IT1112620B - PERFECTED ELECTRIC CONNECTOR - Google Patents
PERFECTED ELECTRIC CONNECTORInfo
- Publication number
- IT1112620B IT1112620B IT22260/78A IT2226078A IT1112620B IT 1112620 B IT1112620 B IT 1112620B IT 22260/78 A IT22260/78 A IT 22260/78A IT 2226078 A IT2226078 A IT 2226078A IT 1112620 B IT1112620 B IT 1112620B
- Authority
- IT
- Italy
- Prior art keywords
- electric connector
- perfected electric
- perfected
- connector
- electric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
- H01L2224/13018—Shape in side view comprising protrusions or indentations
- H01L2224/13019—Shape in side view comprising protrusions or indentations at the bonding interface of the bump connector, i.e. on the surface of the bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/28—Contacts for sliding cooperation with identically-shaped contact, e.g. for hermaphroditic coupling devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78780477A | 1977-04-15 | 1977-04-15 | |
US87399978A | 1978-01-31 | 1978-01-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7822260A0 IT7822260A0 (en) | 1978-04-13 |
IT1112620B true IT1112620B (en) | 1986-01-20 |
Family
ID=27120690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT22260/78A IT1112620B (en) | 1977-04-15 | 1978-04-13 | PERFECTED ELECTRIC CONNECTOR |
Country Status (3)
Country | Link |
---|---|
CA (1) | CA1121011A (en) |
DE (1) | DE2816328C3 (en) |
IT (1) | IT1112620B (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3061659D1 (en) * | 1979-04-06 | 1983-02-24 | Ibm | Method of making prints provided with masks |
DE2936816A1 (en) * | 1979-08-17 | 1981-03-26 | BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau | High current silicon semiconductor cooling system - has wires soldered to metallised islands on surface of silicon disc, extending outwards |
JPS57110690A (en) * | 1980-12-24 | 1982-07-09 | Ibm | Growing of tentrite by electroplating |
DE68913823T2 (en) * | 1988-06-21 | 1994-09-22 | Ibm | Detachable electrical connection. |
US5185073A (en) * | 1988-06-21 | 1993-02-09 | International Business Machines Corporation | Method of fabricating nendritic materials |
US5137461A (en) * | 1988-06-21 | 1992-08-11 | International Business Machines Corporation | Separable electrical connection technology |
US4937653A (en) * | 1988-07-21 | 1990-06-26 | American Telephone And Telegraph Company | Semiconductor integrated circuit chip-to-chip interconnection scheme |
US5118299A (en) * | 1990-05-07 | 1992-06-02 | International Business Machines Corporation | Cone electrical contact |
US5298685A (en) * | 1990-10-30 | 1994-03-29 | International Business Machines Corporation | Interconnection method and structure for organic circuit boards |
US5099393A (en) * | 1991-03-25 | 1992-03-24 | International Business Machines Corporation | Electronic package for high density applications |
US5220725A (en) * | 1991-04-09 | 1993-06-22 | Northeastern University | Micro-emitter-based low-contact-force interconnection device |
US5660570A (en) * | 1991-04-09 | 1997-08-26 | Northeastern University | Micro emitter based low contact force interconnection device |
US5248262A (en) * | 1992-06-19 | 1993-09-28 | International Business Machines Corporation | High density connector |
US5237743A (en) * | 1992-06-19 | 1993-08-24 | International Business Machines Corporation | Method of forming a conductive end portion on a flexible circuit member |
US5297967A (en) * | 1992-10-13 | 1994-03-29 | International Business Machines Corporation | Electrical interconnector with helical contacting portion and assembly using same |
US5281150A (en) * | 1993-01-05 | 1994-01-25 | International Business Machines Corporation | Method and apparatus for connecting cable to the surface of printed circuit boards or the like |
US5397240A (en) * | 1993-10-26 | 1995-03-14 | International Business Machines Corporation | Electrical connector |
US5399101A (en) * | 1993-12-16 | 1995-03-21 | International Business Machines Corporation | Electrical connector with preloaded contact |
TW381328B (en) * | 1994-03-07 | 2000-02-01 | Ibm | Dual substrate package assembly for being electrically coupled to a conducting member |
US5632631A (en) * | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5889568A (en) | 1995-12-12 | 1999-03-30 | Rainbow Displays Inc. | Tiled flat panel displays |
FR2757682B1 (en) * | 1996-12-20 | 1999-03-12 | Thomson Tubes Electroniques | METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS |
US6331119B1 (en) | 1999-12-28 | 2001-12-18 | International Business Machines Corporation | Conductive adhesive having a palladium matrix interface between two metal surfaces |
DE102006031322A1 (en) * | 2006-07-06 | 2007-09-27 | Siemens Ag | Electromechanical component for use in car seat, has rigid carrier board and flexible carrier foil with respective sections that overlap with each other, and nano-wires providing electrical and mechanical connections between board and foil |
DE102007047162B4 (en) * | 2007-05-25 | 2011-12-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for producing a microstructure or nanostructure and microstructured or nanostructured substrate |
DE102009059304B4 (en) * | 2009-12-23 | 2014-07-03 | CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH | Silicon chip with a cable attached to it and procedures for attaching the cable |
DE102017122865B3 (en) * | 2017-10-02 | 2019-03-14 | Infineon Technologies Ag | A method of forming a metallic interconnect, method of making a semiconductor interconnect having a metallic interconnect, and a semiconductor interconnect semiconductor device array |
-
1978
- 1978-04-13 IT IT22260/78A patent/IT1112620B/en active
- 1978-04-14 DE DE2816328A patent/DE2816328C3/en not_active Expired
- 1978-04-17 CA CA000301230A patent/CA1121011A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2816328B2 (en) | 1980-03-20 |
DE2816328C3 (en) | 1980-11-20 |
CA1121011A (en) | 1982-03-30 |
IT7822260A0 (en) | 1978-04-13 |
DE2816328A1 (en) | 1978-10-19 |
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