768B2 (en) 2007-09-17 2012-09-11 Barrick Gold Corporation Method to improve recovery of gold from double refractory gold ores
EA020884B1 (ru) 2007-09-18 2015-02-27 Баррик Гольд Корпорейшн Способ восстановления золота из тугоплавких сульфидных руд
US8262770B2 (en) 2007-09-18 2012-09-11 Barrick Gold Corporation Process for controlling acid in sulfide pressure oxidation processes
US9104568B2 (en) 2013-03-15 2015-08-11 International Business Machines Corporation Detection of memory cells that are stuck in a physical state
CN113990793A (zh) * 2021-10-21 2022-01-28 东莞市中麒光电技术有限公司 一种led芯片转移方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4189825A (en) * 1975-06-04 1980-02-26 Raytheon Company Integrated test and assembly device
US4328286A (en) 1979-04-26 1982-05-04 The International Nickel Co., Inc. Electrodeposited palladium, method of preparation and electrical contact made thereby
JPS57110690A (en) 1980-12-24 1982-07-09 Ibm Growing of tentrite by electroplating
US4716124A (en) 1984-06-04 1987-12-29 General Electric Company Tape automated manufacture of power semiconductor devices
US4820976A (en) 1987-11-24 1989-04-11 Advanced Micro Devices, Inc. Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts
DE68913823T2 (de) * 1988-06-21 1994-09-22 Ibm Lösbare elektrische Verbindung.
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
US5007163A (en) * 1990-04-18 1991-04-16 International Business Machines Corporation Non-destructure method of performing electrical burn-in testing of semiconductor chips
US5118299A (en) * 1990-05-07 1992-06-02 International Business Machines Corporation Cone electrical contact
GB2247565B (en) * 1990-08-22 1994-07-06 Gen Electric Co Plc A method of testing a semiconductor device
US5088190A (en) * 1990-08-30 1992-02-18 Texas Instruments Incorporated Method of forming an apparatus for burn in testing of integrated circuit chip
US5237269A (en) * 1991-03-27 1993-08-17 International Business Machines Corporation Connections between circuit chips and a temporary carrier for use in burn-in tests
US5420520A (en) * 1993-06-11 1995-05-30 International Business Machines Corporation Method and apparatus for testing of integrated circuit chips
US5523696A (en) * 1993-06-14 1996-06-04 International Business Machines Corp. Method and apparatus for testing integrated circuit chips
US5659256A (en) * 1993-06-11 1997-08-19 International Business Machines Corporation Method and apparatus for testing integrated circuit chips
US5494856A (en) * 1994-10-18 1996-02-27 International Business Machines Corporation Apparatus and method for creating detachable solder connections
US6037786A (en) * 1996-12-13 2000-03-14 International Business Machines Corporation Testing integrated circuit chips

Also Published As

Publication number Publication date
JPH06252226A (ja) 1994-09-09
EP0614089A3 (en) 1995-07-12
EP0614089A2 (en) 1994-09-07
US6414509B1 (en) 2002-07-02
CA2110472C (en) 1999-08-10
KR940022769A (ko) 1994-10-21
JP2528619B2 (ja) 1996-08-28
CA2110472A1 (en) 1994-09-02
KR0130736B1 (ko) 1998-04-06

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