TW231366B - - Google Patents

Info

Publication number
TW231366B
TW231366B TW083100477A TW83100477A TW231366B TW 231366 B TW231366 B TW 231366B TW 083100477 A TW083100477 A TW 083100477A TW 83100477 A TW83100477 A TW 83100477A TW 231366 B TW231366 B TW 231366B
Authority
TW
Taiwan
Application number
TW083100477A
Other languages
Chinese (zh)
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21713775&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW231366(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Eaton Corp filed Critical Eaton Corp
Application granted granted Critical
Publication of TW231366B publication Critical patent/TW231366B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
TW083100477A 1993-01-15 1994-01-20 TW231366B (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/005,030 US5436790A (en) 1993-01-15 1993-01-15 Wafer sensing and clamping monitor

Publications (1)

Publication Number Publication Date
TW231366B true TW231366B (en:Method) 1994-10-01

Family

ID=21713775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083100477A TW231366B (en:Method) 1993-01-15 1994-01-20

Country Status (7)

Country Link
US (1) US5436790A (en:Method)
EP (1) EP0607043B1 (en:Method)
JP (1) JP3341221B2 (en:Method)
KR (1) KR100284663B1 (en:Method)
CA (1) CA2113290C (en:Method)
DE (1) DE69400113T2 (en:Method)
TW (1) TW231366B (en:Method)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
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US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
KR960012283A (ko) * 1994-09-30 1996-04-20 가네꼬 히사시 정전척 및 그 제조방법
DE69530801T2 (de) * 1994-10-17 2004-03-11 Varian Semiconductor Equipment Associates Inc., Gloucester Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US5670066A (en) * 1995-03-17 1997-09-23 Lam Research Corporation Vacuum plasma processing wherein workpiece position is detected prior to chuck being activated
US5754391A (en) * 1996-05-17 1998-05-19 Saphikon Inc. Electrostatic chuck
US6298737B1 (en) * 1996-05-29 2001-10-09 Integrated Device Technology, Inc. Ceramic ring undersize detection device
US5952060A (en) * 1996-06-14 1999-09-14 Applied Materials, Inc. Use of carbon-based films in extending the lifetime of substrate processing system components
US5812362A (en) * 1996-06-14 1998-09-22 Applied Materials, Inc. Method and apparatus for the use of diamond films as dielectric coatings on electrostatic chucks
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
JP3245369B2 (ja) * 1996-11-20 2002-01-15 東京エレクトロン株式会社 被処理体を静電チャックから離脱する方法及びプラズマ処理装置
US5886864A (en) * 1996-12-02 1999-03-23 Applied Materials, Inc. Substrate support member for uniform heating of a substrate
TW325148U (en) * 1997-01-23 1998-01-11 Taiwan Semiconductor Mfg Co Ltd Temperature processing device
GB9711273D0 (en) * 1997-06-03 1997-07-30 Trikon Equip Ltd Electrostatic chucks
US6075375A (en) 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
US6205870B1 (en) 1997-10-10 2001-03-27 Applied Komatsu Technology, Inc. Automated substrate processing systems and methods
US5901030A (en) * 1997-12-02 1999-05-04 Dorsey Gage, Inc. Electrostatic chuck employing thermoelectric cooling
US5872694A (en) * 1997-12-23 1999-02-16 Siemens Aktiengesellschaft Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage
US5948986A (en) * 1997-12-26 1999-09-07 Applied Materials, Inc. Monitoring of wafer presence and position in semiconductor processing operations
US5886865A (en) * 1998-03-17 1999-03-23 Applied Materials, Inc. Method and apparatus for predicting failure of an eletrostatic chuck
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
TW432580B (en) * 1998-09-29 2001-05-01 Applied Materials Inc Piezoelectric method and apparatus for semiconductor wafer detection
US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6454332B1 (en) 1998-12-04 2002-09-24 Applied Materials, Inc. Apparatus and methods for handling a substrate
US6215640B1 (en) 1998-12-10 2001-04-10 Applied Materials, Inc. Apparatus and method for actively controlling surface potential of an electrostatic chuck
US6430022B2 (en) * 1999-04-19 2002-08-06 Applied Materials, Inc. Method and apparatus for controlling chucking force in an electrostatic
US6248642B1 (en) 1999-06-24 2001-06-19 Ibis Technology Corporation SIMOX using controlled water vapor for oxygen implants
US6433342B1 (en) 1999-08-18 2002-08-13 Ibis Technology Corporation Coated wafer holding pin
US6452195B1 (en) 1999-08-18 2002-09-17 Ibis Technology Corporation Wafer holding pin
US6155436A (en) * 1999-08-18 2000-12-05 Ibis Technology Corporation Arc inhibiting wafer holder assembly
US6423975B1 (en) 1999-08-18 2002-07-23 Ibis Technology, Inc. Wafer holder for simox processing
US6257001B1 (en) * 1999-08-24 2001-07-10 Lucent Technologies, Inc. Cryogenic vacuum pump temperature sensor
