JPS57110690A - Growing of tentrite by electroplating - Google Patents

Growing of tentrite by electroplating

Info

Publication number
JPS57110690A
JPS57110690A JP56146424A JP14642481A JPS57110690A JP S57110690 A JPS57110690 A JP S57110690A JP 56146424 A JP56146424 A JP 56146424A JP 14642481 A JP14642481 A JP 14642481A JP S57110690 A JPS57110690 A JP S57110690A
Authority
JP
Japan
Prior art keywords
tentrite
electroplating
growing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56146424A
Other languages
Japanese (ja)
Inventor
Jiyosefu Aamusutorong Edowaado
Maikeru Saasen Jiyosefu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS57110690A publication Critical patent/JPS57110690A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
JP56146424A 1980-12-24 1981-09-18 Growing of tentrite by electroplating Pending JPS57110690A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21966080A 1980-12-24 1980-12-24

Publications (1)

Publication Number Publication Date
JPS57110690A true JPS57110690A (en) 1982-07-09

Family

ID=22820192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56146424A Pending JPS57110690A (en) 1980-12-24 1981-09-18 Growing of tentrite by electroplating

Country Status (3)

Country Link
EP (1) EP0054695B1 (en)
JP (1) JPS57110690A (en)
DE (1) DE3172253D1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
US5185073A (en) * 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
CA2110472C (en) 1993-03-01 1999-08-10 Anilkumar Chinuprasad Bhatt Method and apparatus for in-situ testing of integrated circuit chips
AU3765097A (en) * 1997-08-08 1999-03-01 Vladimir Dvorak Method of electrodeposition of metallic layers and equipment for implementing this method
DE102005011298A1 (en) * 2005-03-04 2006-09-07 Gebr. Schmid Gmbh & Co. Apparatus and method for etching substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2854387A (en) * 1955-11-21 1958-09-30 Philco Corp Method of jet plating
DE2504780A1 (en) * 1975-02-05 1976-08-19 Siemens Ag METHOD AND DEVICE FOR SPRAY GALVANIZATION
FR2381567A1 (en) * 1977-02-24 1978-09-22 Fmc Corp Jet electrolysis appts., esp. for mfg. printed circuit boards - where profiled electrolyte streams are sprayed onto board
IT1112620B (en) * 1977-04-15 1986-01-20 Ibm PERFECTED ELECTRIC CONNECTOR

Also Published As

Publication number Publication date
EP0054695B1 (en) 1985-09-11
EP0054695A1 (en) 1982-06-30
DE3172253D1 (en) 1985-10-17

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