FR2757682B1 - METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS - Google Patents

METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS

Info

Publication number
FR2757682B1
FR2757682B1 FR9615747A FR9615747A FR2757682B1 FR 2757682 B1 FR2757682 B1 FR 2757682B1 FR 9615747 A FR9615747 A FR 9615747A FR 9615747 A FR9615747 A FR 9615747A FR 2757682 B1 FR2757682 B1 FR 2757682B1
Authority
FR
France
Prior art keywords
conductors
semiconductor component
substrate provided
substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9615747A
Other languages
French (fr)
Other versions
FR2757682A1 (en
Inventor
Serge Salavin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Electron Devices SA
Original Assignee
Thomson Tubes Electroniques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Tubes Electroniques filed Critical Thomson Tubes Electroniques
Priority to FR9615747A priority Critical patent/FR2757682B1/en
Priority to PCT/FR1997/002317 priority patent/WO1998028791A1/en
Publication of FR2757682A1 publication Critical patent/FR2757682A1/en
Application granted granted Critical
Publication of FR2757682B1 publication Critical patent/FR2757682B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
FR9615747A 1996-12-20 1996-12-20 METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS Expired - Fee Related FR2757682B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9615747A FR2757682B1 (en) 1996-12-20 1996-12-20 METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS
PCT/FR1997/002317 WO1998028791A1 (en) 1996-12-20 1997-12-16 Method and device for connecting a semiconductor component on a substrate provided with conductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9615747A FR2757682B1 (en) 1996-12-20 1996-12-20 METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS

Publications (2)

Publication Number Publication Date
FR2757682A1 FR2757682A1 (en) 1998-06-26
FR2757682B1 true FR2757682B1 (en) 1999-03-12

Family

ID=9498924

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9615747A Expired - Fee Related FR2757682B1 (en) 1996-12-20 1996-12-20 METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS

Country Status (2)

Country Link
FR (1) FR2757682B1 (en)
WO (1) WO1998028791A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6810304B1 (en) * 1997-09-26 2004-10-26 Gilbarco Inc. Multistage ordering system for a fueling and retail environment
DE10245398B3 (en) * 2002-09-28 2004-06-03 Mühlbauer Ag Device and method for applying semiconductor chips to carriers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1112620B (en) * 1977-04-15 1986-01-20 Ibm PERFECTED ELECTRIC CONNECTOR
JPS59210654A (en) * 1983-05-16 1984-11-29 Toshiba Corp Semiconductor device and manufacture thereof
JPS61198769A (en) * 1985-02-28 1986-09-03 Nec Corp Hybrid integrated circuit
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
US5345365A (en) * 1992-05-05 1994-09-06 Massachusetts Institute Of Technology Interconnection system for high performance electronic hybrids
US5517752A (en) * 1992-05-13 1996-05-21 Fujitsu Limited Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
US5313368A (en) * 1993-02-02 1994-05-17 The Whitaker Corporation Electrical connections between printed circuit boards and integrated circuits surface mounted thereon
NL9400508A (en) * 1994-03-30 1995-11-01 Hans Peter Peloschek Method for mounting electronic components by solder bumper and applications and products thereof.

Also Published As

Publication number Publication date
WO1998028791A1 (en) 1998-07-02
FR2757682A1 (en) 1998-06-26

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Legal Events

Date Code Title Description
ST Notification of lapse