ATE491825T1 (de) * 1999-09-29 2011-01-15 Tokyo Electron Ltd Mehrzonenwiderstandsheizung
US6740853B1 (en) * 1999-09-29 2004-05-25 Tokyo Electron Limited Multi-zone resistance heater
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6307728B1 (en) * 2000-01-21 2001-10-23 Applied Materials, Inc. Method and apparatus for dechucking a workpiece from an electrostatic chuck
JP4615670B2 (ja) * 2000-04-19 2011-01-19 アプライド マテリアルズ インコーポレイテッド 静電チャックにおけるチャッキング力を制御する方法及び装置
KR100344221B1 (ko) * 2000-09-22 2002-07-20 삼성전자 주식회사 웨이퍼 클램프 텐션 측정 장치
US6403322B1 (en) * 2001-03-27 2002-06-11 Lam Research Corporation Acoustic detection of dechucking and apparatus therefor
WO2002101377A1 (en) * 2001-06-07 2002-12-19 Tokyo Electron Limited Apparatus and method for determining clamping status of semiconductor wafer
US6998353B2 (en) * 2001-11-05 2006-02-14 Ibis Technology Corporation Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers
US6710360B2 (en) 2002-07-10 2004-03-23 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6774373B2 (en) * 2002-07-29 2004-08-10 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6900444B2 (en) * 2002-07-29 2005-05-31 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US20040079289A1 (en) * 2002-10-23 2004-04-29 Kellerman Peter L. Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging
US6740894B1 (en) 2003-02-21 2004-05-25 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter utilizing a linear scan motor
US20040187787A1 (en) * 2003-03-31 2004-09-30 Dawson Keith E. Substrate support having temperature controlled substrate support surface
US6828572B2 (en) * 2003-04-01 2004-12-07 Axcelis Technologies, Inc. Ion beam incident angle detector for ion implant systems
US6794664B1 (en) 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6987272B2 (en) * 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US7030395B2 (en) * 2004-08-06 2006-04-18 Axcelis Technologies, Inc. Workpiece support structure for an ion beam implanter featuring spherical sliding seal vacuum feedthrough
US7982195B2 (en) * 2004-09-14 2011-07-19 Axcelis Technologies, Inc. Controlled dose ion implantation
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US7629597B2 (en) * 2006-08-18 2009-12-08 Axcelis Technologies, Inc. Deposition reduction system for an ion implanter
US7993465B2 (en) * 2006-09-07 2011-08-09 Applied Materials, Inc. Electrostatic chuck cleaning during semiconductor substrate processing
US7986146B2 (en) * 2006-11-29 2011-07-26 Globalfoundries Inc. Method and system for detecting existence of an undesirable particle during semiconductor fabrication
US20090181475A1 (en) * 2008-01-11 2009-07-16 Novellus Systems, Inc. Detecting the presence of a workpiece relative to a carrier head
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
US8169769B2 (en) * 2008-09-11 2012-05-01 Tel Epion Inc. Electrostatic chuck power supply
US7948734B2 (en) * 2008-09-11 2011-05-24 Tel Epion Inc. Electrostatic chuck power supply
US8514544B2 (en) * 2009-08-07 2013-08-20 Trek, Inc. Electrostatic clamp optimizer
JP6151028B2 (ja) * 2013-01-17 2017-06-21 株式会社日立ハイテクノロジーズ 荷電粒子線装置
JP6066084B2 (ja) * 2013-12-11 2017-01-25 日新イオン機器株式会社 基板保持装置、半導体製造装置及び基板吸着判別方法
US9543110B2 (en) 2013-12-20 2017-01-10 Axcelis Technologies, Inc. Reduced trace metals contamination ion source for an ion implantation system
MY174723A (en) 2014-02-07 2020-05-10 Trek Inc System and method for clamping a work piece
US20150357151A1 (en) 2014-06-10 2015-12-10 Axcelis Technologies, Inc. Ion implantation source with textured interior surfaces
JP6942936B2 (ja) * 2017-08-25 2021-09-29 株式会社アルバック 真空装置、吸着電源
JP7419288B2 (ja) * 2021-03-30 2024-01-22 キヤノントッキ株式会社 制御装置、成膜装置、制御方法、及び電子デバイスの製造方法
CN113984788B (zh) * 2021-12-24 2022-03-15 北京凯世通半导体有限公司 一种通过光学检测仪器对超低温离子注入设备监测的方法
US12435964B2 (en) 2023-11-16 2025-10-07 Tokyo Electron Limited Contactless capacitive measurement tool with improved throughput and accuracy
CN119008501B (zh) * 2024-10-21 2025-02-14 天津吉兆源科技有限公司 静电卡盘电源及控制方法

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US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
US5173834A (en) * 1989-06-02 1992-12-22 Roland Dg Corporation Electrostatic attraction apparatus
DE69104128T2 (de) * 1990-06-08 1995-01-19 Varian Associates Spannen eines Werkstücks.
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
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Also Published As

Publication number Publication date
EP0607043B1 (en) 1996-03-27
JPH077073A (ja) 1995-01-10
DE69400113D1 (de) 1996-05-02
US5436790A (en) 1995-07-25
EP0607043A1 (en) 1994-07-20
KR940018947A (ko) 1994-08-19
DE69400113T2 (de) 1996-10-24
JP3341221B2 (ja) 2002-11-05
CA2113290A1 (en) 1994-07-16
KR100284663B1 (ko) 2001-04-02
CA2113290C (en) 1999-11-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees